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EMIF04-10006F2 데이터시트 PDF




ST Microelectronics에서 제조한 전자 부품 EMIF04-10006F2은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

PDF 형식의 EMIF04-10006F2 자료 제공

부품번호 EMIF04-10006F2 기능
기능 4 LINES EMI ILTER AND ESD PROTECTION
제조업체 ST Microelectronics
로고 ST Microelectronics 로고


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EMIF04-10006F2 데이터시트, 핀배열, 회로
www.DataSheet4U.com
®
IPAD™
EMIF04-10006F2
4 LINES EMI FILTER
AND ESD PROTECTION
MAIN PRODUCT CHARACTERISTICS
Where EMI filtering in ESD sensitive equipment is
required:
Mobile phones and communication systems
Computers, printers and MCU Boards
DESCRIPTION
The EMIF04-10006F2 is a highly integrated
devices designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic
interferences. The EMIF04 flip-chip packaging
means the package size is equal to the die size.
This filter includes an ESD protection circuitry
which prevents the device from destruction when
subjected to ESD surges up 15kV. This device
includes four EMIF filters and 4 separated ESD
diodes.
BENEFITS
EMI symmetrical (I/O) low-pass filter
High efficiency in EMI filtering
Lead free package
Very low PCB space consuming:
2.92mm x 1.29mm
Very thin package: 0.65 mm
High efficiency in ESD suppression
(IEC61000-4-2 level 4)
High reliability offered by monolithic integration
High reducing of parasitic elements through
integration and wafer level packaging.
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC 61000-4-2 level 4:
15kV (air discharge)
8kV (contact discharge)
MIL STD 883E - Method 3015-6 Class 3: 30kV
®
Flip-Chip
(15 Bumps)
Table 1: Order Code
Part Number
EMIF04-10006F2
Marking
FS
Figure 1: Pin Configuration (ball side)
987
654
32 1
D3 I4 I3 I2 I1 D1 A
Gnd
Gnd
Gnd
B
D4 O4 O3 O2 O1 D2 C
TM: IPAD is a trademark of STMicroelectronics.
September 2004
REV. 1
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EMIF04-10006F2 pdf, 반도체, 판매, 대치품
EMIF04-10006F2
Figure 9: Aplac model
Rbump Lbump
Ii*
Rs=100
Lbump Rbump
Oi*
Cbump
Rsub
Cz=41pF@0V
Cz=41pF@0V
Rsub
Cbump
Oi * = Output of each filter cell
Ii* = Input of each filter cell
sub
sub
Rsub
Rbump
Lbump
Rbump Lbump
Dj *
Lbump Rbump
Di*
Cbump
Rsub
Cz=41pF@0V
Cz=41pF@0V
Rsub
Cbump
Cgnd Lgnd
Rgnd
With Dj* = D1 & D3
And Di* = D2 & D4
sub
EMIF04-10006F2 model
Ground return for each GND bump
Figure 10: Aplac parameters
aplacvar RS
aplacvar Cz
aplacvar Lbump
aplacvar Rbump
aplacvar Cbump
aplacvar Rsub
aplacvar Rgnd
aplacvar Lgnd
aplacvar Cgnd
100
41 pF
50 pH
20 m
1.2 pF
100 m
100 m
100 pH
0.15 pF
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EMIF04-10006F2 전자부품, 판매, 대치품
EMIF04-10006F2
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2004 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
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