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PDF MC14556B Data sheet ( Hoja de datos )
| Número de pieza | MC14556B | |
| Descripción | (MC14555B / MC14556B) Dual Binary to 1-of-4 Decoder/Demultiplexer | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de MC14556B (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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MC14555B, MC14556B
Dual Binary to 1-of-4
Decoder/Demultiplexer
The MC14555B and MC14556B are constructed with
complementary MOS (CMOS) enhancement mode devices. Each
Decoder/Demultiplexer has two select inputs (A and B), an active low
Enable input (E), and four mutually exclusive outputs (Q0, Q1, Q2,
Q3). The MC14555B has the selected output go to the “high” state,
and the MC14556B has the selected output go to the “low” state.
Expanded decoding such as binary−to−hexadecimal (1−of−16), etc.,
can be achieved by using other MC14555B or MC14556B devices.
Applications include code conversion, address decoding, memory
selection control, and demultiplexing (using the Enable input as a data
input) in digital data transmission systems.
Features
• Diode Protection on All Inputs
• Active High or Active Low Outputs
• Expandable
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• All Outputs Buffered
• Capable of Driving Two Low−Power TTL Loads or One Low−Power
Schottky TTL Load Over the Rated Temperature Range
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (Voltages Referenced to VSS)
Parameter
Symbol
Value
Unit
DC Supply Voltage Range
VDD −0.5 to +18.0 V
Input or Output Voltage Range
(DC or Transient)
Vin, Vout − 0.5 to VDD
+ 0.5
V
Input or Output Current (DC or Transient) Iin, Iout ±10 mA
per Pin
Power Dissipation, per Package (Note 1)
PD
500 mW
Ambient Temperature Range
TA −55 to +125 °C
Storage Temperature Range
Tstg − 65 to +150 °C
Lead Temperature (8−Second Soldering)
TL
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Temperature Derating: “D/DW” Packages: –7.0 mW/°C From 65°C To 125°C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either VSS or VDD). Unused outputs must be left open.
http://onsemi.com
1
SOIC−16
D SUFFIX
CASE 751B
1
SOEIAJ−16
F SUFFIX
CASE 966
PIN ASSIGNMENTS
EA 1
AA 2
BA 3
Q0A 4
Q1A 5
Q2A 6
Q3A 7
VSS 8
16 VDD EA 1
15 EB
AA 2
14 AB
BA 3
13 BB Q0A 4
12 Q0B Q1A 5
11 Q1B Q2A 6
10 Q2B Q3A 7
9 Q3B VSS 8
16 VDD
15 EB
14 AB
13 BB
12 Q0B
11 Q1B
10 Q2B
9 Q3B
MC14555B
MC14556B
MARKING DIAGRAMS
16
1455xBG
AWLYWW
1
SOIC−16
16
MC1455xB
ALYWG
1
SOEIAJ−16
x = 5 or 6
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G = Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
July, 2014 − Rev. 11
1
Publication Order Number:
MC14555B/D
1 page  
MC14555B, MC14556B
PACKAGE DIMENSIONS
−A−
16
1
SOIC−16
CASE 751B−05
ISSUE K
9
−B− P 8 PL
8 0.25 (0.010) M B S
G
−T− SEATING
PLANE
K
C
D 16 PL
0.25 (0.010) M T B S A S
R X 45_
F
MJ
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC
0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
SOLDERING FOOTPRINT
8X
6.40
16X 1.12
1 16
16X
0.58
1.27
PITCH
89
DIMENSIONS: MILLIMETERS
http://onsemi.com
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| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet MC14556B.PDF ] | |
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