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PDF MCZ33290 Data sheet ( Hoja de datos )
| Número de pieza | MCZ33290 | |
| Descripción | ISO K Line Serial Link Interface | |
| Fabricantes | Freescale Semiconductor | |
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Freescale Semiconductor
Technical Data
Document Number: MC33290
Rev. 7.0, 10/2006
ISO K Line Serial Link Interface
The 33290 is a serial link bus interface device designed to provide
bi-directional half-duplex communication interfacing in automotive
diagnostic applications. It is designed to interface between the
vehicle’s on-board microcontroller and systems off-board the vehicle
via the special ISO K line. The 33290 is designed to meet the
Diagnostic Systems ISO9141 specification. The device’s K line bus
driver’s output is fully protected against bus shorts and
overtemperature conditions.
33290
CAN PHYSICAL INTERFACE
The 33290 derives its robustness to temperature and voltage
extremes by being built on a SMARTMOS process, incorporating
CMOS logic, bipolar/MOS analog circuitry, and DMOS power FETs.
Although the 33290 was principally designed for automotive
applications, it is suited for other serial communication applications.
It is parametrically specified over an ambient temperature range of
-40ºC ≤ TA ≤ 125ºC and 8.0 V ≤ VBB ≤ 18 V supply. The economical
SO-8 surface-mount plastic package makes the 33290 very cost
effective.
D SUFFIX
EF SUFFIX (PB-FREE)
98ASB42564B
8-PIN SOICN
Features
• Operates Over Wide Supply Voltage of 8.0 to 18 V
• Operating Temperature of -40 to 125°C
• Interfaces Directly to Standard CMOS Microprocessors
• ISO K Line Pin Protected Against Shorts to Ground
ORDERING INFORMATION
Device
MC33290D/R2
MCZ33290EF/R2
Temperature
Range (TA)
-40 to 125°C
Package
8-SOICN
• Thermal Shutdown with Hysteresis
• ISO K Line Pin Capable of High Currents
• ISO K Line Can Be Driven with up to 10 nF of Parasitic
Capacitance
• 8.0 kV ESD Protection Attainable with Few Additional Components
• Standby Mode: No VBat Current Drain with VDD at 5.0 V
• Low Current Drain During Operation with VDD at 5.0 V
• Pb-Free Packaging Designated by Suffix Code EF
+VBAT
VDD
VDD
MCU
Dx
SCIRx D
SCITx D
33290
VDD VBB
CEN ISO
RX
TX
GND
ISO K-Line
TxD
RxD
Figure 1. 33290 Simplified Application Diagram
Freescale Semiconductor, Inc. reserves the right to change the detail specifications, as
may be required, to permit improvements in the design of its products.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
1 page  
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics
Characteristics noted under conditions of 4.75 V ≤ VDD ≤ 5.25 V, 8.0 V ≤ VBB ≤ 18 V, -40°C ≤ TC ≤ 125°C, unless otherwise
noted.
Characteristic
Symbol
Min
Typ
Max Unit
POWER AND CONTROL
VDD Sleep State Current
Tx = 0.8 VDD, CEN = 0.3 VDD
VDD Quiescent Operating Current
Tx = 0.2 VDD, CEN = 0.7 VDD
VBB Sleep State Current
VBB = 16 V, Tx = 0.8 VDD, CEN = 0.3 VDD
VBB Quiescent Operating Current
TX = 0.2 VDD, CEN = 0.7 VDD
Chip Enable
Input High-Voltage Threshold (8)
Input Low-Voltage Threshold (9)
Chip Enable Pull-Down Current (10)
TX Input Low-Voltage Threshold
RISO = 510 Ω (11)
TX Input High-Voltage Threshold
RISO = 510 Ω (12)
TX Pull-Up Current (13)
RX Output Low-Voltage Threshold
RISO = 510 Ω, TX = 0.2 VDD, Rx Sinking 1.0 mA
RX Output High-Voltage Threshold
RISO = 510 Ω, TX = 0.8 VDD, RX Sourcing 250 µA
Thermal Shutdown (14)
IDD(SS)
–
mA
– 0.1
IDD(Q)
–
mA
– 1.0
IBB(SS)
–
µA
– 50
IBB(Q)
–
mA
– 1.0
VIH(CEN)
VIL(CEN)
IPD(CEN)
VIL(Tx)
0.7 VDD
–
2.0
–
V
––
– 0.3 VDD
– 40 µA
V
– 0.3 x VDD
VIH(Tx)
0.7 x VDD
–
V
–
IPU(Tx)
VOL(Rx)
-40
–
– -2.0 µA
V
– 0.2 VDD
VOH(Rx)
0.8 VDD
–
V
–
TLIM
150 170
– °C
Notes
8. When IBB transitions to >100 µA.
9. When IBB transitions to <100 µA.
10. Enable pin has an internal current pull-down. Pull-down current is measured with CEN pin at 0.3 VDD.
11. Measured by ramping TX down from 0.7 VDD and noting TX value at which ISO falls below 0.2 VBB.
12. Measured by ramping TX up from 0.3 VDD and noting the value at which ISO rises above 0.9 VBB.
13. Tx pin has internal current pull-up. Pull-up current is measured with TX pin at 0.7 VDD.
14. Thermal Shutdown performance (TLIM) is guaranteed by design but not production tested.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33290
5
5 Page 
REVISION DATE
6.0 7/2006
7.0 10.2006
REVISION HISTORY
REVISION HISTORY
DESCRIPTION OF CHANGES
• Implemented Revision History page
• Converted to Freescale format and updated to the prevailing for and style
• Added Pb-free suffix EF
• Removed MC33290EG/R2 and replaced with MCZ33290EG/R2 in the Ordering
Information block
• Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter
from Maximum Ratings on page 4. Added note with instructions to obtain this information
from www.freescale.com.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33290
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet MCZ33290.PDF ] | |
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