|
|
|
부품번호 | NUF4105FC 기능 |
|
|
기능 | 4 Channel EMI Pi-Filter Array | ||
제조업체 | ON Semiconductor | ||
로고 | |||
전체 6 페이지수
www.DataSheet4U.com
NUF4105FC
4 Channel EMI Pi−Filter
Array with ESD Protection
+4 ESD Diodes
This device is a 4 channel EMI filter array for data lines. Greater
than −40 dB attenuation is obtained at frequencies from 800 MHz to
2.2 GHz. It also offers ESD protection − clamping transients from
static discharges to protect delicate data line circuitry. It is offered in
300 mm and 350 mm solder spheres.
Features
• EMI Filtering and ESD Protection for Data Lines
• Integration of 26 Discretes Offers Cost and Space Savings
• Exceeds IEC61000−4−2 (Level 4) Specifications
• Low Profile Flip−Chip Packaging
• MSL 1
• 300 mm Solder Spheres (NUF4105), Case 499D
Typical Applications
• EMI Filtering and ESD Protection for Data Lines
• Cell Phones
• Handheld Portables
• Notebook Computers
• MP3 Players
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Value
Unit
ESD Discharge IEC61000−4−2,
− Air Discharge
− Contact Discharge
Human Body Model
VPP
kV
30
30
16
DC Power per Resistor
PR 100 mW
DC Power per Package
PT 400 mW
Junction Temperature
TJ 150 °C
Operating Temperature Range
Top
−40 to +85
°C
Storage Temperature Range
Tstg
−55 to +150
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
http://onsemi.com
A1
D1
A2
D3
A3
D5
A4
D7
A5
D9
CIRCUIT DESCRIPTION
C1 C2
D2
C1
R2
C3 C4
R3
C5 C6
C2
D4
B1
C3
D6
R4
C7 C8
R5
C9 C10
C4
D8
B2
C5
D10
A6
D11
C11 C12
C6
D12
B3
A1 FLIP−CHIP
CASE 499D
300 mm Bumps
DEVICE MARKING
ON
NUF4105YYWW
YY = Year
WW = Work Week
ORDERING INFORMATION
Device
Package
Shipping†
NUF4105FCT1 Flip−Chip 3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2004
November, 2004 − Rev. 1
1
Publication Order Number:
NUF4105FC/D
NUF4105FC
Printed Circuit Board Recommendations
PCB Pad Size
Parameter
Pad Shape
Pad Type
Solder Mask Opening
Solder Stencil Thickness
Stencil Aperture
Solder Flux Ratio
Solder Paste Type
Trace Finish
Trace Width
500 mm Pitch
300 or 350 mm Solder Ball
250 mm +25
250 mm −0
Round
NSMD
350 mm ±25
125 mm
250 x 250 mm sq.
50/50
No Clean Type 3 or Finer
OSP Cu
150 mm Max
Copper
Solder Mask
NSMD
SMD
Figure 6. Solder Mask versus Non−Solder Mask Definition
Controlled Atmosphere
250
225°C Min
235°C Max
200
183 °C
2 to 5 °C/s
150
140 to 160 °C
100
50
0 1 to 5 °C/s
01 2 3 4
1 to 2 min 30−100 sec
TIME (minutes)
Figure 7. Solder Reflow Profile
5
http://onsemi.com
4
4페이지 | |||
구 성 | 총 6 페이지수 | ||
다운로드 | [ NUF4105FC.PDF 데이터시트 ] |
당사 플랫폼은 키워드, 제품 이름 또는 부품 번호를 사용하여 검색할 수 있는 |
구매 문의 | 일반 IC 문의 : 샘플 및 소량 구매 ----------------------------------------------------------------------- IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한 광범위한 전력 반도체를 판매합니다. 전력 반도체 전문업체 상호 : 아이지 인터내셔날 사이트 방문 : [ 홈페이지 ] [ 블로그 1 ] [ 블로그 2 ] |
부품번호 | 상세설명 및 기능 | 제조사 |
NUF4105FC | 4 Channel EMI Pi-Filter Array | ON Semiconductor |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |