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부품번호 | P0408FCxxC 기능 |
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기능 | PFLIP CHIP ARRAY | ||
제조업체 | Protek Devices | ||
로고 | |||
APPLICATIONS
✔ Cellular Phones
✔ MCM Boards
✔ Wireless Communication Circuits
✔ IR LEDs
✔ SMART & PCMCIA Cards
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
FEATURES
✔ ESD Protection > 25 kilovolts
✔ Available in Voltages Ranging From 3.3V to 36V
✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔ Bidirectional Configuration & Monolithic Structure
✔ Protects 4 to 7 Lines
✔ RoHS Compliant
MECHANICAL CHARACTERISTICS
✔ Standard EIA Chip Size: 0408
✔ Weight 0.73 milligrams (Approximate)
✔ Available in Lead-Free Plating
✔ Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
✔ Consult Factory for Leaded Device Availability
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel
✔ Top Contacts: Solder Bump 0.004” in Height (Nominal)
PIN CONFIGURATION
P0408FC3.3C*
thru
P0408FC36C*
PFLIP CHIP ARRAY
0402 CHIP SHOWN
05156.R6 2/07
1 www.protekdevices.com
*U.S. Patent No. Des. “D456,367S”
APPLICATION INFORMATION
P0408FC3.3C*
thru
P0408FC36C*
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
270°C
REQUIREMENTS
Temperature:
TP for Lead-Free (SnAgCu): 260-270°C
TP for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
TP
TL
TSMAX
TSMIN
05156.R6 2/07
Ramp-up
155°
Ramp-down
TS - Preheat
140°
t 25°C to Peak
30-60 seconds
Ramp-up
Solder Time Ramp-down
15 seconds 15-20 seconds
4 www.protekdevices.com
*U.S. Patent No. Des. “D456,367S”
4페이지 | |||
구 성 | 총 6 페이지수 | ||
다운로드 | [ P0408FCxxC.PDF 데이터시트 ] |
당사 플랫폼은 키워드, 제품 이름 또는 부품 번호를 사용하여 검색할 수 있는 |
구매 문의 | 일반 IC 문의 : 샘플 및 소량 구매 ----------------------------------------------------------------------- IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한 광범위한 전력 반도체를 판매합니다. 전력 반도체 전문업체 상호 : 아이지 인터내셔날 사이트 방문 : [ 홈페이지 ] [ 블로그 1 ] [ 블로그 2 ] |
부품번호 | 상세설명 및 기능 | 제조사 |
P0408FCxxC | PFLIP CHIP ARRAY | Protek Devices |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |