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PDF PIP3119-P Data sheet ( Hoja de datos )
| Número de pieza | PIP3119-P | |
| Descripción | LOGIC LEVEL TOPFET | |
| Fabricantes | NXP Semiconductors | |
| Logotipo |  |
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Philips Semiconductors
Logic level TOPFET
Product specification
PIP3119-P
DESCRIPTION
Monolithic temperature and
overload protected logic level power
MOSFET in TOPFET2 technology
assembled in a 3 pin plastic
package.
APPLICATIONS
General purpose switch for driving
lamps
motors
solenoids
heaters
QUICK REFERENCE DATA
SYMBOL PARAMETER
VDS
ID
PD
Tj
RDS(ON)
Continuous drain source voltage
Continuous drain current
Total power dissipation
Continuous junction temperature
Drain-source on-state resistance
IISL
Input supply current
VIS = 5 V
FEATURES
www.DataSheet4U.com
TrenchMOS output stage
Current limiting
Overload protection
Overtemperature protection
Protection latched reset by input
5 V logic compatible input level
Control of output stage and
supply of overload protection
circuits derived from input
Low operating input current
permits direct drive by
micro-controller
ESD protection on all pins
Overvoltage clamping for turn
off of inductive loads
FUNCTIONAL BLOCK DIAGRAM
INPUT
O/V
CLAMP
RIG
LOGIC AND
PROTECTION
MAX.
50
20
90
150
28
650
UNIT
V
A
W
˚C
mΩ
µA
DRAIN
POWER
MOSFET
PINNING - SOT78B
PIN DESCRIPTION
1 input
2 drain
3 source
tab drain
SOURCE
Fig.1. Elements of the TOPFET.
PIN CONFIGURATION
mb mb
SYMBOL
D
TOPFET
I
P
12 3
Front view
MBL292
S
May 2001 1 Rev 1.000
1 page  
Philips Semiconductors
Logic level TOPFET
MECHANICAL DATA
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-leads
Product specification
PIP3119-P
SOT78B
D1
D
E
p1
∅p
q
mounting
base
(2)
A
A1
L1
L b1
L2
123
b(1)
ee
wM
Q
c
0 5 10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A1 b(1) b1
c
D D1 E
e
mm
4.5
4.1
1.39 0.85
1.27 0.60
1.3
1.0
0.7
0.4
15.8
15.2
6.4
5.9
10.3
9.7
2.54
Notes
1. The positional accuracy of the terminals is controlled within zone L1 max.
2. Mounting base configuration is not defined within the dimensions E and D
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
EIAJ
SOT78B
L
15.0
13.5
L1
3.30
2.79
L2
max.
3.0
∅ p p1 q Q w
3.8
3.6
4.3
4.1
3.0
2.7
2.6
2.2
0.4
EUROPEAN
PROJECTION
ISSUE DATE
01-02-22
Fig.2. SOT78B (TO220AB) package1, pin 2 connected to mounting base.
1 Refer to mounting instructions for SOT78 (TO220) envelopes. Epoxy meets UL94 V0 at 1/8". Net mass: 2 g
May 2001
5
Rev 1.000
5 Page | ||
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