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부품번호 MPXV5050G 기능
기능 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned
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MPXV5050G 데이터시트, 핀배열, 회로
Freescale Semiconductor
Technical Data
MPX5050
Rev 9, 05/2007
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPX5050/MPXV5050G series piezoresistive transducer is a state-of-the-
art monolithic silicon pressure sensor designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This patented, single element transducer combines advanced
micromachining techniques, thin-film metallization, and bipolar processing to
provide an accurate, high level analog output signal that is proportional to the
applied pressure.
Features
• 2.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller-Based Systems
• Temperature Compensated Over –40° to +125°C
• Patented Silicon Shear Stress Strain Gauge
• Durable Epoxy Unibody Element
• Easy-to-Use Chip Carrier Option
ORDERING INFORMATION
www.DataSheet4U.com
Device
Type
Options
Case MPX Series Order
No. No.
SMALL OUTLINE PACKAGE (MPXV5050G SERIES)
Packing
Options
Device
Marking
Ported Side Port
Element Dual Port
1369 MPXV5050GP
1351 MPXV5050DP
Trays
Trays
MPXV5050G
MPXV5050G
Axial Port
482A MPXV5050GC6U
Trays MPXV5050G
482A MPXV5050GC6T1 Tape & Reel MPXV5050G
UNIBODY PACKAGE (MPX5050 SERIES)
Basic Differential
Element
867 MPX5050D
— MPX5050D
Ported Differential Dual 867C MPX5050DP
Element Ports
— MPX5050DP
Gauge
867B MPX5050GP
— MPX5050GP
UNIBODY PACKAGES
MPX5050
MPXV5050G
SERIES
INTEGRATED
PRESSURE SENSOR
0 to 50 kPa (0 to 7.25 psi)
0.2 to 4.7 V Output
SMALL OUTLINE PACKAGE
SURFACE MOUNT
MPXV5050GP
CASE 1369-01
MPXV5050DP
CASE 1351-01
MPXV5050GC6U
CASE 482A-01
SMALL OUTLINE PACKAGE
PIN NUMBERS(1)
1 N/C 5 N/C
2 VS 6 N/C
3 Gnd 7 N/C
4 Vout 8 N/C
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
UNIBODY PACKAGE PIN NUMBERS(1)
1 Vout 4 N/C
2 Gnd 5 N/C
3 VS 6 N/C
1. Pins 4, 5, and 6 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
MPX5050D
CASE 867-08
MPX5050GP
CASE 867B-04
© Freescale Semiconductor, Inc., 2007. All rights reserved.
MPX5050DP
CASE 867C-05




MPXV5050G pdf, 반도체, 판매, 대치품
Figure 3 illustrates the Differential/Gauge Sensing Chip in
Table 3. Mechanical Characteristics
Characteristics
Weight, Basic Element (Case 867)
Weight, Basic Element (Case 1369)
Weight, Basic Element (Case 482A)
Typ
1.8
3.376
Unit
grams
grams
grams
the basic chip carrier (Case 867). A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPX5050/MPXV5050G series pressure sensor
operating characteristics, and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media, other than dry air, may have adverse effects on
sensor performance and long-term reliability. Contact the
factory for information regarding media compatibility in your
application.
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0× to 85×C using the decoupling circuit shown in Figure 4.
The output will saturate outside of the specified pressure
range.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
5.0
4.5
Transfer Function:
Vout = VS*(0.018*P+0.04) ± ERROR
4.0 VS = 5.0 Vdc
3.5 TEMP = 0 to 85°C
3.0
2.5
MAX
2.0
1.5
1.0
0.5
MIN
0 0 5 10 15 20 25 30 35 40
Differential Pressure (kPa)
TYPICAL
45 50
55
Figure 2. Output versus Pressure Differential
Fluoro Silicone
Gel Die Coat
Wire Bond
Die
P1
Stainless Steel
Metal Cover
Epoxy
Plastic
Case
Lead Frame
Differential/Gauge Element
P2
Figure 3. Cross-Sectional Diagram
(not to scale)
Die
Bond
1.0 μF
+5 V
Vout
Vs
IPS
0.01 μF
GND
OUTPUT
470 pF
Figure 4. Recommended Power Supply Decoupling
and Output Filtering
(For additional output filtering, please refer to
Application Note AN1646.)
MPX5050
4
Sensors
Freescale Semiconductor

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MPXV5050G 전자부품, 판매, 대치품
PACKAGE DIMENSIONS
Sensors
Freescale Semiconductor
CASE 867B-04
ISSUE G
UNIBODY PACKAGE
PAGE 1 OF 2
MPX5050
7

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