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RMPA2266 데이터시트 PDF




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부품번호 RMPA2266 기능
기능 WCDMA Band I Power Amplifier Module
제조업체 Fairchild Semiconductor
로고 Fairchild Semiconductor 로고


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RMPA2266 데이터시트, 핀배열, 회로
PRELIMINARY
RMPA2266 i-Lo™
WCDMA Band I Power Amplifier Module
April 2007
tm
Features
General Description
40% WCDMA efficiency at +28dBm Pout
The RMPA2266 Power Amplifier Module (PAM) is
20% WCDMA efficiency (58mA total current) at
+16dBm Pout
Low quiescent current (Iccq): 25mA in low-power
mode
Meets UMTS/WCDMA performance requirements
Meets HSDPA performance requirements
Fairchild’s latest innovation in 50matched, surface
mount modules targeting UMTS/WCDMA/HSDPA
applications. Answering the call for ultra-low DC power
consumption and extended battery life in portable
electronics, the RMPA2266 uses novel proprietary
circuitry to dramatically reduce amplifier current at low to
medium RF output power levels (< +16dBm), where the
Single positive-supply operation with low power and
handset most often operates. A simple two-state Vmode
shutdown modes
control is all that is needed to reduce operating current
– 3.4V typical Vcc operation
by more than 60% at 16dBm output power, and
– Low Vref (2.85V) compatible with advanced handset
chipsets
Compact Lead-free compliant LCC package –
(4.0 x 4.0 x 1.0mm nominal)
Industry standard pinout
Internally matched to 50and DC blocked RF
quiescent current (Iccq) by as much as 70% compared
to traditional power-saving methods. No additional
circuitry, such as DC-to-DC converters, are required to
achieve this remarkable improvement in amplifier
efficiency. Further, the 4 x 4 x 1.0mm LCC package is
pin-compatible and a drop-in replacement for last
generation 4 x 4mm PAMs widely used today, minimizing
input/output
the design time to apply this performance-enhancing
technology. The multi-stage GaAs Microwave Monolithic
www.DataSheet4U.com
Integrated Circuit (MMIC) is manufactured using
Fairchild RF’s InGaP Heterojunction Bipolar Transistor
(HBT) process.
Functional Block Diagram
(Top View)
Vcc1 1
RF IN 2
GND 3
Vmode 4
Vref 5
MMIC
INPUT
MATCH
BIAS/MODE SWITCH
10 Vcc2
OUTPUT
MATCH
9 GND
8 RF OUT
7 GND
6 GND
11 (paddle ground on package bottom)
©2007 Fairchild Semiconductor Corporation
RMPA2266 i-Lo™ Rev. D
www.fairchildsemi.com




RMPA2266 pdf, 반도체, 판매, 대치품
PRELIMINARY
Evaluation Board Layout
1
5 63
2
65
4
7
5
Materials List
Qty Item No.
Part Number
1 1 G657553-1 V2
2 2 #142-0701-841
5 3 #2340-5211TN
Ref 4
3 5 GRM39X7R102K50V
3 5 (Alt) ECJ-1VB1H102K
2 6 C3216X5R1A335M
1 7 GRM39Y5V104Z16V
1 7 (Alt) ECJ-1VB1C104K
A/R 8 SN63
A/R 9 SN96
Description
PC Board
SMA Connector
Terminals
Assembly, RMPA2266
1000pF Capacitor (0603)
1000pF Capacitor (0603)
3.3µF Capacitor (1206)
0.1µF Capacitor (0603)
0.1µF Capacitor (0603)
Solder Paste
Solder Paste
Evaluation Board Schematic
Vendor
Fairchild
Johnson
3M
Fairchild
Murata
Panasonic
TDK
Murata
Panasonic
Indium Corp.
Indium Corp.
SMA1
RF IN
3.3 µF
1000 pF
VCC1
VMODE
50 Ohm TRL
1
2
4
1000 pF
VREF
5
0.1 µF
1000 pF
3.3 µF
10 VCC2
8 50 Ohm TRL
3, 6, 7, 9
11
(PACKAGE BASE)
SMA2
RF OUT
©2007 Fairchild Semiconductor Corporation
RMPA2266 i-Lo™ Rev. D
4
www.fairchildsemi.com

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RMPA2266 전자부품, 판매, 대치품
PRELIMINARY
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an
exhaustive list of all such trademarks.
ACEx®
Across the board. Around the world.¥
ActiveArray¥
Bottomless¥
Build it Now¥
CoolFET¥
CROSSVOLT¥
CTL™
Current Transfer Logic™
DOME¥
E2CMOS¥
EcoSPARK®
EnSigna¥
FACT Quiet Series™
FACT®
FAST®
FASTr¥
FPS¥
FRFET®
GlobalOptoisolator¥
GTO¥
HiSeC¥
i-Lo¥
ImpliedDisconnect¥
IntelliMAX¥
ISOPLANAR¥
MICROCOUPLER¥
MicroPak¥
MICROWIRE¥
MSX¥
MSXPro¥
OCX¥
OCXPro¥
OPTOLOGIC®
OPTOPLANAR®
PACMAN¥
POP¥
Power220®
Power247®
PowerEdge¥
PowerSaver¥
PowerTrench®
Programmable Active Droop¥
QFET®
QS¥
QT Optoelectronics¥
Quiet Series¥
RapidConfigure¥
RapidConnect¥
ScalarPump¥
SMART START¥
SPM®
STEALTH™
SuperFET¥
SuperSOT¥-3
SuperSOT¥-6
SuperSOT¥-8
SyncFET™
TCM¥
The Power Franchise®
TinyBoost¥
TinyBuck¥
TinyLogic®
TINYOPTO¥
TinyPower¥
TinyWire¥
TruTranslation¥
PSerDes¥
UHC®
UniFET¥
VCX¥
Wire¥
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER
ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
2. A critical component in any component of a life support,
device, or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status
Advance Information
Formative or In Design
Preliminary
First Production
No Identification Needed Full Production
Obsolete
Not In Production
Definition
This datasheet contains the design specifications for product
development. Specifications may change in any manner without notice.
This datasheet contains preliminary data; supplementary data will be
published at a later date. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve design.
This datasheet contains final specifications. Fairchild Semiconductor
reserves the right to make changes at any time without notice to improve
design.
This datasheet contains specifications on a product that has been
discontinued by Fairchild Semiconductor. The datasheet is printed for
reference information only.
Rev. I24
©2007 Fairchild Semiconductor Corporation
RMPA2266 i-Lo™ Rev. D
7
www.fairchildsemi.com

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