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L6714 데이터시트 PDF




ST Microelectronics에서 제조한 전자 부품 L6714은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


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부품번호 L6714 기능
기능 4 phase controller
제조업체 ST Microelectronics
로고 ST Microelectronics 로고


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L6714 데이터시트, 핀배열, 회로
www.DataSheet4U.com
L6714
4 phase controller with embedded drivers
for Intel VR10, VR11 and AMD 6Bit CPUs
Features
0.5% output voltage accuracy
7/8 bit programmable output up to 1.60000V -
Intel VR10.x, VR11 DAC
6 bit programmable output up to 1.5500V -
AMD 6Bit DAC
High current integrated gate drivers
Full differential current sensing across inductor
or low side MOSFET
Embedded VRD thermal monitor
Integrated remote sense buffer
Dynamic VID management
Adjustable reference voltage offset
Programmable Soft-Start
Low-Side-Less startup
Programmable over voltage protection
Preliminary over voltage
Constant over current protection
Oscillator internally fixed at 150kHz externally
adjustable
Output enable
SS_END / PGOOD signal
TQFP64 10mm x 10mm package
with Exposed Pad
Application
High current VRD for desktop CPUs
Workstation and server CPU power supply
VRM modules
Order codes
TQFP64 (Exposed Pad)
Description
L6714 implements a four phase step-down
controller with 90º phase-shift between each
phase with integrated high current drivers in a
compact 10mm x 10mm body package with
exposed pad.
The device embeds selectable DACs: the output
voltage ranges up to 1.60000V (both Intel VR10.x
and VR11 DAC) or up to 1.5500V (AMD 6Bit
DAC) managing D-VID with ±0.5% output voltage
accuracy over line and temperature variations.
Additional programmable offset can be added to
the reference voltage with a single external
resistor.
The controller assures fast protection against load
over current and under / over voltage (in this last
case also before UVLO). In case of over-current
the system works in Constant Current mode until
UVP.
Selectable current reading adds flexibility to the
design allowing current sense across inductor or
LS MOSFET.
System Thermal Monitor is also provided allowing
system protection from over-temperature
conditions.
Part number
Package
Packaging
L6714
L6714TR
TQFP64
TQFP64
Tube
Tape and reel
November 2006
Rev 3
1/70
www.st.com
70




L6714 pdf, 반도체, 판매, 대치품
Contents
L6714
23 Tolerance band (TOB) definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
23.1 Controller tolerance (TOB controller) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
23.2 Ext. current sense circuit tolerance
(TOB CurrSense - Inductor Sense) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
23.3 Time constant matching error tolerance (TOB TCMatching) . . . . . . . . . . 63
23.4 Temperature measurement error (VTC) . . . . . . . . . . . . . . . . . . . . . . . . . . 63
24 Layout guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
24.1 Power components and connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
24.2 Small signal components and connections . . . . . . . . . . . . . . . . . . . . . . . 65
25 Embedding L6714 - Based VR... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
26 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
27 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
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L6714 전자부품, 판매, 대치품
L6714
2.2
Functions
Pin settings
Table 1. Pin functions
N° Pin
Function
Channel 1 HS driver output.
1 UGATE1
A small series resistors helps in reducing device-dissipated power.
Channel 1 HS driver supply.
Connect through a capacitor (100nF typ.) to PHASE1 and provide necessary
2 BOOT1 Bootstrap diode.
A small resistor in series to the boot diode helps in reducing Boot capacitor
overcharge.
3 N.C. Not internally connected.
Channel 3 HS driver return path.
4 PHASE3 It must be connected to the HS3 mosfet source and provides return path for the
HS driver of channel 3.
Channel 3 HS driver output.
5 UGATE3
A small series resistors helps in reducing device-dissipated power.
Channel 3 HS driver supply.
Connect through a capacitor (100nF typ.) to PHASE3 and provide necessary
6 BOOT3 Bootstrap diode.
A small resistor in series to the boot diode helps in reducing Boot capacitor
overcharge.
7 N.C. Not internally connected.
Channel 2 HS driver return path.
8 PHASE2 It must be connected to the HS2 mosfet source and provides return path for the
HS driver of channel 2.
Channel 2 HS driver output.
9 UGATE2
A small series resistors helps in reducing device-dissipated power.
Channel 2 HS driver supply.
Connect through a capacitor (100nF typ.) to PHASE2 and provide necessary
10 BOOT2 Bootstrap diode.
A small resistor in series to the boot diode helps in reducing Boot capacitor
overcharge.
11 N.C. Not internally connected.
Channel 4 HS driver return path.
12 PHASE4 It must be connected to the HS4 mosfet source and provides return path for the
HS driver of channel 4.
Channel 4 HS driver output.
13 UGATE4
A small series resistors helps in reducing device-dissipated power.
Channel 4 HS driver supply.
Connect through a capacitor (100nF typ.) to PHASE4 and provide necessary
14 BOOT4 Bootstrap diode.
A small resistor in series to the boot diode helps in reducing Boot capacitor
overcharge.
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