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부품번호 | A3P060 기능 |
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기능 | (A3Pxxx) ProASIC3 Flash Family FPGAs | ||
제조업체 | Actel Corporation | ||
로고 | |||
전체 30 페이지수
www.DataSheet4U.com
ProASIC3 Flash Family FPGAs
Advanced v0.2
™
Features and Benefits
High Capacity
• 30 k to 1 Million System Gates
• Up to 144 kbits of True Dual-Port SRAM
• Up to 288 User I/Os
Reprogrammable Flash Technology
• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Process
• Live-At-Power-Up Level 0 Support
• Single-Chip Solution
• Retains Programmed Design When Powered Off
On-Chip User Nonvolatile Memory
• 1 kbit of FlashROM (FROM)
Performance
• 150+ MHz Internal System Performance with 3.3 V,
66 MHz 64-bit PCI (except A3P030)
• Up to 350 MHz External System Performance
In-System Programming (ISP) and Security
• Secure ISP Using On-Chip 128-Bit AES Decryption via
JTAG (IEEE1532-compliant) (except A3P030)
• FlashLock™ to Secure FPGA Contents
Low Power
• 1.5 V Core Voltage for Low Power
• Support for 1.5-V-Only Systems
• Low-Impedance Flash Switches
High-Performance Routing Hierarchy
• Segmented, Hierarchical Routing and Clock Structure
• Ultra-Fast Local and Long-Line Network
• Enhanced High-Speed, Very Long-Line Network
• High-Performance, Low-Skew Global Network
• Architecture Supports Ultra-High Utilization
Advanced I/O
• 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)
• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
• Bank-Selectable I/O Voltages – Up to 4 Banks per Chip
• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X (except
A3P030), and LVCMOS 2.5 V / 5.0 V Input
• Differential I/O Standards: LVPECL and LVDS (A3P250
and above)
• I/O Registers on Input, Output, and Enable Paths
• Hot-Swappable I/Os (A3P030 only)
• Programmable Output Slew Rate and Drive Strength
• Weak Pull-Up/Down
• IEEE1149.1 (JTAG) Boundary-Scan Test
• Pin-Compatible Packages Across the ProASIC3 Family
Clock Conditioning Circuit (CCC) and PLL
(except A3P030)
• Six CCC Blocks Total, One with an Integrated PLL
• Flexible Phase Shift, Multiply/Divide, and Delay
Capabilities
• Wide Input Frequency Range (1.5 MHz to 350 MHz)
SRAMs and FIFOs (except A3P030)
• Variable-Aspect Ratio 4,608-bit RAM Blocks (x1, x2, x4,
x9, x18 Organizations Available)
• True Dual-Port SRAM (except x18)
• 24 SRAM and FIFO Configurations with Synchronous
Operation up to 350 MHz
• Programmable Embedded FIFO Control Logic
Table 1 • ProASIC3 Product Family
System Gates
VersaTiles (D-Flip-Flops)
RAM kbits (1,024 bits)
4,608 Bit Blocks
FlashROM (FROM) Bits
Secure (AES) ISP
Integrated PLL in CCCs
VersaNet Globals1
I/O Banks
Maximum User I/Os
Package Pins
QFN
VQFP
TQFP
PQFP
FBGA
A3P030
30 k
768
–
–
1k
–
–
6
2
81
QN132
VQ100
A3P060
60 k
1,536
18
4
1k
Yes
1
18
2
96
VQ100
TQ144
FG144
A3P125
125 k
3,072
36
8
1k
Yes
1
18
2
133
A3P250
250 k
6,144
36
8
1k
Yes
1
18
4
157
A3P400
400 k
9,216
54
12
1k
Yes
1
18
4
194
A3P600
600 k
13,824
108
24
1k
Yes
1
18
4
227
A3P1000
1M
24,576
144
32
1k
Yes
1
18
4
288
VQ100
TQ144
PQ208
FG144
VQ100
PQ208
PQ208
PQ208
PQ208
FG144, FG256 FG144, FG256, FG144, FG256, FG144,
FG484
FG484
FG256, FG484
Notes:
1. Six chip (main) and three quadrant global networks are available for A3P060 and above.
2. For higher densities and support of additional features, refer to the ProASIC3E Flash FPGAs datasheet.
January 2005
© 2005 Actel Corporation
i
See Actel’s website for the latest version of the datasheet.
www.DataSheet4U.com
ProASIC3 Flash Family FPGAs
Table of Contents
Introduction and Overview
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Device Architecture
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Device Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-46
Software Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-47
Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-47
Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-47
ISP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-48
DC and Switching Characteristics
General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
User I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
VersaTile Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-41
Global Resource Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-45
Embedded SRAM and FIFO Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-50
Embedded FROM Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-59
JTAG 1532 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-60
Package Pin Assignments
132-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
100-Pin VQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
144-Pin TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6
208-Pin PQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-11
144-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-22
256-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-27
484-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-40
Datasheet Information
Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
International Traffic in Arms Regulations (ITAR) and Export Administration
Regulations (EAR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
iv Advanced v0.2
4페이지 www.DataSheet4U.com
Bank 0
ProASIC3 Flash Family FPGAs
CCC
RAM Block
4,608-Bit Dual-Port
SRAM or FIFO Block*
I/Os
VersaTile
ISP AES
Decryption*
User Nonvolatile
FlashROM (FROM)
Bank 1
Charge Pumps
Note: *Not supported by A3P030.
Figure 1-1 • ProASIC3 Device Architecture Overview with Two I/O Banks (A3P030, A3P060, A3P125)
Bank 0
CCC
RAM Block
4,608-Bit Dual-Port
SRAM or FIFO Block
I/Os
VersaTile
ISP AES
Decryption
User Nonvolatile
FlashROM (FROM)
Bank 2
Charge Pumps
RAM Block
4,608-Bit Dual-Port
SRAM or FIFO Block
(A3P600 and A3P1000)
Figure 1-2 • ProASIC3 Device Architecture Overview with Four I/O Banks (A3P250, A3P400, A3P600, and A3P1000)
Advanced v0.2
1-3
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부품번호 | 상세설명 및 기능 | 제조사 |
A3P060 | ProASIC3 Flash Family FPGAs | Microsemi |
A3P060 | (A3Pxxx) ProASIC3 Flash Family FPGAs | Actel Corporation |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |