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PDF MC3488A Data sheet ( Hoja de datos )

Número de pieza MC3488A
Descripción Dual EIA-423/EIA-232D Line Driver
Fabricantes ON Semiconductor 
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MC3488A
Dual EIA−423/EIA−232D
Line Driver
The MC3488A dual is single−ended line driver has been designed to
satisfy the requirements of EIA standards EIA−423 and EIA−232D, as
well as CCITT X.26, X.28 and Federal Standard FIDS1030. It is
suitable for use where signal wave shaping is desired and the output
load resistance is greater than 450 W. Output slew rates are adjustable
from 1.0 ms to 100 ms by a single external resistor. Output level and
slew rate are insensitive to power supply variations. Input undershoot
diodes limit transients below ground and output current limiting is
provided in both output states.
The MC3488A has a standard 1.5 V input logic threshold for TTL or
NMOS compatibility.
Features
PNP Buffered Inputs to Minimize Input Loading
Short Circuit Protection
Adjustable Slew Rate Limiting
MC3488A Equivalent to 9636A
Output Levels and Slew Rates are Insensitive to Power
Supply Voltages
No External Blocking Diode Required for VEE Supply
Second Source mA9636A
www.DataSheet4U.com
Pb−Free Packages are Available
http://onsemi.com
MARKING
DIAGRAMS
8
SOIC−8
3488A
D SUFFIX
ALYW
1 CASE 751
G
1
8
PDIP−8
P1 SUFFIX
CASE 626
MC3488AP1
AWL
YYWWG
11
A = Assembly Location
L, WL = Wafer Lot
Y, YY = Year
W, WW = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
Wave
Shape
1
Input A 2
Input B 3
GND 4
8 VCC
7 Output A
6 Output B
5 VEE
Wave Shape Control
TTL Logic
MC3488A Driver
RS−423 Interface
Figure 1. Simplified Application
© Semiconductor Components Industries, LLC, 2006
July, 2006 − Rev. 5
1
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
MC3486
Three−State Receiver
Publication Order Number:
MC3488A/D

1 page




MC3488A pdf
MC3488A
PACKAGE DIMENSIONS
SOIC−8 NB
D SUFFIX
PLASTIC PACKAGE
CASE 751−07
ISSUE AH
−X−
A
B
−Y−
−Z−
H
85
S 0.25 (0.010) M Y M
1
4
K
G
D
C
SEATING
PLANE
N X 45 _
0.10 (0.004)
M
0.25 (0.010) M Z Y S X S
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 4.80 5.00 0.189 0.197
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050
M 0_ 8_ 0_ 8_
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
ǒ ǓSCALE 6:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5

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