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S75PL-N 데이터시트 PDF




SPANSION에서 제조한 전자 부품 S75PL-N은 전자 산업 및 응용 분야에서
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부품번호 S75PL-N 기능
기능 Stacked Multi-Chip Product
제조업체 SPANSION
로고 SPANSION 로고


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S75PL-N 데이터시트, 핀배열, 회로
www.DataSheet4U.com
S75PL-N MirrorBitORNANDMCPs
Stacked Multi-Chip Product (MCP)
S29PL-N: CMOS 3.0 Volt-only Simultaneous Read/Write,
Page-mode Flash Memory (NOR Interface)
S30ML-P: ORNAND Flash (NAND Interface)
3V pSRAM
S75PL-N MirrorBitORNANDMCPs Cover Sheet
Data Sheet (Advance Information)
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
Publication Number S75PL-N_00
Revision 01E
Issue Date April 21, 2006




S75PL-N pdf, 반도체, 판매, 대치품
Data Sheet (Advance Information)
1. Ordering Information
The ordering part number is formed by a valid combination of the following:
S75PL
127 N B F JF W GZ 0
PACKING TYPE
0 = Tray
2 = 7” Tape and Reel
3 = 13” Tape and Reel
MODEL NUMBER
Refer to the Valid Combinations table below
TEMPERATURE RANGE
W = Wireless (–25°C to +85°C)
PACKAGE TYPE AND MATERIAL
JA = MCP BGA, 1.4 mm height, 0.8 mm pitch, Lead (Pb)-free Compliant package
JF = MCP BGA, 1.4 mm height, 0.8 mm pitch, Lead (Pb)-free package
ORNAND DATA DENSITY
F = S30ML512P
G = S30ML01GP
pSRAM DENSITY
B = 32 Mb pSRAM
C = 64 Mb pSRAM
D = 128 Mb pSRAM
PROCESS TECHNOLOGY
N = 110 nm MirrorBit™ Technology
FLASH DENSITY
256 = 256 Mb
127 = 128 Mb (Single CE#)
DEVICE FAMILY
S75PL = 3.0 Volt-only Simultaneous Read/Write, Page Mode Flash Memory with Data storage
ORNAND and pSRAM
2
S75PL-N MirrorBitORNANDMCPs
S75PL-N_00_01E April 21, 2006

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S75PL-N 전자부품, 판매, 대치품
Data Sheet (Advance Information)
3.2
FMH107—107-Ball Fine Pitch Ball Grid Array (FBGA) 9 x 12 mm package
0.15 C
(2X)
D
PIN A1
CORNER
INDEX MARK
9
TOP VIEW
A A2
A1
6
107X b
SIDE VIEW
0.15 M C A B
0.08 M C
Figure 3.2 FMH107
A
eD
D1
10
9
8
7
E
6
5
4
eE 3
2
1
B
0.15 C
(2X)
0.20 C
SE 7
E1
ML K J HG F E D C B A
7
SD
PIN A1
CORNER
BOTTOM VIEW
C 0.08 C
PACKAGE
JEDEC
FMH 107
N/A
DxE
SYMBOL
A
A1
A2
D
E
D1
E1
MD
ME
n
Øb
eE
eD
SD / SE
12.00 mm x 9.00 mm
PACKAGE
MIN NOM MAX
--- --- 1.40
0.17 ---
---
0.94 --- 1.11
12.00 BSC.
9.00 BSC.
8.80 BSC.
7.20 BSC.
12
10
107
0.35 0.40 0.45
0.80 BSC.
0.80 BSC.
0.40 BSC.
A3,A4,A5,A6,A7,A8,
B1,M3,M4,M5,M6,M7,M8
NOTE
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTES:
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JEP95, SECTION
4.3, SPP-010.
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E"
DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL
POSITIONS FOR MATRIX SIZE MD X ME.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO
DATUMS A AND B AND DEFINE THE POSITION OF THE
CENTER SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS
IN THE OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS
IN THE OUTER ROW, SD OR SE = e/2
8. "+" INDICATES THE THEORETICAL CENTER OF
DEPOPULATED BALLS.
9. A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER
OR INK MARK, METALLIZED MARK INDENTATION OR
OTHER MEANS.
3512 \ 16-038.19 \ 8.9.05
S75PL-N_00_01E April 21, 2006
S75PL-N MirrorBitORNANDMCPs
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부품번호상세설명 및 기능제조사
S75PL-N

Stacked Multi-Chip Product

SPANSION
SPANSION

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