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PDF CS5204-2 Data sheet ( Hoja de datos )
| Número de pieza | CS5204-2 | |
| Descripción | 1.5 V Fixed Linear Regulator | |
| Fabricantes | ON Semiconductor | |
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CS5204−2
4.0 A, 1.5 V Fixed Linear
Regulator
The CS5204−2 linear regulator provides 4.0 A @ 1.5 V with an
accuracy of ±2.0%.
The fast loop response and low dropout voltage make this regulator
ideal for GTL bus termination where low voltage operation and good
transient response are important.
The circuit is designed to operate with dropout voltages as low as 1.0 V
depending on the output current level. The maximum quiescent current is
only 10 mA at full load.
The regulator is fully protected against overload conditions with
protection circuitry for Safe Operating Area (SOA), overcurrent and
thermal shutdown.
The regulator is available in TO−220−3 and surface mount D2PAK−3
packages.
Features
• Output Current to 4.0 A
• Output Voltage Trimmed to ±2.0%
• Dropout Voltage (typical) 1.10 V @ 4.0 A
• Fast Transient Response
• Fault Protection Circuitry
www.DataSheet4U.com
− Thermal Shutdown
− Overcurrent Protection
− Safe Area Protection
VOUT
VIN
Thermal
Shutdown
Bandgap
Output
Current
Limit
− + Error
Amplifier
Figure 1. Block Diagram
GND
http://onsemi.com
12 3
TO−220−3
T SUFFIX
CASE 221A
Tab = VOUT
Pin 1. GND
2. VOUT
3. VIN
123
D2PAK−3
D2T SUFFIX
CASE 418AB
MARKING DIAGRAMS
TO−220−3
D2PAK−3
CS5204−2
AWLYWW
CS5204−2
AWLYWW
1
1
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2004
January, 2004 − Rev. 9
1
Publication Order Number:
CS5204−2/D
1 page  
CS5204−2
Calculating Power Dissipation and Heat Sink
Requirements
The CS5204−2 linear regulator includes thermal
shutdown and safe operating area circuitry to protect the
device. High power regulators such as these usually operate
at high junction temperatures so it is important to calculate
the power dissipation and junction temperatures accurately
to ensure that an adequate heat sink is used.
The case is connected to VOUT on the CS5204−2,
electrical isolation may be required for some applications.
Thermal compound should always be used with high current
regulators such as these.
The thermal characteristics of an IC depend on the
following four factors:
1. Maximum Ambient Temperature TA (°C)
2. Power dissipation PD (Watts)
3. Maximum junction temperature TJ (°C)
4. Thermal resistance junction to ambient RqJA (°C/W)
These four are related by the equation
TJ + TA ) PD RQJA
(1)
The maximum ambient temperature and the power
dissipation are determined by the design while the
maximum junction temperature and the thermal resistance
depend on the manufacturer and the package type.
The maximum power dissipation for a regulator is:
PD(max) + {VIN(max) * VOUT(min)}IOUT(max) ) VIN(max)IQ
(2)
where:
VIN(max) is the maximum input voltage,
VOUT(min) is the minimum output voltage,
IOUT(max) is the maximum output current, for the
application
IQ is the maximum quiescent current at IOUT(max).
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment has a thermal resistance. Like series
electrical resistances, these resistances are summed to
determine RqJA, the total thermal resistance between the
junction and the surrounding air.
1. Thermal Resistance of the junction to case, RqJC
(°C/W)
2. Thermal Resistance of the case to Heat Sink, RqCS
(°C/W)
3. Thermal Resistance of the Heat Sink to the ambient
air, RqSA (°C/W)
These are connected by the equation:
RQJA + RQJC ) RQCS ) RQSA
(3)
The value for RqJA is calculated using equation (3) and the
result can be substituted in equation (1).
RqJC is 1.6°C/Watt for the CS5204−2. For a high current
regulator such as the CS5204−2 the majority of the heat is
generated in the power transistor section. The value for RqSA
depends on the heat sink type, while RqCS depends on
factors such as package type, heat sink interface (is an
insulator and thermal grease used?), and the contact area
between the heat sink and the package. Once these
calculations are complete, the maximum permissible value
of RqJA can be calculated and the proper heat sink selected.
For further discussion on heat sink selection, see application
note “Thermal Management,” document number
AND8036/D, available through the Literature Distribution
Center or via our website at http://onsemi.com.
ORDERING INFORMATION
Orderable Part Number
Type
Package
Shipping†
CS5204−2GT3
4.0 A, 1.5 V Output
TO−220−3, STRAIGHT
50 Units / Rail
CS5204−2GDP3
4.0 A, 1.5 V Output
D2PAK−3
50 Units / Rail
CS5204−2GDPR3
4.0 A, 1.5 V Output
D2PAK−3
750 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet CS5204-2.PDF ] | |
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