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PDF EM1402 Data sheet ( Hoja de datos )
| Número de pieza | EM1402 | |
| Descripción | 3 EMI FILTER/ 2 TVS ARRAY | |
| Fabricantes | Protek Devices | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de EM1402 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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EM1402
APPLICATIONS
✔ Cellular Phones
✔ Notebooks
✔ Personal Digital Assistant (PDA)
✔ Ground Positioning System (GPS)
✔ SIM Cards
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
FEATURES
✔ ESD Protection > 25 kilovolts
✔ Bidirectional EMI Filtering/TVS Low Pass Filters
✔ Low Insertion Loss: -3db Roll-Off @ 77/85 MHz
✔ Protects Up to Five(5) Data Lines
✔ RoHS Compliant
MECHANICAL CHARACTERISTICS
✔ 10 Bump Flip Chip Package
✔ Weight 0.73 milligrams (Approximate)
✔ Available in Lead-Free Plating
✔ Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
✔ Consult Factory for Leaded Device Availability
✔ Flammability Rating UL 94V-0
✔ 8mm Tape and Reel Per EIA Standard 481
PIN CONFIGURATION
3 EMI FILTER/ 2 TVS ARRAY
10 BUMP FLIP CHIP
R1 C1 A2 R2
A1 C2
CC
CC
GND
R1 C3 A4
A3
C4
CC
B1 B2
CC
R1 = 100 Ohms
R2 = 47 Ohms
05219.R1 2/07
1 www.protekdevices.com
1 page  
EM1402
APPLICATION INFORMATION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
270°C
REQUIREMENTS
Temperature:
TP for Lead-Free (SnAgCu): 260-270°C
TP for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
TP
TL
TSMAX
TSMIN
05219.R1 2/07
Ramp-up
155°
Ramp-down
TS - Preheat
140°
t 25°C to Peak
30-60 seconds
Ramp-up
Solder Time Ramp-down
15 seconds 15-20 seconds
5 www.protekdevices.com
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet EM1402.PDF ] | |
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