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NUF2222FC 데이터시트 PDF




ON Semiconductor에서 제조한 전자 부품 NUF2222FC은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

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부품번호 NUF2222FC 기능
기능 2 Line USB 1.1 Upstream EMI Filter
제조업체 ON Semiconductor
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NUF2222FC 데이터시트, 핀배열, 회로
www.DataSheet4U.com
NUF2222FC
2 Line USB 1.1 Upstream
EMI Filter
This device is a 2 line EMI filter array for USB port protection in
wireless applications. Greater than −20 dB attenuation is obtained at
frequencies from 900 MHz to 3.0 GHz. It also has 2 lines for dedicated
ESD protection. ESD protection is provided across all capacitors.
Features
EMI Filtering and ESD Protection
Integration of 10 Discretes
Provides Protection for IEC61000−4−2 (Level 4)
15 kV (Contact)
Flip−Chip Package
Moisture Sensitivity Level 1
ESD Rating: Machine Model = C; Human Body Model = 3B
Benefits
Reduces EMI/RFI Emissions on a Data Line
Integrated Solution Offers Cost and Space Savings
Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
Filter Response
Integrated Solution Improves System Reliability
This is a Pb−Free Device
Applications
EMI Filtering and ESD Protection for Data Lines
Cell Phones
Handheld Products
Notebook Computers
MP3 Players
http://onsemi.com
A3
A1 1.3 K
33 R
C1
B2
C3
D2
(Gnd Pin)
33 R
E1 E3
1
Flip−Chip
FC SUFFIX
CASE 499AM
MARKING
DIAGRAM
1
2222AYWW
2222
A
Y
WW
= Specific Device Code
= Assembly Location
= Year
= Work Week
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Symbol Value
Unit
ESD Discharge
IEC61000−4−2
Contact Discharge
VPP
15 kV
Operating Temperature Range
TOP −40 to +85 °C
Storage Temperature Range
TSTG −55 to +150 °C
Junction Temperature
TJ
+125
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
PIN CONFIGURATION
3 21
A
B
C
D
E
ORDERING INFORMATION
Device
Package
Shipping
NUF2222FCT1G Flip−Chip 3000 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2005
June, 2005 − Rev. 0
1
Publication Order Number:
NUF2222FC/D




NUF2222FC pdf, 반도체, 판매, 대치품
NUF2222FC
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PCB Pad Size
Parameter
Pad Shape
Pad Type
Solder Mask Opening
Solder Stencil Thickness
Stencil Aperture
Solder Flux Ratio
Solder Paste Type
Trace Finish
Trace Width
Copper
500 mm Pitch
300 or 350 mm Solder Ball
250 mm +25
−0
Round
NSMD
350 mm "25
125 mm
250 x 250 mm sq.
50/50
No Clean Type 3 or Finer
OSP Cu
150 mm Max
Solder mask
280
270
260
250
240
230
TL= 217
210
200
190
180
170
160
150
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
NSMD
SMD
Figure 6. NSMD vs. SMD
Tp = (15−30 sec)
RAMP−UP
Tp = 260°C − 5°C
tL
(60−90 sec)
RAMP−DOWN
PRE−HEAT
ZONE
TIME (seconds)
Figure 7. Typical Pb−Free Solder Heating Profile
http://onsemi.com
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관련 데이터시트

부품번호상세설명 및 기능제조사
NUF2222FC

2 Line USB 1.1 Upstream EMI Filter

ON Semiconductor
ON Semiconductor

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