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부품번호 | EMIF04-VID01C1 기능 |
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기능 | 4 LINES LOW CAPACITANCE EMI FILTER AND ESD PROTECTION | ||
제조업체 | ST Microelectronics | ||
로고 | |||
www.DataSheet4U.com
®
IPAD™
EMIF04-VID01C1
4 LINES LOW CAPACITANCE EMI FILTER
AND ESD PROTECTION
MAIN APPLICATION
Where EMI filtering in ESD sensitive equipment is
required:
■ LCD and camera for mobile phones
■ Computers and printers
■ Communication systems
■ MCU board
DESCRIPTION
The EMIF04-VID01C1 is a 4 lines highly integrat-
ed array designed to suppress EMI / RFI noise in
all systems subjected to electromagnetic interfer-
ences.
The EMIF04-VID01C1 Flip-Chip packaging
means the package size is equal to the die size.
Additionally, this filter includes an ESD protection
circuitry which prevents the protected device from
destruction when subjected to ESD surges up to
15 kV.
BENEFITS
■ High efficiency EMI filtering (-40db @ 900MHz)
■ Low line capacitance suitable for high speed
data bus
■ Low serial resistance for camera impedance
adaptation
■ Optimized PCB space consuming:
1.92mm x 1.29mm
■ Very thin package: 0.69 mm
■ High efficiency in ESD suppression on inputs
pins (IEC61000-4-2 level 4)
■ High reliability offered by monolithic integration
■ High reducing of parasitic elements through
integration & wafer level packaging
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2
Level 4 on input pins 15kV (air discharge)
8kV (contact discharge)
MIL STD 883E - Method 3015-6 Class 3
®
Coated Flip-Chip
(10 Bumps)
Table 1: Order Code
Part Number
EMIF04-VID01C1
Marking
GU
Figure 1: Pin Configuration (ball side)
654
32 1
I4 I3 I2 I1 A
Gnd
Gnd
B
O4 O3 O2 O1 C
Figure 2: Configuration
Input
R
Output
R = 100Ω
CLINE = 16pF typ. @ 3V
TM: IPAD is a trademark of STMicroelectronics.
February 2005
REV. 1
1/6
EMIF04-VID01C1
Figure 8: Ordering Information Scheme
EMIF yy - xxx zz Cx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
C = Coated Flip-Chip
x = 1: 500µm, Bump = 315µm
= 2: Leadfree Pitch = 500µm, Bump = 315µm
Figure 9: FLIP-CHIP Package Mechanical Data
500µm ± 50
250µm ± 50
315µm ± 50
690µm ± 65
1.92mm ± 50µm
Figure 10: Foot Print Recommendations
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 300µm copper pad diameter
Figure 11: Marking
Dot, ST logo
365 240
xx = marking
z = packaging location
yww = date code
(y = year
ww = week)
xxz
y ww
All dimensions in µm
4/6
4페이지 | |||
구 성 | 총 6 페이지수 | ||
다운로드 | [ EMIF04-VID01C1.PDF 데이터시트 ] |
당사 플랫폼은 키워드, 제품 이름 또는 부품 번호를 사용하여 검색할 수 있는 |
구매 문의 | 일반 IC 문의 : 샘플 및 소량 구매 ----------------------------------------------------------------------- IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한 광범위한 전력 반도체를 판매합니다. 전력 반도체 전문업체 상호 : 아이지 인터내셔날 사이트 방문 : [ 홈페이지 ] [ 블로그 1 ] [ 블로그 2 ] |
부품번호 | 상세설명 및 기능 | 제조사 |
EMIF04-VID01C1 | 4 LINES LOW CAPACITANCE EMI FILTER AND ESD PROTECTION | ST Microelectronics |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |