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PDF CS5203-3 Data sheet ( Hoja de datos )
| Número de pieza | CS5203-3 | |
| Descripción | Linear Regulator | |
| Fabricantes | ON Semiconductor | |
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CS5203−3
3.0 A, 3.3 V Fixed Linear
Regulator
The CS5203−3 linear regulator provides 3.3 V reference at 3.0 A
with an output voltage accuracy of ±1.5%.
This regulator is intended for use as a post regulator and
microprocessor supply. The fast loop response and low dropout
voltage make this regulator ideal for applications where low voltage
operation and good transient response are important.
The circuit is designed to provide 3.0 A of output current with
dropout voltages of less than 1.15 V. The maximum quiescent current
is only 10 mA at full load. Device protection includes over−current
and thermal shutdown.
The CS5203−3 is pin compatible with the LT1085 family of linear
regulators.
The regulator is available in a surface mount D2PAK−3 package.
Features
• Output Current to 3.0 A
• Output Accuracy to ±1.5% Over Temperature
• Dropout Voltage (typical) 1.15 V @ 3.0 A
• Fast Transient Response
• Fault Protection
− Current Limit
− Thermal Shutdown
5.0 V
100 mF
5.0 V
VIN VOUT
CS5203−3
GND
3.3 V @ 3.0 A
10 mF
5.0 V
http://onsemi.com
123
D2PAK−3
DP SUFFIX
CASE 418AB
Tab = VOUT
Pin 1. GND
2. VOUT
3. VIN
MARKING DIAGRAM
CS5203−3
AWLYWW
1
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Figure 1. Application Diagram
© Semiconductor Components Industries, LLC, 2006
September, 2006 − Rev. 7
1
Publication Order Number:
CS5203−3/D
1 page  
CS5203−3
Output Voltage Sensing
Since the CS5203−3 is a three terminal regulator, it is not
possible to provide true remote load sensing. Load
regulation is limited by the resistance of the conductors
connecting the regulator to the load. For best results the
regulator should be connected as shown in Figure 10.
VIN VIN VOUT
CS5203−3
Conductor Parasitic
RC Resistance
RLOAD
Figure 10. Conductor Parasitic Resistance Effects
Can Be Minimized With the Above Grounding
Scheme For Fixed Output Regulators
Calculating Power Dissipation and Heat Sink
Requirements
The CS5203−3 linear regulator includes thermal
shutdown and current limit circuitry to protect the device.
High power regulators such as these usually operate at high
junction temperatures so it is important to calculate the
power dissipation and junction temperatures accurately to
ensure that an adequate heat sink is used.
The case is connected to VOUT on the CS5203−3,
electrical isolation may be required for some applications.
Thermal compound should always be used with high current
regulators such as these.
The thermal characteristics of an IC depend on the
following four factors:
1. Maximum Ambient Temperature TA (°C)
2. Power dissipation PD (Watts)
3. Maximum junction temperature TJ (°C)
4. Thermal resistance junction to ambient RqJA (°C/W)
These four are related by the equation
TJ + TA ) PD RQJA
(1)
The maximum ambient temperature and the power
dissipation are determined by the design while the
maximum junction temperature and the thermal resistance
depend on the manufacturer and the package type.
The maximum power dissipation for a regulator is:
PD(max) + {VIN(max) * VOUT(min)}IOUT(max) ) VIN(max)IQ
(2)
where:
VIN(max) is the maximum input voltage,
VOUT(min) is the minimum output voltage,
IOUT(max) is the maximum output current, for the
application
IQ is the maximum quiescent current at IOUT(max).
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment has a thermal resistance. Like series
electrical resistances, these resistances are summed to
determine RqJA, the total thermal resistance between the
junction and the surrounding air.
1. Thermal Resistance of the junction to case, RqJC
(°C/W)
2. Thermal Resistance of the case to Heat Sink, RqCS
(°C/W)
3. Thermal Resistance of the Heat Sink to the ambient
air, RqSA (°C/W)
These are connected by the equation:
RQJA + RQJC ) RQCS ) RQSA
(3)
The value for RqJA is calculated using equation (3) and the
result can be substituted in equation (1).
The value for RqJC is 3.5°C/W for a given package type
based on an average die size. For a high current regulator
such as the CS5203−3 the majority of the heat is generated
in the power transistor section. The value for RqSA depends
on the heat sink type, while RqCS depends on factors such as
package type, heat sink interface (is an insulator and thermal
grease used?), and the contact area between the heat sink and
the package. Once these calculations are complete, the
maximum permissible value of RqJA can be calculated and
the proper heat sink selected. For further discussion on heat
sink selection, see application note “Thermal
Management,” document number AND8036/D, available
through the Literature Distribution Center or via our website
at http://onsemi.com.
ORDERING INFORMATION
Orderable Part Number
Type*
Package
Shipping†
CS5203−3GDP3
3.0 A, 3.3 V Output
D2PAK−3
50 Units / Rail
CS5203−3GDPR3
3.0 A, 3.3 V Output
D2PAK−3
750 / Tape & Reel
*Consult your local sales representative for other package options.
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet CS5203-3.PDF ] | |
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