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CSW0118-BD PDF 데이터시트 : 부품 기능 및 핀배열

부품번호 CSW0118-BD
기능 GaAs pHEMT MMIC SPDT Switch
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CSW0118-BD 데이터시트, 핀배열, 회로
0.5-18 GHz GaAs pHEMT MMIC
SPDT Switch
January 2007 - Rev 22-Jan-07
CSW0118-BD
Features
Broadband Coverage: 0.5 to 18.0 GHz
Insertion Loss: 1.8 dB Typ. @ 10 GHz
Isolation: 35 dB
P1dB: +20 dBm, Typical
Current Consumption: 50 µA, Typ. with
Control Voltage of -7.0V, 0.0V
2 nsec Rise/Fall Time
0.5 µm pHEMT Technology
Small Size: 670 x 590 x 76 µm
(26.4 x 23.2 x 3.0 mil)
Applications
Radar
Communications
Avionics
Test and Measurement
Description
The CSW0118-BD is a single-pole double-throw
www.DataSheet4U.com(SPDT) GaAs pHEMTMMIC switch that covers the frequen-
cy range from 0.5 to 18 GHz. The CSW0118-BD is 80%
smaller than comparable broadband FETswitch MMICs offer-
ing similar performance. It has very low power consumption
requirements and offers very fast switching speeds.
The 0.5 µm pHEMT GaAs process used for this device provides
for excellent uniformity and high manufacturing yields.
Chip Diagram
Backside via holes are used to provide low induc-
tance ground connections and to facilitate ease of use. Gold-
plated metallization in used on both front side and backside
metal.The MMIC is compatible with either eutectic or con-
ductive epoxy die attach and either thermocompression or
thermosonic wire bonding.Minimal off-chip components pro-
vides ease of use in design and manufacturing steps.
CSW0118-BD SPDTMMIC switches are shipped in
Gel Pack.
Specifications (TA = 25ºC,VDD = 0.0V)
Parameters
Units
Frequency Range
GHz
Vp (Vds = 3.0V, Id = 1 mA)
Volts
BVdg0 (100 µA/mm)
Volts
Idss (Vds = 3.0V)
mA/mm
Min
0.5
-1.5
16.0
RFSpecifications at Frequency (TA = 25ºC)
Parameters
@ 0.5 GHz
@ 2.0 GHz
Insertion Loss, dB
1.4 1.6
Isolation, dB
-40 -30
P-1dB, dBm
20.0 21.5
VSWR In/Out
2.5:1
1.5:1
Typ
-1.0
19.0
150
@ 10.0 GHz
1.8
-23
21.0
1.5:1
Max
18.0
-0.5
@ 18.0
2.7
-24
21.5
1.5:1
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 1 of 4
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.




CSW0118-BD pdf, 반도체, 판매, 대치품
0.5-18 GHz GaAs pHEMT MMIC
SPDT Switch
January 2007 - Rev 22-Jan-07
CSW0118-BD
Handling and Assembly Information
CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the
human body and the environment. For safety, observe the following procedures:
Do not ingest.
Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical
processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed.
Observe government laws and company regulations when discarding this product.This product must be
discarded in accordance with methods specified by applicable hazardous waste procedures.
Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support
devices or systems without the express written approval of the President and General Counsel of Mimix Broadband. As
used herein: (1) Life support devices or systems are devices or systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions
for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. (2) A critical
component is any component of a life support device or system whose failure to perform can be reasonably expected
to cause the failure of the life support device or system, or to affect its safety or effectiveness.
ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in anti-
static containers, which should be opened in cleanroom conditions at an appropriately grounded antistatic workstation.
Devices need careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers.
Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the back-
side to enable grounding to the circuit. Microstrip substrates should be brought as close to the die as possible.The
mounting surface should be clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die
Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy
sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total die
periphery. For additional information please see the Mimix "Epoxy Specifications for Bare Die" application note. If
eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.0012 thick, placed between the
die and the attachment surface should be used. A die bonder that utilizes a heated collet and provides scrubbing action
to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended.The gold-tin eutectic
(80% Au 20% Sn) has a melting point of approximately 280º C (Note: Gold Germanium should be avoided).The work
station temperature should be 310ºC +/- 10º C. Exposure to these extreme temperatures should be kept to minimum.
The collet should be heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force
impact are critical during placement.
Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to the
die's gold bond pads.The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99%
pure gold ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge
or ball bonds are acceptable for DC Bias connections. Aluminum wire should be avoided.Thermo-compression bonding
is recommended though thermosonic bonding may be used providing the ultrasonic content of the bond is minimized.
Bond force, time and ultrasonics are all critical parameters. Bonds should be made from the bond pads on the die to the
package or substrate. All bonds should be as short as possible.
Ordering Information
The CSW0118-BD is available in bare die and is shipped in Gel Pak.
Part Number for Ordering
Description
C SW 0118-B D
B are Die
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 4 of 4
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.

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CSW0118-BD

GaAs pHEMT MMIC SPDT Switch

Mimix Broadband
Mimix Broadband

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