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PDF NUF2015W1 Data sheet ( Hoja de datos )
| Número de pieza | NUF2015W1 | |
| Descripción | USB Upstream Terminator | |
| Fabricantes | ON Semiconductor | |
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NUF2015W1
USB Upstream Terminator
with ESD Protection
This device is designed for applications requiring Line
Termination, EMI Filtering and ESD Protection. It is intended for
use in upstream USB ports, Cellular phones, Wireless equipment and
computer applications. This device offers an integrated solution in a
small package (SC−88/SOT−363) reducing PCB space and cost.
Features:
• Provides USB Line Termination, Filtering and ESD Protection
• Single IC Offers Cost Savings
• Bidirectional EMI Filtering Prevents Noise from Entering/Leaving
the System
• Compliance with IEC61000−4−2 (Level 4)
8 kV (Contact)
15 kV (Air)
• Flexible Pullup Line Termination to Meet USB 1.1 Low Speed
and High Speed Specification
• ESD Ratings: Machine Model = C
ESD Ratings: Human Body Model = 3B
• Pb−Free Package is Available
Benefits:
• SC−88 Package Minimizes PCB Space
• Integrated Circuit Increases System Reliability versus Discrete
Component Implementation
• TVS Devices Provide ESD Protection That is Better than a Discrete
Implementation because the Small IC minimizes Parasitic
Inductances
Applications:
• USB Hubs
• Computer Peripherals Using USB
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Value
Unit
Steady State Power
Maximum Junction Temperature
Operating Temperature Range
Storage Temperature Range
Lead Solder Temperature
(10 second duration)
PD
TJ(max)
TJ
Tstg
TL
225
125
−55 to +125
−55 to +125
260
mW
°C
°C
°C
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
CIRCUIT DESCRIPTION
D1(c)
6
VBUS
5
D2(c)
4
Rup
Rs C1
C1 Rs
1
D1(i)
2
GND
3
D2(i)
54
6
123
MARKING
DIAGRAM
654
SC−88 / SOT−363
CASE 419B
PLASTIC
5W M G
G
123
5W = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
RS
(W)
Pkg.
Shipping†
NUF2015W1T2 15 SC−88 3000/Tape & Reel
NUF2015W1T2G 15 SC−88 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 3
1
Publication Order Number:
NUF2015W1/D
1 page  
NUF2015W1
PACKAGE DIMENSIONS
D
e
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE W
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
654
HE −E−
123
b 6 PL
0.2 (0.008) M E M
MILLIMETERS
INCHES
DIM MIN NOM MAX MIN NOM MAX
A 0.80 0.95 1.10 0.031 0.037 0.043
A1 0.00 0.05 0.10 0.000 0.002 0.004
A3 0.20 REF
0.008 REF
b 0.10 0.21 0.30 0.004 0.008 0.012
C 0.10 0.14 0.25 0.004 0.005 0.010
D 1.80 2.00 2.20 0.070 0.078 0.086
E 1.15 1.25 1.35 0.045 0.049 0.053
e 0.65 BSC
0.026 BSC
L 0.10 0.20 0.30 0.004 0.008 0.012
HE 2.00 2.10 2.20 0.078 0.082 0.086
A3
C
A
A1 L
SOLDERING FOOTPRINT*
0.50
0.0197
0.40
0.0157
0.65
0.025
0.65
0.025
1.9
0.0748
ǒ ǓSCALE 20:1
mm
inches
SC−88/SC70−6/SOT−363
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet NUF2015W1.PDF ] | |
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