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PDF S72NS512P Data sheet ( Hoja de datos )
| Número de pieza | S72NS512P | |
| Descripción | MirrorBit Flash Memory and DRAM | |
| Fabricantes | SPANSION | |
| Logotipo |  |
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S72NS-P Based MCPs/PoPs
MirrorBit™ Flash Memory and DRAM
128/256/512 Mb (8/16/32 M x 16 bit), 1.8 Volt-only,
Multiplexed Simultaneous Read/Write, Burst Mode Flash
Memory
S72NS-P Based MCPs/PoPs Cover Sheet
128/256 Mb (8/16 M x 16 bit) DDR DRAM on Split Bus
Data Sheet (Advance Information)
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
Publication Number S72NS-P_00
Revision 01
Issue Date September 6, 2006
1 page  
Data Sheet (Advance Information)
2. Product Block Diagram
F-RST#
F-ACC
F-WP#
F-CE#
F-OE#
F-WE#
AVD#
F-VSS
F2-CE#
RST#
ACC
WP#
CE#
OE#
WE#
AVD#
VSS
MUX
Flash
Memory
NS-P
A15-A0
DQ15-DQ0
CLK
RDY
Amax - A16
VCC
VCCQ
D-RAS#
D-CAS#
D-BA0
D-BA1
D-CKE
D-WE#
D-CE#
D-Amax - D-A0
D-VCC
D-VCCQ
RAS#
CAS#
BA0
BA1
CKE
WE#
CE#
VCC
VCCQ
DDR
DRAM
Memory
CLK
CLK#
DQS0
DQS1
LDQM
UDQM
TEST
DQ15-DQ0
VSS
VSSQ
Notes:
1. Amax indicates highest address bit for memory component:
a. Amax = A24 for NS512P, A23 for NS256P, A22 for NS128P
b. Amax = A11 for 128 Mb DDR DRAM
c. Amax = A12 for 256Mb DDR DRAM
2. For Flash, A15 - A0 is tied to DQ15 - DQ0.
ADQ15-ADQ0
F-CLK
F-RDY
Amax - A16
F-VCC
F-VCCQ
D-CLK
D-CLK#
D-LDQS
D-UDQS
D-LDQM
D-UDQM
D-TEST
D-DQ15 - D-DQ0
D-VSS
D-VSSQ
S72NS-P_00_01 September 6, 2006
S72NS-P Based MCPs/PoPs
3
5 Page 
Data Sheet (Advance Information)
6.2 NSC133—133-ball Fine-Pitch Ball Grid Array (FBGA) 8.0 x 8.0 mm
PACKAGE
JEDEC
NSC 133
N/A
DxE
SYMBOL
A
A1
A2
D
E
D1
E1
MD
ME
n
Øb
eE
eD
SD / SE
8.00 mm x 8.00 mm
PACKAGE
NOTE
MIN NOM MAX
0.90 1.00 1.10 PROFILE
0.20 0.25 0.30 BALL HEIGHT
0.70 0.76 0.82 BODY THICKNESS
8.00 BSC
BODY SIZE
8.00 BSC
BODY SIZE
6.50 BSC.
MATRIX FOOTPRINT
6.50 BSC.
MATRIX FOOTPRINT
14 MATRIX SIZE D DIRECTION
14 MATRIX SIZE E DIRECTION
133 BALL COUNT
0.25 0.30 0.35 BALL DIAMETER
0.50 BSC.
BALL PITCH
0.50 BSC
BALL PITCH
0.25 BSC.
SOLDER BALL PLACEMENT
D5-D11,E4-E11,F4-F11,G4-G11 DEPOPULATED SOLDER BALLS
H4-H11,J4-J11,K4-K11,L4-L11
NOTES:
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1
SPP-010.
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3583 \ 16-039.22 \ 8.15.06
S72NS-P_00_01 September 6, 2006
S72NS-P Based MCPs/PoPs
9
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet S72NS512P.PDF ] | |
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