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PDF MC145828B Data sheet ( Hoja de datos )

Número de pieza MC145828B
Descripción LOOK-AHEAD CARRY BLOCK
Fabricantes Motorola Semiconductors 
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Look-Ahead Carry Block
The MC14582B is a CMOS look–ahead carry generator capable of
anticipating a carry across four binary adders or groups of adders. The
device is cascadable to perform full look–ahead across n–bit adders. Carry,
generate–carry, and propagate–carry functions are provided as enumerated
in the pin designation table shown below.
Expandable to any Number of Bits
All Buffered Outputs
Low Power Dissipation
Diode Protection on All Inputs
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low–power TTL Loads or One Low–Power
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎSchottky TTL Load over the Rated Temperature Range
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎMAXIMUM RATINGS* (Voltages Referenced to VSS)
Symbol
Parameter
Value
Unit
VDD DC Supply Voltage
Vin, Vout Input or Output Voltage (DC or Transient)
Iin, Iout Input or Output Current (DC or Transient),
per Pin
– 0.5 to + 18.0
– 0.5 to VDD + 0.5
± 10
V
V
mA
PD Power Dissipation, per Package†
500 mW
Tstg Storage Temperature
– 65 to + 150
_C
TL Lead Temperature (8–Second Soldering)
260 _ C
* Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_ C From 65_ C To 125_ C
Ceramic “L” Packages: – 12 mW/_ C From 100_ C To 125_ C
LOGIC EQUATIONS
Cn+x = G0 + (P0  Cn)
Cn+y = G1 + (P1  G0) + (P1  P0  Cn)
Cn+z = G2 + (P2  G1) + (P2  P1 G0) + (P2  P1  P0  Cn)
G = G3 + (P3  G2) + (P3  P2  G1) + (P1  P2  P3  G0)
P = P3  P2  P1  P0
Designation
G0, G1, G2, G3
PIN DESIGNATIONS
Pin No’s
Function
3, 1, 14, 5
Active–Low
Carry–Generate Inputs
P0, P1, P2, P3
4, 2, 15, 6
Active–Low
Carry–Propagate Inputs
Cn
Cn+x, Cn+y
Cn+z
G
13
12, 11, 9
10
Carry Input
Carry Outputs
Active–Low Group
Carry–Generate Output
P 7 Active–Low Group
Carry–Propagate Output
REV 3
1/94
©MMOotoTrOolaR, IOncL. A199C5MOS LOGIC DATA
MC14582B
L SUFFIX
CERAMIC
CASE 620
P SUFFIX
PLASTIC
CASE 648
D SUFFIX
SOIC
CASE 751B
ORDERING INFORMATION
MC14XXXBCP
MC14XXXBCL
MC14XXXBD
Plastic
Ceramic
SOIC
TA = – 55° to 125°C for all packages.
PIN ASSIGNMENT
G1 1
P1 2
16 VDD
15 P2
G0 3
14 G2
P0 4
G3 5
P3 6
P7
13 Cin
12 Cn+x
11 Cn+y
10 G
VSS 8
9 Cn+z
MC14582B
1

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MC145828B pdf
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16 9
–B–
18
CL
–T–
SEATING
PLANE
F
NK
E
G
D 16 PL
0.25 (0.010) M T A S
M
J 16 PL
0.25 (0.010) M T B S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
INCHES
DIM MIN MAX
A 0.750 0.785
B 0.240 0.295
C ––– 0.200
D 0.015 0.020
E 0.050 BSC
F 0.055 0.065
G 0.100 BSC
H 0.008 0.015
K 0.125 0.170
L 0.300 BSC
M 0_ 15_
N 0.020 0.040
MILLIMETERS
MIN MAX
19.05 19.93
6.10 7.49
––– 5.08
0.39 0.50
1.27 BSC
1.40 1.65
2.54 BSC
0.21 0.38
3.18 4.31
7.62 BSC
0_ 15_
0.51 1.01
–A–
16
1
H
G
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
9
B
8
FC
S
L
–T–
SEATING
PLANE
KJ
D 16 PL
0.25 (0.010) M T A M
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC
2.54 BSC
H 0.050 BSC
1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0_ 10_ 0 _ 10 _
S 0.020 0.040 0.51 1.01
MOTOROLA CMOS LOGIC DATA
MC14582B
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