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Número de pieza | BAV199DW | |
Descripción | QUAD SURFACE MOUNT LOW LEAKAGE DIODE | |
Fabricantes | Diodes Incorporated | |
Logotipo | ||
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No Preview Available ! BAV199DW
QUAD SURFACE MOUNT LOW LEAKAGE DIODE
Features
Mechanical Data
• Surface Mount Package Ideally Suited for Automated Insertion
• Very Low Leakage Current
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device (Notes 4 and 5)
• Qualified to AEC-Q101 Standards for High Reliability
• Case: SOT-363
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Finish - Matte Tin annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
• Polarity: See Diagram
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.008 grams (approximate)
SOT-363
AC
1
C2
A2
TOP VIEW
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 2)
Repetitive Peak Forward Current (Note 2)
Non-Repetitive Peak Forward Surge Current
Single diode
Double diode
@ t = 1.0μs
@ t = 1.0ms
@ t = 1.0s
A1
C1
AC
2
TOP VIEW
Internal Schematic
Symbol
VRRM
VRWM
VR
VR(RMS)
IFM
IFRM
IFSM
Value
85
60
160
140
500
4.0
1.0
0.5
Unit
V
V
mA
mA
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 2)
Thermal Resistance Junction to Ambient Air (Note 2)
Operating and Storage Temperature Range
Symbol
PD
RθJA
TJ , TSTG
Value
200
625
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 1)
Forward Voltage
Leakage Current (Note 1)
Total Capacitance
Reverse Recovery Time
Symbol
V(BR)R
VF
IR
CT
trr
Min Typ Max Unit
Test Condition
85 ⎯ ⎯ V IR = 100μA
0.90 IF = 1.0mA
⎯
⎯
1.0
1.1
V IF = 10mA
IF = 50mA
1.25 IF = 150mA
⎯
⎯
5.0 nA VR = 75V
80 nA VR = 75V, TJ = 150°C
⎯ 2 ⎯ pF VR = 0, f = 1.0MHz
⎯
⎯
3.0
μs
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
Notes:
1. Short duration pulse test used to minimize self-heating effect.
2. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BAV199DW
Document number: DS30417 Rev. 9 - 2
1 of 4
www.diodes.com
August 2009
© Diodes Incorporated
1 page |
Páginas | Total 4 Páginas | |
PDF Descargar | [ Datasheet BAV199DW.PDF ] |
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