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BAS101; BAS101S
High-voltage switching diodes
Rev. 01 — 8 September 2006
Product data sheet
1. Product profile
1.1 General description
High-voltage switching diodes, encapsulated in a SOT23 small Surface-Mounted Device
(SMD) plastic package.
Table 1. Product overview
Type number
Package
Philips
BAS101
SOT23
BAS101S
SOT23
JEITA
-
-
Configuration
single
dual series
1.2 Features
I High switching speed: trr ≤ 50 ns
I Low leakage current
I Repetitive peak reverse voltage:
VRRM ≤ 300 V
I Low capacitance: Cd ≤ 2 pF
I Reverse voltage: VR ≤ 300 V
I Small SMD plastic package
1.3 Applications
I High-speed switching
I High-voltage switching
I Voltage clamping
I Reverse polarity protection
1.4 Quick reference data
Table 2. Quick reference data
Symbol Parameter
Per diode
IF forward current
IR reverse current
VR reverse voltage
trr reverse recovery time
Conditions
Min Typ
VR = 250 V
-
-
-
[1] -
-
-
-
-
[1] When switched from IF = 30 mA to IR = 30 mA; RL = 100 Ω; measured at IR = 3 mA.
Max
200
150
300
50
Unit
mA
nA
V
ns
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Philips Semiconductors
BAS101; BAS101S
High-voltage switching diodes
7. Characteristics
Table 8. Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Per diode
VF forward voltage
IF = 100 mA
IR reverse current
VR = 250 V
VR = 250 V; Tj = 150 °C
Cd diode capacitance
VR = 0 V; f = 1 MHz
trr reverse recovery time
Min Typ
[1] -
-
-
-
[2] -
-
-
-
-
-
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
[2] When switched from IF = 30 mA to IR = 30 mA; RL = 100 Ω; measured at IR = 3 mA.
Max
1.1
150
100
2
50
Unit
V
nA
µA
pF
ns
BAS101_BAS101S_1
Product data sheet
DataSheet4 U .com
Rev. 01 — 8 September 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
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Philips Semiconductors
11. Soldering
BAS101; BAS101S
High-voltage switching diodes
2.90
2.50
0.85
2
1
3.00 1.30
0.85
3
2.70
0.60
(3x)
1.00
3.30
0.50 (3x)
0.60 (3x)
MSA439
Dimensions in mm
Fig 7. Reflow soldering footprint SOT23 (TO-236AB)
3.40
1.20 (2x)
4.60 4.00 1.20
21
3
solder lands
solder resist
occupied area
solder paste
solder lands
solder resist
occupied area
preferred transport direction during soldering
2.80
4.50
MSA427
Dimensions in mm
Fig 8. Wave soldering footprint SOT23 (TO-236AB)
BAS101_BAS101S_1
Product data sheet
DataSheet4 U .com
Rev. 01 — 8 September 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
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