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부품번호 | L6714 기능 |
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기능 | 4 phase controller | ||
제조업체 | ST Microelectronics | ||
로고 | |||
전체 30 페이지수
www.DataSheet4U.com
L6714
4 phase controller with embedded drivers
for Intel VR10, VR11 and AMD 6Bit CPUs
Features
■ 0.5% output voltage accuracy
■ 7/8 bit programmable output up to 1.60000V -
Intel VR10.x, VR11 DAC
■ 6 bit programmable output up to 1.5500V -
AMD 6Bit DAC
■ High current integrated gate drivers
■ Full differential current sensing across inductor
or low side MOSFET
■ Embedded VRD thermal monitor
■ Integrated remote sense buffer
■ Dynamic VID management
■ Adjustable reference voltage offset
■ Programmable Soft-Start
■ Low-Side-Less startup
■ Programmable over voltage protection
■ Preliminary over voltage
■ Constant over current protection
■ Oscillator internally fixed at 150kHz externally
adjustable
■ Output enable
■ SS_END / PGOOD signal
■ TQFP64 10mm x 10mm package
with Exposed Pad
Application
■ High current VRD for desktop CPUs
■ Workstation and server CPU power supply
■ VRM modules
Order codes
TQFP64 (Exposed Pad)
Description
L6714 implements a four phase step-down
controller with 90º phase-shift between each
phase with integrated high current drivers in a
compact 10mm x 10mm body package with
exposed pad.
The device embeds selectable DACs: the output
voltage ranges up to 1.60000V (both Intel VR10.x
and VR11 DAC) or up to 1.5500V (AMD 6Bit
DAC) managing D-VID with ±0.5% output voltage
accuracy over line and temperature variations.
Additional programmable offset can be added to
the reference voltage with a single external
resistor.
The controller assures fast protection against load
over current and under / over voltage (in this last
case also before UVLO). In case of over-current
the system works in Constant Current mode until
UVP.
Selectable current reading adds flexibility to the
design allowing current sense across inductor or
LS MOSFET.
System Thermal Monitor is also provided allowing
system protection from over-temperature
conditions.
Part number
Package
Packaging
L6714
L6714TR
TQFP64
TQFP64
Tube
Tape and reel
November 2006
Rev 3
1/70
www.st.com
70
Contents
L6714
23 Tolerance band (TOB) definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
23.1 Controller tolerance (TOB controller) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
23.2 Ext. current sense circuit tolerance
(TOB CurrSense - Inductor Sense) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
23.3 Time constant matching error tolerance (TOB TCMatching) . . . . . . . . . . 63
23.4 Temperature measurement error (VTC) . . . . . . . . . . . . . . . . . . . . . . . . . . 63
24 Layout guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
24.1 Power components and connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
24.2 Small signal components and connections . . . . . . . . . . . . . . . . . . . . . . . 65
25 Embedding L6714 - Based VR... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
26 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
27 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
4/70
4페이지 L6714
2.2
Functions
Pin settings
Table 1. Pin functions
N° Pin
Function
Channel 1 HS driver output.
1 UGATE1
A small series resistors helps in reducing device-dissipated power.
Channel 1 HS driver supply.
Connect through a capacitor (100nF typ.) to PHASE1 and provide necessary
2 BOOT1 Bootstrap diode.
A small resistor in series to the boot diode helps in reducing Boot capacitor
overcharge.
3 N.C. Not internally connected.
Channel 3 HS driver return path.
4 PHASE3 It must be connected to the HS3 mosfet source and provides return path for the
HS driver of channel 3.
Channel 3 HS driver output.
5 UGATE3
A small series resistors helps in reducing device-dissipated power.
Channel 3 HS driver supply.
Connect through a capacitor (100nF typ.) to PHASE3 and provide necessary
6 BOOT3 Bootstrap diode.
A small resistor in series to the boot diode helps in reducing Boot capacitor
overcharge.
7 N.C. Not internally connected.
Channel 2 HS driver return path.
8 PHASE2 It must be connected to the HS2 mosfet source and provides return path for the
HS driver of channel 2.
Channel 2 HS driver output.
9 UGATE2
A small series resistors helps in reducing device-dissipated power.
Channel 2 HS driver supply.
Connect through a capacitor (100nF typ.) to PHASE2 and provide necessary
10 BOOT2 Bootstrap diode.
A small resistor in series to the boot diode helps in reducing Boot capacitor
overcharge.
11 N.C. Not internally connected.
Channel 4 HS driver return path.
12 PHASE4 It must be connected to the HS4 mosfet source and provides return path for the
HS driver of channel 4.
Channel 4 HS driver output.
13 UGATE4
A small series resistors helps in reducing device-dissipated power.
Channel 4 HS driver supply.
Connect through a capacitor (100nF typ.) to PHASE4 and provide necessary
14 BOOT4 Bootstrap diode.
A small resistor in series to the boot diode helps in reducing Boot capacitor
overcharge.
7/70
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구매 문의 | 일반 IC 문의 : 샘플 및 소량 구매 ----------------------------------------------------------------------- IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한 광범위한 전력 반도체를 판매합니다. 전력 반도체 전문업체 상호 : 아이지 인터내셔날 사이트 방문 : [ 홈페이지 ] [ 블로그 1 ] [ 블로그 2 ] |
부품번호 | 상세설명 및 기능 | 제조사 |
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DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |