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PDF STD50N03L Data sheet ( Hoja de datos )
| Número de pieza | STD50N03L | |
| Descripción | N-CHANNEL MOSFET | |
| Fabricantes | ST Microelectronics | |
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STD50N03L
STD50N03L-1
N-CHANNEL 30V - 9.2mΩ - 40A - DPAK/IPAK
STripFET™ III Power MOSFET
General features
Type
STD50N03L
STD50N03L-1
VDSS
30V
30V
RDS(on)
10.5mΩ
10.5mΩ
■ RDS(on)*Qg industry’s benchmark
■ Conduction losses reduced
■ Switching losses reduced
■ Low threshold device
ID
40A
40A
Description
This product utilizes the latest advanced design
rules of ST’s proprietary STripFET™ technology.
This is suitable for the most demanding DC-DC
converter application where high efficiency is to
be achieved.
Applications
■ Switching applications
3
2
1
IPAK
3
1
DPAK
Internal schematic diagram
Order codes
Part number
STD50N03L
STD50N03L-1
Marking
D50N03L
D50N03L
Package
DPAK
IPAK
Packaging
Tape & reel
Tube
October 2006
Rev 2
1/16
www.st.com
16
1 page  
STD50N03L - STD50N03L-1
Electrical characteristics
Table 5. Switching times
Symbol
Parameter
td(on)
tr
Turn-on delay time
Rise time
td(off)
tf
Turn-off delay time
Fall time
Test conditions
VDD=15V, ID= 25A,
RG= 4.7Ω, VGS= 4.5V
(see Figure 12)
VDD= 15V, ID= 25A,
RG= 4.7Ω, VGS= 4.5V
(see Figure 12)
Min. Typ. Max. Unit
15 ns
125 ns
14 ns
45 ns
Table 6. Source drain diode
Symbol
Parameter
Test conditions
ISD
ISDM(1)
Source-drain current
Source-drain current
(pulsed)
VSD(2) Forward on voltage
ISD= 20A, VGS=0
trr
Qrr
IRRM
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD= 40A, di/dt = 100A/µs,
VDD= 10 V, Tj = 25°C
(see Figure 17)
trr
Qrr
IRRM
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD= 40A, di/dt = 100A/µs,
VDD= 10V, Tj= 150°C
(see Figure 17)
1. Pulse width limited by safe operating area
2. Pulsed: pulse duration=300µs, duty cycle 1.5%
Min. Typ. Max. Unit
40 A
160 A
1.3 V
26 ns
15.6 nC
1.2 A
26.4 ns
18.1 nC
1.4 A
5/16
5 Page 
STD50N03L - STD50N03L-1
4 Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at : www.st.com
11/16
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet STD50N03L.PDF ] | |
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