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PDF NUF3101FC Data sheet ( Hoja de datos )
| Número de pieza | NUF3101FC | |
| Descripción | Three Line EMI Filter | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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NUF3101FC
Three Line EMI Filter
This device is a three−line EMI filter array for SIM Card wireless
applications. Greater than −25 dB attenuation is obtained at
frequencies from 800 MHz to 2.2 GHz. ESD protection is provided
across all capacitors.
Features
• EMI Filtering and ESD Protection
• Integration of 10 Discretes
• Provides Protection for IEC61000−4−2 (Level 4)
♦ 8.0 kV (Contact)
♦ 15 kV (Air)
• Flip−Chip Package
• Moisture Sensitivity Level 1
• ESD Rating: Machine Model = C; Human Body Model = 3B
• Pb−Free Package is Available*
Benefits
• Reduces EMI/RFI Emissions on a Data Line
• Integrated Solution Offers Cost and Space Savings
• Reduces Parasitic Inductances Which Offer a More “Ideal”
Low Pass Filter Response
• Integrated Solution Improves System Reliability
Applications
• SIM Card
• EMI Filtering and ESD Protection for Data Lines
• Cell Phones
• Handheld Products
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
ESD Discharge
IEC61000−4−2
Air Discharge
Contact Discharge
VPP
15 kV
8.0
Steady−State Power per Resistor
Steady−State Power per Package
Operating Temperature Range
Storage Temperature Range
Junction Temperature
PR
PT
TOP
TSTG
TJ
100 mW
300 mW
−40 to +85 °C
−55 to +150 °C
+125
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 2
1
C2
A3
B3
C3
http://onsemi.com
100 R
47 R
100 R
A2
B1
C1
A2
8−Pin Flip−Chip
FC SUFFIX
CASE 499AG
B2
GND
MARKING
DIAGRAM
1
3101
AYWW G
G
3101
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONFIGURATION
A3 A2
B3 B2 B1
C3 C2 C1
ORDERING INFORMATION
Device
Package
Shipping†
NUF3101FCT1 Flip−Chip 3000 Tape & Reel
NUF3101FCT1G Flip−Chip 3000 Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NUF3101FC/D
1 page | ||
| Páginas | Total 4 Páginas | |
| PDF Descargar | [ Datasheet NUF3101FC.PDF ] | |
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