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BD3941HFP 데이터시트 PDF




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광범위하게 사용되는 반도체 소자입니다.


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부품번호 BD3941HFP 기능
기능 LDO Regulator
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BD3941HFP 데이터시트, 핀배열, 회로
TECHNICAL NOTE
Power Management LSI Series for Automotive Body Control
High temperature
operating
LDO Regulator
Now available
BD3940FP, BD3941FP/HFP/T
zDescription
BD394FP Series regulators feature a high 36 V breakdown voltage and are compatible with onboard vehicle microcontrollers. They offer
an output current of 500 mA while limiting dark current to 30 µA (TYP). The series supports the use of ceramic capacitors as output phase
compensation capacitors. Since the ICs use P-channel DMOS output transistors, increased loads do not result in increased total supply
current. BD394FP Series is ideal for lowering current consumption and costs in battery direct-coupled systems.
zFeatures
1) Super-low dark current: 30 µA (Typ.)
2) Low-saturation voltage type P-channel DMOS output transistors
Output on resistance: 1.6 (Typ.)
3) High precision output voltage: 5 V ±2% (Ta = 25°C) / Iomax = 500 mA
4) Low-ESR ceramic capacitors can be used as output capacitors
5) Vcc power supply voltage = 36 V / Peak power supply voltage = 50 V (tr 1 ms, tH 200 ms)
6) Built-in over current protection circuit and thermal shutdown circuit
7) TO252-3/HRP-5/TO220FP-3 package
zApplications
Vehicle equipment, car stereos, satellite navigation systems, etc.
zProduct line
Model
Output voltage
BD3940FP
3.3 V
BD3941FP/HFP/T
5.0 V
zAbsolute maximum ratings (Ta = 25°C)
Parameter
Symbol
Limit
Unit
Power supply voltage
Vcc
36*1
V
Output current
Io 500 mA
1.2*2
Power dissipation
Pd
1.6*3
W
2.0*4
Operating temperature range
Topr
40 to +125
°C
Storage temperature range
Tstg
55 to +150
°C
Peak power supply voltage
Vcc Peak
50*5
V
Maximum junction temperature
Tjmax
150 °C
* 1Not to exceed Pd.
*2 For TO252-3, reduced by 9.6 mW/°C over 25°C, when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm).
*3 Reduced by 12.8 mW/°C over 25°C, when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm).
*4 For TO220FP-3, reduced by 16.0 mW/°C over 25°C.
*5 Application time 200 ms or shorter. (tr 1 ms)
Ver.B Oct2005




BD3941HFP pdf, 반도체, 판매, 대치품
zBlock diagram
Vcc
1
Cin
Vref
GND
Fin
OCP
OVP
TSD
2
N.C
Fig.13 TO252-3
Vcc
1
Cin
Vo
3
Co
GND
3
Fin
Vref
OCP
OVP
TSD
24
N.C N.C
.
Fig.14 HRP5
Cin : 0.33 µF to 1000 µF
Co : 0.1 µF to 1000 µF
Vcc
1
Cin
Vo
5
Co
GND
2
Vref
OCP
OVP
TSD
Vo
3
Co
Fig.15 TO220FP-3
zPin assignments
TO252-3
FIN
1 23
Fig.16
Pin No.
1
2
3
Fin
Pin No.
Vcc
N.C.
Vo
GND
Function
Power supply pin
NC pin
Voltage output pin
Ground pin
HRP5
FIN
1 2 345
Fig.17
Pin No.
1
2
3
4
5
Fin
Pin No.
Vcc
N.C.
GND
N.C.
Vo
GND
Function
Power supply pin
NC pin
Ground pin
NC pin
Voltage output pin
Ground pin
TO220FP-3
1 23
Fig.18
Pin No.
1
2
3
Pin No.
Vcc
GND
Vo
Function
Power supply pin
Ground pin
Voltage output pin
4/8

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BD3941HFP 전자부품, 판매, 대치품
9) Applications or inspection processes with modes where the potentials of the Vcc pin and other pins may be reversed from their normal
states may cause damage to the IC's internal circuitry or elements.
Use an output pin capacitance of 1,000 µF or lower in case Vcc is shorted with the GND pin while the external capacitor is charged. It is
recommended to insert a diode for preventing back current flow in series with Vcc or bypass diodes between Vcc and each pin.
Diode for preventing back current flow
Bypass diode
Vcc Pin
Fig. 23
10) Thermal shutdown circuit (TSD)
This IC incorporates a built-in thermal shutdown circuit for the protection from thermal destruction. The IC should be used within the
specified power dissipation range. However, in the event that the IC continues to be operated in excess of its power dissipation limits, the
attendant rise in the chip’s temperature Tj will trigger the thermal shutdown circuit to turn off all output power elements. The circuit will
automatically reset once the chip’s temperature Tj drops. Operation of the thermal shutdown circuit presumes that the IC’s absolute
maximum ratings have been exceeded. Application designs should never make use of the thermal shutdown circuit. (See Fig.8)
11) Overcurrent protection circuit (OCP)
The IC incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. This circuit serves to
protect the IC from damage when the load is shorted. The protection circuit is designed to limit current flow by not latching in the event of
a large and instantaneous current flow originating from a large capacitor or other component. However, while this protection circuit is
effective in preventing damage due to sudden and unexpected accidents, it is not compatible with continuous operation or use during
transitional periods. At the time of thermal designing, keep in mind that the current capability has negative characteristics to temperatures.
(See Fig. 3.)
12) Overvoltage protection circuit (OVP)
Overvoltage protection is designed to turn off all output when the voltage differential between the VCC and GND pins exceeds
approximately 30 V (typ.). Use caution when determining the power supply voltage range to use. (See Fig. 6)
zSelecting a model name when ordering
BD 3 9 4 1
ROHM model
name
Part number
3940: 3.3 V output
3941: 5.0 V output
FP
Packaging type
FP : TO252-3
HFP : HRP5
T : TO220FP-3
E2
Taping
E2 : Reel-wound embossed taping
TO252-3
<Dimension>
6.5±0.2
5.1+−00..21
FIN
C0.5
2.3±0.2
0.5±0.1
<Tape and Reel information>
Tape
Quantity
Embossed carrier tape
2000pcs
Direction
of feed
E2
(The direction is the 1pin of product is at the lower left when you hold
reel on the left hand and you pull out the tape on the right hand)
1 23
0.65 0.65
0.75
2.3±0.2 2.3±0.2
0.5±0.1
1.0±0.2
(Unit:mm)
xxxx
x x xx
xxxx
xxxx
x x xx
xxxx
Reel
1pin Direction of feed
7/8
When you order , please order in times the amount of package quantity.

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BD3941HFP

LDO Regulator

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