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PDF RMPA2458 Data sheet ( Hoja de datos )
| Número de pieza | RMPA2458 | |
| Descripción | InGaP HBT Low Current Linear Power Amplifier | |
| Fabricantes | Fairchild Semiconductor | |
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Preliminary
September 2005
RMPA2458
2.4–2.5 GHz InGaP HBT Low Current Linear Power Amplifier
Features
■ 31.5dB small signal gain
■ 27dBm output power @ 1dB compression
■ 103mA total current at 19dBm modulated power out
■ 2.5% EVM at 19 dBm modulated power out
■ 3.3V collector supply operation
■ 2.9V mirror supply operation
■ Power saving shutdown options (bias control)
■ Integrated power detector with 20dB dynamic range
■ Lead-free RoHS compliant 3 x 3 x 0.9mm leadless package
■ Internally matched to 50 Ohms and DC blocked RF input/
output
■ Optimized for use in 802.11b/g applications
General Description
The RMPA2458 power amplifier is designed for high
performance WLAN applications in the 2.4–2.5 GHz frequency
band. The low profile 16 pin 3 x 3 x 0.9 mm package with internal
matching on both input and output to 50 Ohms minimizes next
level PCB space and allows for simplified integration. The on-
chip detector provides power sensing capability while the bias
control provides power saving shutdown capability. The PA’s
industry leading low power consumption and excellent linearity
are achieved using our InGaP Heterojunction Bipolar Transistor
(HBT) technology.
Device
Electrical Characteristics1 802.11g OFDM Modulation
(176 µs burst time, 100 µs idle time) 54 Mbps Data Rate, 16.7 MHz Bandwidth
Parameter
Frequency
Collector Supply Voltage
Mirror Supply Voltage
Mirror Supply Current
Gain
Total Current @ 19dBm POUT
EVM @ 19dBm POUT2
Detector Output @ 19dBm POUT
Detector Threshold3
Min
2.4
3.0
Typ
3.3
2.9
3.3
31.5
103
2.5
340
5
Notes:
1. VC1, VC2, VC3 = 3.3V, VM123 = 2.9V, TA = 25°C, PA is constantly biased, 50Ω system.
2. Percentage includes system noise floor of EVM = 0.8%.
3. POUT measured at PIN corresponding to power detection threshold.
Max
2.5
3.6
Units
GHz
V
V
mA
dB
mA
%
mV
dBm
©2005 Fairchild Semiconductor Corporation
RMPA2458 Rev. E
1
www.fairchildsemi.com
1 page  
Evaluation Board Schematic
Package Outline
16 15 14 13
1
2
3
4
12
11
10
9
56
78
Backside Ground
Dimensions in mm
Note: Dimensions do not include protrusions or mold flash. These are not to exceed 0.006" (.155mm) on any side.
RMPA2458 Rev. E
5 www.fairchildsemi.com
5 Page | ||
| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet RMPA2458.PDF ] | |
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