|
|
PDF MCIMX31L Data sheet ( Hoja de datos )
| Número de pieza | MCIMX31L | |
| Descripción | Multimedia Applications Processors | |
| Fabricantes | Freescale Semiconductor | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de MCIMX31L (archivo pdf) en la parte inferior de esta página. Total 30 Páginas | ||
|
No Preview Available !
Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MCIMX31
Rev. 4.1, 11/2008
MCIMX31 and
MCIMX31L
MCIMX31 and
MCIMX31L
Multimedia Applications
Processors
Package Information
Plastic Package
Case 1581 14 x 14 mm, 0.5 mm Pitch
Case 1931 19 x 19 mm, 0.8 mm Pitch
Ordering Information
See Table 1 on page 3 for ordering information.
1 Introduction
The MCIMX31 and MCIMX31L multimedia
applications processors represent the next step in
low-power, high-performance application processors.
Unless otherwise specified, the material in this data sheet
is applicable to both the MCIMX31 and MCIMX31L
processors and referred to singularly throughout this
document as MCIMX31. The MCIMX31L does not
include a graphics processing unit (GPU).
Based on an ARM11™ microprocessor core, the
MCIMX31 provides the performance with low power
consumption required by modern digital devices such
as:
• Feature-rich cellular phones
• Portable media players and mobile gaming
machines
• Personal digital assistants (PDAs) and Wireless PDAs
• Portable DVD players
• Digital cameras
The MCIMX31 takes advantage of the ARM1136JF-S™
core running at up to 532 MHz, and is optimized for
Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering Information . . . . . . . . . . . . . . . . . . . . . 3
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional Description and Application
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
ARM11 Microprocessor Core . . . . . . . . . . . . . . 4
Module Inventory . . . . . . . . . . . . . . . . . . . . . . . 6
Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . 9
Electrical Characteristics . . . . . . . . . . . . . . . . 10
Chip-Level Conditions . . . . . . . . . . . . . . . . . . 10
Supply Power-Up/Power-Down Requirements
and Restrictions . . . . . . . . . . . . . . . . . . . . 18
Module-Level Electrical Specifications . . . . . . 21
Package Information and Pinout . . . . . . . . . 104
MAPBGA Production Package—
457 14 x 14 mm, 0.5 mm Pitch . . . . . . . . . . . 104
MAPBGA Production Package—
473 19 x 19 mm, 0.8 mm Pitch . . . . . . . . . . . 110
Ball Maps . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Product Differences . . . . . . . . . . . . . . . . . . . . 118
Product Documentation . . . . . . . . . . . . . . . . 119
Revision History . . . . . . . . . . . . . . . . . . . . . . . 120
This document contains information on a new product. Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2005–2008. All rights reserved.
1 page  
Functional Description and Application Information
• Instruction and data memory management units (MMUs), managed using micro TLB structures
backed by a unified main TLB
• Instruction and data L1 caches, including a non-blocking data cache with Hit-Under-Miss
• Virtually indexed/physically addressed L1 caches
• 64-bit interface to both L1 caches
• Write buffer (bypassable)
• High-speed Advanced Micro Bus Architecture (AMBA)™ L2 interface
• Vector Floating Point co-processor (VFP) for 3D graphics and other floating-point applications
hardware acceleration
• ETM™ and JTAG-based debug support
2.1.1 Memory System
The ARM1136JF-S complex includes 16 KB Instruction and 16 KB Data L1 caches. It connects to the
MCIMX31 L2 unified cache through 64-bit instruction (read-only), 64-bit data read/write (bi-directional),
and 64-bit data write interfaces.
The embedded 16K SRAM can be used for audio streaming data to avoid external memory accesses for
the low-power audio playback, for security, or for other applications. There is also a 32-KB ROM for
bootstrap code and other frequently-used code and data.
A ROM patch module provides the ability to patch the internal ROM. It can also initiate an external boot
by overriding the boot reset sequence by a jump to a configurable address.
Table 2 shows information about the MCIMX31 core in tabular form.
Table 2. MCIMX31 Core
Core
Core
Acronym Name
Brief Description
Integrated Memory
Includes
ARM11 or ARM1136
ARM1136 Platform
The ARM1136™ Platform consists of the ARM1136JF-S core, the ETM
real-time debug modules, a 6 x 5 multi-layer AHB crossbar switch (MAX), and
a Vector Floating Processor (VFP).
The MCIMX31 provides a high-performance ARM11 microprocessor core and
highly integrated system functions. The ARM Application Processor (AP) and
other subsystems address the needs of the personal, wireless, and portable
product market with integrated peripherals, advanced processor core, and
power management capabilities.
• 16 Kbyte Instruction
Cache
• 16 Kbyte Data
Cache
• 128 Kbyte L2 Cache
• 32 Kbyte ROM
• 16 Kbyte RAM
Freescale Semiconductor
MCIMX31/MCIMX31L Technical Data, Rev. 4.1
5
5 Page 
Electrical Characteristics
Table 6 provides the thermal resistance data for the 14 × 14 mm, 0.5 mm pitch package.
Table 6. Thermal Resistance Data—14 × 14 mm Package
Rating
Junction to Ambient (natural convection)
Junction to Ambient (natural convection)
Junction to Ambient (@200 ft/min)
Junction to Ambient (@200 ft/min)
Junction to Board
Junction to Case
Junction to Package Top (natural convection)
Board
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
—
—
—
Symbol
RθJA
RθJA
RθJMA
RθJMA
RθJB
RθJC
ΨJT
Value
56
30
46
26
17
10
2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
1, 2, 3
1, 3
1, 2, 3
1, 3
1, 4
1, 5
1, 6
NOTES
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of
other components on the board, and board thermal resistance.
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9
specification.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top
and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the
thermal characterization parameter is written as Psi-JT.
Table 7 provides the thermal resistance data for the 19 × 19 mm, 0.8 mm pitch package.
Table 7. Thermal Resistance Data—19 × 19 mm Package
Rating
Junction to Ambient (natural convection)
Junction to Ambient (natural convection)
Junction to Ambient (@200 ft/min)
Junction to Ambient (@200 ft/min)
Junction to Board
Junction to Case (Top)
Junction to Package Top (natural convection)
Board
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
—
—
—
Symbol
RθJA
RθJA
RθJMA
RθJMA
RθJB
RθJCtop
ΨJT
Value
46
29
38
25
19
10
2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 3
1, 4
1, 5
Freescale Semiconductor
MCIMX31/MCIMX31L Technical Data, Rev. 4.1
11
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet MCIMX31L.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| MCIMX31 | Multimedia Applications Processors | Freescale Semiconductor |
| MCIMX31C | Multimedia Applications Processors | Freescale Semiconductor |
| MCIMX31L | Multimedia Applications Processors | Freescale Semiconductor |
| MCIMX31LC | Multimedia Applications Processors | Freescale Semiconductor |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |