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PDF 33797 Data sheet ( Hoja de datos )
| Número de pieza | 33797 | |
| Descripción | Four Channel Squib Driver IC | |
| Fabricantes | Freescale Semiconductor | |
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Advance Information
Four Channel Squib Driver IC
The Four Channel Squib Driver IC is a complete squib diagnostic
and deployment interface for use in automotive air bag modules.
Extensive diagnostics and system control features are incorporated
to provide fail-safe operation. The device contains a serial peripheral
interface (SPI) compatible 8-bit interface to allow microprocessor
control.
The device has the capability to be used in a standard four-channel
squib driver IC or in a cross-coupled state with the high- and low-side
squib drivers located on separate squib driver ICs. Both the high- and
low-side output drivers are protected against temporary shorts to
battery or ground. The current limit threshold is set by an external
resistor.
Features
• Four-Channel High-Side and Low-Side 2.0 A FET Switches
• Externally Adjustable FET Current Limiting
• Adjustable Current Limit Range: 0.8 A to 2.0 A
• Individual Channel Current Limit Detection with Timing Duration
Measurement, Communicated via SPI
• 8-Bit SPI for Diagnostics and FET Switch Activation
• Diagnostics for High-Side Safing Sensor Status
• Resistance and Voltage Diagnostics for Squibs
• Squib Driver IC Capability to Be Used for Cross-Coupled Driver
Firing Application (Allows High- and Low-Side FET Switches to Be
Located on Separate Squib Driver ICs)
• Pb-Free Packaging designated by Suffix Code EK
Figure 1.
Document Number: MC33797
Rev 3.0, 11/2006
33797
SQUIB DRIVER
EK SUFFIX (PB-FREE)
98ARH99137A
32-PIN SOICW
ORDERING INFORMATION
Device
MC33797EK/R2
MCZ33797EK/R2
Temperature
Range (TA)
-40°C to 85°C
Package
32 SOICW
33797
VPWR
VIN VBOOST1
VDIAG_1
TYPICAL
AIR BAG
FIRING
VFIRE_1A
POWER SUPPLY CAP VFIRE_1B
/4
SQB_HI
SENSE /4
SQUIB
(1A, 1B, 2A, 2B)
VBOOST2
VDIAG_2
SQB_LO /4
5.0 V
FIRING
CAP
VFIRE_2A
VFIRE_2B
/2
VFIRE_RTN
MICROPROCESSOR
ENABLE
ENABLE
VDD
CS
CLK
MISO
MOSI
RST
FEN_1
FEN_2
R_LIMIT_1
R_LIMIT_2
R_DIAG
GND
Figure 2. 33797 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
1 page  
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
Unit
INPUT ELECTRICAL RATINGS
Voltage on VDD
Voltage on Input pins CS, CLK, D1, D0, FEN_1, FEN_2, RESETB,
R_DIAG, R_LIMIT_X
Voltage on Squib pins SQB_HI_XX, SQB_LO_XX, SENSE_XX
Voltage on pins VDIAG_X, VFIRE_XX
ESD Voltage (1)
Human Body Model
Machine Model
Maximum VVFIRE with Pulsed Output (2), (3)
RSQUIB = 2.0 Ω, tON = 0.8 ms, ISQUIB = 2.24 A
RSQUIB = 1.2 Ω, tON = 0.8 ms, ISQUIB = 2.24 A
RSQUIB = 0.1 Ω, tON = 0.60 ms, ISQUIB = 2.24 A
VDD
VI
VVFIRE_XX
VDIAG_X
VESD1
VESD2
VFPULSE
7.0
-0.3 to VDD + 0.3
-0.3 to VVFIRE + 0.3
-0.3 to 35
±2000
±200
35
25
25
V
V
V
V
V
V
THERMAL RATINGS
Storage Temperature
TSTG
155 °C
Junction Temperature Ambient
Continuous (Prior to Squib Deployment)
t ≤ 5.0 ms (Post-Squib Deployment)
TA
TJCONT
TJDPYD
85 °C
100
300
Peak Package Reflow Temperature During Reflow (4), (5)
TPPRT
Note 5.
°C
Thermal Resistance (Junction-to-Ambient)
RθJ-A
74 °C/W
Notes
1 ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in
accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).
2 With a nominal squib load, the FET squib driver will not enter thermal shutdown until the driver has been active for a minimum of 2.1 ms.
The individual squib driver thermal shutdown will not affect other squib driver firing “ON” times. With a shorted squib load, the FET squib
driver will not enter thermal shutdown until the driver has been active for a minimum of 2.1 ms. When the thermal shutdown limit is
exceeded, the FET driver will turn OFF and the thermal status bit will be set to 1. The FET squib driver can be activated through the
arm/fire command when the TEMPRENABLE (MIN) is reached (thermal shutdown status “0”). Nominal squib load is 2.15 Ω ±0.15 Ω.
Shorted squib load is 0.1 Ω.
3 Three-squib driver with RSQUIB = 0.1 Ω conditions. Remaining squib driver conditions: RSQUIB = 1.2 Ω, tON = 4.0 ms, ISQUIB = 2.0 A,
VVDIAG_X = VVFIRE_XX = 35 V.
4 Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
5. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33797
5
5 Page 
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics (continued)
Characteristics noted under conditions 4.75 V ≤ VDD ≤ 5.25 V; 7.0 V ≤ VVFIRE_XX ≤ 35 V; VVDIAG_X = VVFIRE_XX; FEN 1 = FEN 2
= VDD; RR_LIMIT_X = 10 kΩ ±1%, RR_DIAG = 10 kΩ ±1%, -40°C ≤ TA ≤ +85°C, GND = 0 unless otherwise noted. Typical values
noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol Min Typ Max Unit
R_HS Short Threshold
RHSS
2.8
–
4.1 κΩ
VFIRE_XA & VFIRE_XB Current during High Side Safing Test at Open
Threshold
VFIRE_1A & VFIRE_1B or VFIRE_2A & VFIRE_2B
I1HSO
µA
270 360 410
VFIRE_XA & VFIRE_XB Current during High Side Safing Test at Short
Threshold
VFIRE_1A & VFIRE_1B or VFIRE_2A & VFIRE_2B
I1HSS
µA
287 385 436
HIGH-SIDE SAFING SENSOR DIAGNOSTICS WITH 1 SAFING SENSOR IN FIRING PATH CONNECTED TO VFIRE_1A AND VFIRE_2A
PINS (GUARANTEED BY DESIGN) ($C0 COMMAND)
Total VFIRE_XX Current during High Side Safing Test at Open Threshold
VFIRE_1A, VFIRE_1B, VFIRE_2A & VFIRE_2B pins
I2HSO
µA
574 705 835
Total VFIRE_XX Current during High Side Safing Test at Short Threshold
VFIRE_1A, VFIRE_1B, VFIRE_2A & VFIRE_2B pins
I2HSS
µA
605 748 892
R_HS Valid Resistor Range
15 V ≤ VVDIAG_X ≤ 35 V
R2HS
kΩ
1.99 – 2.93
R_HS Open Threshold
15 V ≤ VVDIAG_X ≤ 35 V
R2HSO
2.93
3.35
kΩ
4.43
R_HS Short Threshold
15 V ≤ VVDIAG_X ≤ 35 V
R2HSS
kΩ
1.41 1.61 1.99
R_LIMIT RESISTOR DIAGNOSTICS ($C8 COMMAND)
R_LIMIT Valid Resistor Range
R_LIMIT Open Threshold (“Out of Range Threshold”)
R_LIMIT Short-to-Ground Threshold (“Out of Range Threshold”)
Maximum External Capacitance to Ground
R_DIAG RESISTOR DIAGNOSTICS ($C8 COMMAND) (17)
RRL
RRLO
RRLS
CRL
4.32
60
3.0
–
– 45.3 kΩ
76 105 kΩ
3.5 4.31 kΩ
– 20 pF
R_DIAG Valid Resistor Range
RRD 8.0 – 13 kΩ
R_DIAG Open Threshold (“Out of Range Threshold”)
RRDO 13 23 60 kΩ
R_DIAG Short-to-Ground Threshold (“Out of Range Threshold”)
RRDS
3.0 5.4 8.0 kΩ
Maximum External Capacitance to Ground
CRD – – 20 pF
Notes
17 By changing the R_DIAG resistor value, the resistance thresholds can be varied by a linear relationship.The R_DIAG resistance could
be changed by ±10% to shift the thresholds by ±10%. Design goal for resistance threshold change is ±15%. R_DIAG threshold limit may
have to be changed to accommodate ±15% change. Example: Shifting the R_DIAG resistance value ±10%, the resistance threshold
will change by ±10%. Refer to Table 4.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33797
11
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet 33797.PDF ] | |
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