|기능||Integrated Quad Half-Bridge and Triple High-Side|
전체 30 페이지
Integrated Quad Half-bridge and
Triple High Side with Embedded
MCU and LIN for High End
The 908E621 is an integrated single package solution that
includes a high performance HC08 microcontroller with a
SMARTMOS analog control IC. The HC08 includes flash memory, a
timer, enhanced serial communications interface (ESCI), a 10 bit
analog-to-digital converter (ADC), internal serial peripheral interface
(SPI), and an internal clock generator module (ICG). The analog
control die provides four half-bridge and three high side outputs with
diagnostic functions, a Hall effect sensor input, analog inputs, voltage
regulator, window watchdog, and local interconnect network (LIN)
The single package solution, together with LIN, provides optimal
application performance adjustments and space saving PCB design.
It is well-suited for the control of automotive high end mirrors.
• High performance M68HC908EY16 core
• 16 KB of on-chip flash memory, 512 B of RAM
• Two 16-bit, two-channel timers
• LIN physical layer interface
• Autonomous MCU watchdog / MCU supervision
• One analog input with switchable current source
• Four low RDS(ON) half-bridge outputs
• Three low RDS(ON) high side outputs
• Wake-up and 2 or 3-pin Hall effect sensor input
• 12 microcontroller I/Os
• Pb-free packaging designated by suffix codes EK
Document Number: MM908E621
Rev. 6.0, 4/2012
QUAD HALF-BRIDGE AND TRIPLE HIGH SIDE
SWITCH WITH EMBEDDED MCU AND LIN
(Add an R2 suffix for
Tape and reel orders)
-40 to 85°C 54 SOICW-EP
M 4 x Half-brideOutputs
High Side Output 1
High Side Output 2
High Side Output 3
Switched 5.0 V Output
Analog Input with Curet Source
Analog Input Current Source Trim
Two 3-pin Hall Sensor Input
Pull to GND for User Mode
Figure 1. 908E621 Simplified Application Diagram
Freescale Semiconductor, Inc. reserves the right to change the detail specifications,
as may be required, to permit improvements in the design of its products.
© Freescale Semiconductor, Inc., 2007-2012. All rights reserved.
Table 1. Pin Definitions (continued)
A functional description of each pin can be found in the Functional Pin Description section beginning on page 19.
ADC Supply and
MCU Power Supply
These pins are the power supply and voltage reference pins for the
analog-to-digital converter (ADC).
These pins are the ground and power supply pins, respectively. The
MCU operates from a single power supply.
Port A I/Os
These pins are special function, bidirectional I/O port pins that are
shared with other functional modules in the MCU.
For test purposes only. Do not connect in the application.
This pin is the bidirectional reset pin of the analog die.
This pin is the interrupt output pin of the analog die indicating errors or
This pin represents the single wire bus transmitter and receiver.
Analog Input Trim Pin This is the analog input trim pin for the A0 input. This is to connect a
known fixed resistor value to trim the current source measurement.
Analog Input Pin This pin is an analog input port with selectable source values.
Power Ground Pins These pins are device power ground connections.
Power Supply Pins
This device includes power MOSFETs configured as four half-bridge
driver outputs. These outputs may be configured for DC motor drivers,
or as high side and low side switches.
Note: The HB3 and HB4 have a lower RDS(ON) then HB1 and HB2.
These pins are device power supply pins.
These pins are not connected.
TESTMODE Input Pin for test purpose only. In application this pin needs to be tied GND.
High Side HS1 Output This output pin is a low RDS(ON) high side switch.
High Side HS2 Output These output pins are low RDS(ON) high side switches.
High Side HS3 Output
Hall-Effect Sensor /
This pin provides an input for a Hall-effect sensor or general purpose
This pin provides an high voltage input, which is wake-up capable.
This pin is a switchable VDD output for driving resistive loads requiring
a regulated 5.0 V supply; e.g. potentiometers.
Voltage Regulator The +5. V voltage regulator output pin is intended to supply the
Analog Integrated Circuit Device Data
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground, unless otherwise noted. Exceeding limits on any pin may cause permanent damage
to the device.
Operating Ambient Temperature(3)
Operating Junction Temperature(4)
Peak Package Reflow Temperature During Reflow(5), (6)
-40 to 85
-40 to 125
-40 to 150
3. The limiting factor is junction temperature; taking into account the power dissipation, thermal resistance, and heat sinking.
4. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150 °C under these conditions.
5. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
6. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data
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|다운로드||[ 908E621.PDF 데이터시트 ]||구매 문의||
일반 IC 문의 : 샘플 및 소량 구매
전력 반도체 판매 ( IGBT, TR 모듈, SCR, 다이오드 모듈 )
상호 : 아이지 인터내셔날
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|부품번호||상세설명 및 기능||제조사|
Integrated Quad Half-Bridge and Triple High-Side
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