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부품번호 | MC74AC174 기능 |
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기능 | Hex D Flip-Flop | ||
제조업체 | ON Semiconductor | ||
로고 | |||
전체 9 페이지수
MC74AC174, MC74ACT174
Hex D Flip−Flop
with Master Reset
The MC74AC174/74ACT174 is a high−speed hex D flip−flop. The
device is used primarily as a 6−bit edge−triggered storage register. The
information on the D inputs is transferred to storage during the
LOW−to−HIGH clock transition. The device has a Master Reset to
simultaneously clear all flip−flops.
• Outputs Source/Sink 24 mA
• ′ACT174 Has TTL Compatible Inputs
VCC Q5 D5 D4 Q4 D3 Q3 CP
16 15 14 13 12 11 10 9
12345678
MR Q0 D0 D1 Q1 D2 Q2 GND
Figure 1. Pinout: 16−Lead Packages Conductors
(Top View)
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PIN ASSIGNMENT
PIN FUNCTION
D0−D5
CP
Data Inputs
Clock Pulse Input
MR Master Reset Input
Q0−Q5
Outputs
TRUTH TABLE
Inputs
Output
MR CP
D
Q
LXX
HH
HL
HLX
L
H
L
Q
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
= LOW−to−HIGH Transition of Clock
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16
1
16
1
16
1
DIP−16
N SUFFIX
CASE 648
SO−16
D SUFFIX
CASE 751B
TSSOP−16
DT SUFFIX
CASE 948F
16
1
EIAJ−16
M SUFFIX
CASE 966
ORDERING INFORMATION
Device
Package
Shipping
MC74AC174N
PDIP−16 25 Units/Rail
MC74ACT174N
PDIP−16 25 Units/Rail
MC74AC174D
SOIC−16 48 Units/Rail
MC74ACT174D
MC74AC174DR2
SOIC−16 48 Units/Rail
SOIC−16 2500 Tape & Reel
MC74ACT174DR2 SOIC−16 2500 Tape & Reel
MC74AC174DT TSSOP−16 96 Units/Rail
MC74ACT174DT TSSOP−16 96 Units/Rail
MC74AC174DTR2 TSSOP−16 2500 Tape & Reel
MC74AC174M
EIAJ−16
50 Units/Rail
MC74ACT174M
EIAJ−16
50 Units/Rail
MC74AC174MEL EIAJ−16 2000 Tape & Reel
MC74ACT174MEL EIAJ−16 2000 Tape & Reel
© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 7
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 6 of this data sheet.
1 Publication Order Number:
MC74AC174/D
MC74AC174, MC74ACT174
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
74AC
74AC
Symbol
Parameter
VCC*
(V)
TA = +25°C
CL = 50 pF
Min Typ Max
TA = −40°C
to +85°C
CL = 50 pF
Min Max
Unit
Fig.
No.
fmax
Maximum Clock
Frequency
3.3 90 100
5.0 100 125
−
−
70
100
−
−
MHz
3−3
tPLH
Propagation Delay
CP to Qn
tPHL
Propagation Delay
CP to Qn
tPHL
Propagation Delay
MR to Qn
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
3.3 2.0 9.0 11.5 1.5 12.5
5.0 1.5 6.0 8.5 1.0 9.5
3.3 2.0 8.5 11.0 1.5 12.0
5.0 1.5 6.0 8.0 1.0 9.0
3.3 2.5 9.0 11.5 2.0 12.5
5.0 1.5 7.0 9.0 1.5 10.5
ns
ns
ns
3−6
3−6
3−6
AC OPERATING REQUIREMENTS
Symbol
Parameter
ts
Setup Time, HIGH or LOW
Dn to CP
th
Hold Time, HIGH or LOW
Dn to CP
tw MR Pulse Width, LOW
tw CP Pulse Width
trec
Recovery TIme
MR to CP
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
VCC*
(V)
3.3
5.0
3.3
5.0
3.3
5.0
3.3
5.0
3.3
5.0
74AC
74AC
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
Typ Guaranteed Minimum
2.5 6.5
2.0 5.0
7.0
5.5
1.0 3.0
0.5 3.0
3.0
3.0
1.0 5.5
1.0 5.0
7.0
5.0
1.0 5.5
1.0 5.0
7.0
5.0
0 2.5
0 2.0
2.5
2.0
Unit
ns
ns
ns
ns
ns
Fig.
No.
3−9
3−9
3−6
3−6
3−6
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4
4페이지 MC74AC174, MC74ACT174
PACKAGE DIMENSIONS
−A−
16
1
H
G
PDIP−16
N SUFFIX
16 PIN PLASTIC DIP PACKAGE
CASE 648−08
ISSUE R
9
B
8
FC
S
L
−T−
SEATING
PLANE
KJ
D 16 PL
0.25 (0.010) M T A M
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC
2.54 BSC
H 0.050 BSC
1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0_ 10_ 0 _ 10 _
S 0.020 0.040 0.51 1.01
−A−
16
1
SO−16
D SUFFIX
16 PIN PLASTIC SOIC PACKAGE
CASE 751B−05
ISSUE J
9
−B− P 8 PL
8 0.25 (0.010) M B S
G
−T− SEATING
PLANE
K
C
D 16 PL
0.25 (0.010) M T B S A S
R X 45_
F
MJ
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC
0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
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7
7페이지 | |||
구 성 | 총 9 페이지수 | ||
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부품번호 | 상세설명 및 기능 | 제조사 |
MC74AC174 | Hex D Flip-Flop | ON Semiconductor |
MC74AC175 | Quad D Flip-Flop | ON Semiconductor |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |