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PDF CS5207-2 Data sheet ( Hoja de datos )
| Número de pieza | CS5207-2 | |
| Descripción | Linear Regulator | |
| Fabricantes | ON Semiconductor | |
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CS5207−2
7.0 A, 1.5 V Fixed Linear
Regulator
The CS5207−2 provides 7.0 A at 1.5 V with an accuracy of ±2.0 %.
The regulator is intended for use as an active termination for the
GTL bus on Intel based motherboards. The fast loop response and low
dropout voltage make these regulators ideal for applications where
low voltage operation and good transient response are important.
The circuit is designed to operate with dropout voltages as low as 1.0 V
depending on the output current level. The maximum quiescent current is
only 10 mA at full load.
The regulators are fully protected against overload conditions with
protection circuitry for Safe Operating Area (SOA), overcurrent and
thermal shutdown.
The CS5207−2 is available in TO−220 packages.
Features
• Output Current to 7.0 A
• Output Voltage Trimmed to ±2.0%
• Dropout Voltage 1.45 V @ 7.0 A
• Fast Transient Response
• Fault Protection Circuitry
− Thermal Shutdown
− Overcurrent Protection
− Safe Area Protection
http://onsemi.com
TO−220
THREE LEAD
T SUFFIX
CASE 221A
12 3
PIN CONNECTIONS AND
MARKING DIAGRAMS
CS5207−2
AWLYWW
Tab = VOUT
Pin 1. GND
2. VOUT
3. VIN
VIN
Thermal
Shutdown
Bandgap
Output
Current
Limit
− + Error
Amplifier
Figure 1. Block Diagram
VOUT
GND
1
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
ORDERING INFORMATION*
Device
Package
Shipping
CS5207−2GT3
TO−220†
50 Units/Rail
*Additional ordering information can be found on page
5 of this data sheet.
† TO−220 is 3−pin, straight leaded.
© Semiconductor Components Industries, LLC, 2006
September, 2006 − Rev. 8
1
Publication Order Number:
CS5207−2/D
1 page  
CS5207−2
Calculating Power Dissipation and Heat Sink
Requirements
The CS5207−2 includes thermal shutdown and safe
operating area circuitry to protect the device. High power
regulators such as these usually operate at high junction
temperatures so it is important to calculate the power
dissipation and junction temperatures accurately to ensure
that an adequate heat sink is used.
The case is connected to VOUT on the CS5207−2,
electrical isolation may be required for some applications.
Thermal compound should always be used with high current
regulators such as these.
The thermal characteristics of an IC depend on the
following four factors:
1. Maximum Ambient Temperature TA (°C)
2. Power dissipation PD (Watts)
3. Maximum junction temperature TJ (°C)
4. Thermal resistance junction to ambient RΘJA (°C/W)
These four are related by the equation
TJ + TA ) PD RQJA
(1)
The maximum ambient temperature and the power
dissipation are determined by the design while the
maximum junction temperature and the thermal resistance
depend on the manufacturer and the package type.
The maximum power dissipation for a regulator is:
PD(max) + {VIN(max) * VOUT(min)}IOUT(max) ) VIN(max)IQ
(2)
where:
VIN(max) is the maximum input voltage,
VOUT(min) is the minimum output voltage,
IOUT(max) is the maximum output current, for the
application
IQ is the maximum quiescent current at IOUT(max).
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment has a thermal resistance. Like series
electrical resistances, these resistances are summed to
determine RΘJA, the total thermal resistance between the
junction and the surrounding air.
1. Thermal Resistance of the junction to case, RΘJC
(°C/W)
2. Thermal Resistance of the case to Heat Sink, RΘCS
(°C/W)
3. Thermal Resistance of the Heat Sink to the ambient
air, RΘSA (°C/W)
These are connected by the equation:
RQJA + RQJC ) RQCS ) RQSA
(3)
The value for RΘJA is calculated using equation (3) and
the result can be substituted in equation (1).
RΘJC is 1.6°C/Watt for the CS5207−2. For a high current
regulator such as the CS5207−2 the majority of the heat is
generated in the power transistor section. The value for
RΘSA depends on the heat sink type, while RΘCS depends on
factors such as package type, heat sink interface (is an
insulator and thermal grease used?), and the contact area
between the heat sink and the package. Once these
calculations are complete, the maximum permissible value
of RΘJA can be calculated and the proper heat sink selected.
For further discussion on heat sink selection, see application
note “Thermal Management,” document number
AND8036/D, available through the Literature Distribution
Center or via our website at http://onsemi.com.
ADDITIONAL ORDERING INFORMATION
Orderable Part
Number
Type
CS5207−2GT3
7.0 A, 1.5 V Output
Description
TO−220 THREE LEAD, STRAIGHT
http://onsemi.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet CS5207-2.PDF ] | |
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