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PDF MRS1504T3 Data sheet ( Hoja de datos )
| Número de pieza | MRS1504T3 | |
| Descripción | Surface Mount Standard Recovery Power Rectifier | |
| Fabricantes | ON Semiconductor | |
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MRS1504T3
Surface Mount Standard
Recovery Power Rectifier
SMB Power Surface Mount Package
Features mesa epitaxial construction with glass passivation. Ideally
suited for high frequency switching power supplies; free wheeling
diodes and polarity protection diodes.
Features
• Compact Package with J−Bend Leads Ideal for Automated Handling
• Stable, High Temperature, Glass Passivated Junction
• Pb−Free Package is Available
Mechanical Characteristics:
• Case: Molded Epoxy
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Weight: 95 mg (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Maximum Temperature of 260°C / 10 Seconds for Soldering
• Polarity: Notch and/or Band in Plastic Body Indicates Cathode Lead
http://onsemi.com
STANDARD RECOVERY
RECTIFIER
1.5 AMPERES, 400 VOLTS
SMB
CASE 403A
PLASTIC
MARKING DIAGRAM
MAXIMUM RATINGS
www.DataSheet4U.com
Rating
Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(At Rated VR, TI = 118°C)
VRRM
VRWM
VR
IO
400
1.5
V
A
Peak Repetitive Forward Current
IFRM 3.0 A
(Rated VR, Square Wave, 20 kHz, TI = 118°C)
Non−Repetitive Peak Surge Current
(Surge applied at rated load conditions,
halfwave, single phase, 60 Hz)
IFSM 50 A
Storage/Operating Case Temperature Range Tstg, TC −55 to 150
Operating Temperature Range
TJ −55 to 150
°C
°C
THERMAL CHARACTERISTICS
Rating
Symbol Value Unit
Thermal Resistance, Junction−to−Lead
(Note 1)
Rtjl 18 °C/W
Thermal Resistance, Junction−to−Ambient
(on 1″ sq. Cu. PCB pattern)
Rtja
79 °C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Minimum pad size.
AYWW
RGG G
G
A = Assembly Location
Y = Year
WW = Work Week
RGG = Device Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
MRS1504T3
MRS1504T3G
SMB
SMB
(Pb−Free)
2500/Tape & Reel
2500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 4
1
Publication Order Number:
MRS1504T3/D
1 page | ||
| Páginas | Total 4 Páginas | |
| PDF Descargar | [ Datasheet MRS1504T3.PDF ] | |
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