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WJ Communication에서 제조한 전자 부품 WJA1510은 전자 산업 및 응용 분야에서
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부품번호 WJA1510 기능
기능 5V Active-Bias InGaP HBT Gain Block
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WJA1510 데이터시트, 핀배열, 회로
WJA1510www.DataSheet4U.com
+5V Active-Bias InGaP HBT Gain Block
Product Features
50 – 1000 MHz
15 dB Gain
+20 dBm P1dB
+43 dBm OIP3
+5V Single Voltage Supply
Internal Active Bias Supply
Internally matched to 50 Ω
Lead-free / RoHS-compliant /
Green SOT-89 package
Applications
IF Amplifier
Repeaters, BTS Transceivers
VHF/UHF
Wireless Infrastructure
General Purpose
Product Description
Functional Diagram
The WJA1510 is a high performance amplifier that offers
high linearity in a low-cost surface-mount package. At 200
MHz, the WJA1510 typically provides 15 dB gain, +43
dBm OIP3, and +20 dBm P1dB. The device is housed in a
lead-free/green/RoHS-compliant SOT-89 industry-standard
SMT package using a NiPdAu plating to eliminate the
possibility of tin whiskering.
The WJA1510 consists of Darlington pair amplifiers using
a high reliability InGaP/GaAs HBT process technology.
The MMIC amplifier is internally matched to 50and only
requires DC-blocking capacitors and an inductive RF choke
for operation. Biased directly from a 5V supply, an internal
active bias network enables stable operation over
temperature, eliminating the need for the typical dropping
bias resistor.
GND
4
1
RF IN
2
GND
3
RF OUT
Function
Input
Output/Bias
Ground
Pin No.
1
3
2, 4
The amplifier is targeted for high performance IF applications
in existing and next generation wireless technologies. In
addition, the WJA1510 will work for various other
applications within the 50 to 1000 MHz frequency range.
.
Specifications
Parameter
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
Noise Figure
Device Voltage
Device Current
Units
MHz
MHz
dB
dB
dB
dBm
dBm
dB
V
mA
Min
50
Typ
200
14.6
13
16
+20
+43
4.5
5
97
Max
1000
1. Test conditions: 25 ºC, Supply Voltage = +5 V, 50 Ω System.
2. 3OIP measured with two tones at an output power of 0 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Typical Performance
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3 (2)
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
50
15.5
-13
-15
+20
+44.5
4.7
Typical
100 200
15 14.6
-13 -13
-16 -16
+20 +20
+44.5 +43
4.5 4.5
500
14.3
-12
-14
+20
+42
4.6
Absolute Maximum Rating
Ordering Information
Parameter
Operating Case Temperature
Storage Temperature
Rating
-40 to +85 °C
-55 to +150 °C
Part No.
WJA1510
WJA1510-PCB
Description
+5V Active Bias InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Package)
50 – 1000 MHz Fully Assembled Eval. Board
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com
Page 1 of 4 May 2007




WJA1510 pdf, 반도체, 판매, 대치품
WJA1510
+5V Active-Bias InGaP HBT Gain Block
Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The WJA1510 will be marked with an “A1510”
designator with an alphanumeric lot code
marked below the part designator.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating: Class 1C
Value:
Passes 1000V min.
Test:
Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Passes 1000V min.
Test:
Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated thru
diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com
Page 4 of 4 May 2007

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