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PDF MPXV7002 Data sheet ( Hoja de datos )
| Número de pieza | MPXV7002 | |
| Descripción | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned | |
| Fabricantes | Freescale Semiconductor | |
| Logotipo |  |
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1. MPXV7002  Hay una vista previa y un enlace de descarga de MPXV7002 (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
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Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MPXV7002
Rev 3, 01/2015
MPXV7002 Integrated Silicon
Pressure Sensor On-Chip Signal
Conditioned, Temperature
Compensated and Calibrated
The MPXV7002 series piezoresistive transducers are state-of-the-art monolithic
silicon pressure sensors designed for a wide range of applications, but
particularly those employing a microcontroller or microprocessor with A/D
inputs. This transducer combines advanced micromachining techniques, thin-
film metallization, and bipolar processing to provide an accurate, high level
analog output signal that is proportional to the applied pressure.
Features
• 2.5% Typical Error over +10C to +60C with Auto Zero
• 6.25% Maximum Error over +10C to +60C without Auto Zero
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Thermoplastic (PPS) Surface Mount Package
• Temperature Compensated over +10 to +60C
• Patented Silicon Shear Stress Strain Gauge
• Available in Differential and Gauge Configurations
MPXV7002
-2 to +2 kPa (-0.3 to +0.3 psi)
0.5 to 4.5 V Output
MPXV7002GC6U/C6T1
CASE 482A
MPXV7002GP
CASE 1369
MPXV7002DP
CASE 1351
Small Outline Package
Top view
N/C 5
N/C 6
N/C 7
N/C 8
4 VOUT
3 GND
2 VS
1 N/C
Pinout
(Style 2, case number 98ASA99255D)
Device Name
Package
Options
Case
No.
Small Outline Package (MPXV7002 Series)
MPXV7002GC6U
Rails
482A
MPXV7002GC6T1
Tape & Reel
482A
MPXV7002GP
Trays
1369
MPXV7002DP
Trays
1351
ORDERING INFORMATION
# of Ports
Pressure Type
None Single Dual Gauge Differential Absolute
Device
Marking
••
••
••
•
•
MPXV7002G
MPXV7002G
MPXV7002G
MPXV7002DP
© 2005, 2009, 2015 Freescale Semiconductor, Inc. All rights reserved.
1 page  
5.0
Transfer Function:
Vout = VS (0.2 P(kPa)+0.5) ± 6.25% VFSS
4.0 VS = 5.0 Vdc
TA = 10 to 60°C
3.0
MAX
2.0
1.0
MIN
TYPICAL
0 -2 -1 0 1
Differential Pressure (kPa)
Figure 4. Output versus Pressure Differential
2
4 Pressure (P1)/Vacuum (P2) Side Identification Table
Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure
(P1) side is the side containing a gel die coat which protects the die from harsh media.
The Pressure (P1) side may be identified by using the following table:
Part Number
MPXV7002GC6U/GC6T1
MPXV7002GP
MPXV7002DP
Case Type
482A-01
1369-01
1351-01
Pressure (P1)
Side Identifier
Side with Port Attached
Side with Port Attached
Side with Part Marking
5 Minimum Recommended Footprint for Surface Mounted Applications
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the
packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask
layer to avoid bridging and shorting between solder pads.
0.660
16.76
0.100 TYP 8X
2.54
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm SCALE 2:1
Figure 5. Small Outline Package Footprint
Sensors
Freescale Semiconductor, Inc.
MPXV7002
5
5 Page 
7 Revision History
Table 1. Revision History
Revision Revision
number
date
Description of changes
• Updated data sheet format.
3 01/2015 • Added Pinout.
• Updated package outline for 98ASA99303D.
Sensors
Freescale Semiconductor, Inc.
MPXV7002
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet MPXV7002.PDF ] | |
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