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908E621 PDF 데이터시트 : 부품 기능 및 핀배열

부품번호 908E621
기능 Integrated Quad Half-Bridge and Triple High-Side
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908E621 데이터시트, 핀배열, 회로
Freescale Semiconductor
Technical Data
Integrated Quad Half-bridge and
Triple High Side with Embedded
MCU and LIN for High End
Mirror
The 908E621 is an integrated single package solution that
includes a high performance HC08 microcontroller with a
SMARTMOS analog control IC. The HC08 includes flash memory, a
timer, enhanced serial communications interface (ESCI), a 10 bit
analog-to-digital converter (ADC), internal serial peripheral interface
(SPI), and an internal clock generator module (ICG). The analog
control die provides four half-bridge and three high side outputs with
diagnostic functions, a Hall effect sensor input, analog inputs, voltage
regulator, window watchdog, and local interconnect network (LIN)
physical layer.
The single package solution, together with LIN, provides optimal
application performance adjustments and space saving PCB design.
It is well-suited for the control of automotive high end mirrors.
Features
• High performance M68HC908EY16 core
• 16 KB of on-chip flash memory, 512 B of RAM
• Two 16-bit, two-channel timers
• LIN physical layer interface
• Autonomous MCU watchdog / MCU supervision
• One analog input with switchable current source
• Four low RDS(ON) half-bridge outputs
• Three low RDS(ON) high side outputs
• Wake-up and 2 or 3-pin Hall effect sensor input
• 12 microcontroller I/Os
• Pb-free packaging designated by suffix codes EK
Document Number: MM908E621
Rev. 6.0, 4/2012
908E621
QUAD HALF-BRIDGE AND TRIPLE HIGH SIDE
SWITCH WITH EMBEDDED MCU AND LIN
EK (Pb-Free)
98ASA10712D
54-PIN SOICW-EP
ORDERING INFORMATION
Device
(Add an R2 suffix for
Tape and reel orders)
Temperature
Range (TA)
Package
MM908E621ACPEK
-40 to 85°C 54 SOICW-EP
100 nF
4.7 μF
μC PortA
μC PortB
μC PortC
μC PortD
μC PortE
Internally Connected
Internally Connected
LIN VSP1:8]
VDDA/VREFH
L0
EVDD
VDD
HB1
VSSA/VREFL
EVSS
VSS
908E621
HB2
HB3
RST A
RST
HB4
IRQ A
IRQ
HS1
PTA/KBD0
PTA1/KBD1
HS2
PTA2/KBD2
PTA3/KBD3
HS3
PTA4/KBD4
HVDD
PTB3/AD3
A0
PTB4/AD4
PTB5/AD5
A0CST
PTC2/MCLK
H0
PTC3/OSC2
PTC4/OSC1
TESTMODE
PTD0/TACH0
PTD1/TACH1
PTE1/RXD
EP
GND[1:4]
>22 μF
Wake-up Input
100 nF
M
M 4 x Half-brideOutputs
M
High Side Output 1
High Side Output 2
High Side Output 3
Switched 5.0 V Output
Analog Input with Curet Source
Analog Input Current Source Trim
Two 3-pin Hall Sensor Input
Pull to GND for User Mode
Figure 1. 908E621 Simplified Application Diagram
Freescale Semiconductor, Inc. reserves the right to change the detail specifications,
as may be required, to permit improvements in the design of its products.
© Freescale Semiconductor, Inc., 2007-2012. All rights reserved.




908E621 pdf, 반도체, 판매, 대치품
PIN CONNECTIONS
Table 1. Pin Definitions (continued)
A functional description of each pin can be found in the Functional Pin Description section beginning on page 19.
Die Pin
Pin Name
Formal Name
Definition
MCU
MCU
45
48
46
47
VSSA/VREFL
VDDA/VREFH
EVSS
EVDD
ADC Supply and
Reference Pins
MCU Power Supply
Pins
These pins are the power supply and voltage reference pins for the
analog-to-digital converter (ADC).
These pins are the ground and power supply pins, respectively. The
MCU operates from a single power supply.
MCU
MCU
49
50
52
53
54
51
PTA4/KBD4
PTA3/KBD3
PTA2/KBD2
PTA1/KBD1
PTA0/KBD0
FLSVPP
Port A I/Os
These pins are special function, bidirectional I/O port pins that are
shared with other functional modules in the MCU.
Test Pin
For test purposes only. Do not connect in the application.
Analog
Analog
11
12
RST_A
IRQ_A
Internal Reset
Internal Interrupt
Output
This pin is the bidirectional reset pin of the analog die.
This pin is the interrupt output pin of the analog die indicating errors or
wake-up events.
Analog
13
LIN
LIN Bus
This pin represents the single wire bus transmitter and receiver.
Analog
14
A0CST
Analog Input Trim Pin This is the analog input trim pin for the A0 input. This is to connect a
known fixed resistor value to trim the current source measurement.
Analog
Analog
Analog
Analog
Analog
15
16
19
25
30
29
26
20
17
18
21
27
28
31
32
35
22
23
24
A0
GND1
GND2
GND3
GND4
HB1
HB2
HB3
HB4
VSUP1
VSUP2
VSUP3
VSUP4
VSUP5
VSUP6
VSUP7
NC
NC
TESTMODE
Analog Input Pin This pin is an analog input port with selectable source values.
Power Ground Pins These pins are device power ground connections.
Half-bridge Outputs
Power Supply Pins
This device includes power MOSFETs configured as four half-bridge
driver outputs. These outputs may be configured for DC motor drivers,
or as high side and low side switches.
Note: The HB3 and HB4 have a lower RDS(ON) then HB1 and HB2.
These pins are device power supply pins.
No Connect
These pins are not connected.
TESTMODE Input Pin for test purpose only. In application this pin needs to be tied GND.
Analog
Analog
Analog
34
35
36
38
39
Analog
40
HS1a
HS1b
HS2
HS3
H0
L0
High Side HS1 Output This output pin is a low RDS(ON) high side switch.
High Side HS2 Output These output pins are low RDS(ON) high side switches.
High Side HS3 Output
Hall-Effect Sensor /
General Purpose
Input
Wake-up Input
This pin provides an input for a Hall-effect sensor or general purpose
input.
This pin provides an high voltage input, which is wake-up capable.
Analog
41
HVDD
Switchable VDD
Output
This pin is a switchable VDD output for driving resistive loads requiring
a regulated 5.0 V supply; e.g. potentiometers.
Analog
42
VDD
Voltage Regulator The +5. V voltage regulator output pin is intended to supply the
Output
embedded microcontroller.
908E621
4
Analog Integrated Circuit Device Data
Freescale Semiconductor

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908E621 전자부품, 판매, 대치품
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground, unless otherwise noted. Exceeding limits on any pin may cause permanent damage
to the device.
Rating
Symbol
Value
Unit
THERMAL RATINGS
Operating Ambient Temperature(3)
Operating Junction Temperature(4)
Storage Temperature
Peak Package Reflow Temperature During Reflow(5), (6)
TA
TJ
TSTG
TPPRT
-40 to 85
-40 to 125
-40 to 150
Note 6
°C
°C
°C
°C
Notes
3. The limiting factor is junction temperature; taking into account the power dissipation, thermal resistance, and heat sinking.
4. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150 °C under these conditions.
5. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
6. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data
Freescale Semiconductor
908E621
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