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PDF NUF4107FC Data sheet ( Hoja de datos )
| Número de pieza | NUF4107FC | |
| Descripción | 4 Channel EMI Pi-Filter Array | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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NUF4107FC
Four Channel EMI Pi−Filter
Array with Full USB Filter
This device is a four−channel EMI filter array for data lines. Greater
than −35 dB attenuation is obtained at frequencies from 800 MHz to
2.2 GHz. It also offers USB filtering circuitry with speed detection.
This includes the inline resistors for impedance matching and EMI
filtering. ESD protection is provided across all capacitors.
Features
• EMI Filtering and ESD Protection for Data Lines
• USB 1.1 Filtering Provided with Speed Detection
• Integration of 27 Discretes Offers Cost and Space Savings
• 350 mm Solder Spheres
• All TVS Protected Inputs Comply with IEC61000−4−2 (Level 4)
30 kV (Contact)
30 kV (Air)
• Low Profile Flip−Chip Packaging
• MSL 1
• All Pins Exceed 2000 V Human Body Model (Note 1)
• Pb−Free Package is Available*
Typical Applications
• EMI and USB Filtering and ESD Protection for Data Lines
• Cell Phones
• Handheld Portables
• Notebook Computers
• MP3 Players
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Value
Unit
ESD Discharge IEC61000−4−2 (Note 1)
− Air Discharge, Contact Discharge
Human Body Model
Machine Model
VPP
kV
30
16
0.4
DC Power per Resistor
DC Power per Package
Junction Temperature
Operating Temperature Range
Storage Temperature Range
PR 100 mW
PT 600 mW
TJ 150 °C
Top −40 to +85 °C
Tstg −55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. This does not include Pins B1, C1 and C2
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 3
1
http://onsemi.com
CIRCUIT DESCRIPTION
A1
D1
R1
C1
C1
R7
A2
D2
R2
C2
B1
C2
D11
A3
D3
A4
D5
A5
D7
A6
D9
B2 R3
C3 C4
B3 R4
C5 C6
B4 R5
C7 C8
B5 R6
C9 C10
C3
D4
C4
D6
C5
D8
C6
D10
FLIP−CHIP−17
CASE 499AD
A1
MARKING DIAGRAM
ÈÈ4107AYWW G
4107
A
Y
= Device Code
= Assembly Location
= Year
G WW = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NUF4107FCT1
Flip−Chip 3000 Tape & Reel
NUF4107FCT1G Flip−Chip 3000 Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NUF4107FC/D
1 page  
4X
0.10 C
TERMINAL A1
LOCATOR
ÈÈÈÈ
D
NUF4107FC
PACKAGE DIMENSIONS
FLIP−CHIP−17 CSP
CASE 499AD−01
ISSUE A
AB
E
0.10 C
TOP VIEW
A1
A2 A C
0.05 C
SIDE VIEW
SEATING
PLANE
D1
e /2
e
C
17 X b
B
0.05 C A B A
0.03 C
1
2345
BOTTOM VIEW
E1
e1
6
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A −−− 0.740
A1 0.250 0.310
A2 0.380 0.430
D 2.960 BSC
E 1.330 BSC
b 0.350 0.410
e 0.500 BSC
e1 0.435 BSC
D1 2.500 BSC
E1 0.870 BSC
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer
purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
http://onsemi.com
5
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
NUF4107FC/D
5 Page | ||
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