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PDF MCZ33661 Data sheet ( Hoja de datos )
| Número de pieza | MCZ33661 | |
| Descripción | Local Area Network (LIN) Enhanced Physical Interface | |
| Fabricantes | Freescale Semiconductor | |
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Advance Information
Document Number: MC33661
Rev. 6.0, 11/2006
Local Area Network (LIN)
Enhanced Physical Interface
with Selectable Slew Rate
33661
Local Interconnect Network (LIN) is a serial communication protocol
designed to support automotive networks in conjunction with Controller
Area Network (CAN). As the lowest level of a hierarchical network, LIN
enables cost-effective communication with sensors and actuators
when all the features of CAN are not required.
The 33661 is a Physical Layer component dedicated to automotive
LIN sub-bus applications. It offers slew rate selection for optimized
operation at 10 kbps and 20 kbps, fast baud rate (above 100 kbps) for
test and programming modes, excellent radiated emission
performance, and safe behavior in the event of LIN bus short-to-ground
or LIN bus leakage during low-power mode.
The 33661 is compatible with LIN Protocol Specification 2.0.
Features
• Operational from VSUP 6.0 V to 18 V DC, Functional up to 27 V DC,
and Handles 40 V During Load Dump
• Active Bus Waveshaping Offering Excellent Radiated Emission
Performance
• 5.0 kV ESD on LIN Bus Pin
• 30 kΩ Internal Pullup Resistor
• LIN Bus Short-to-Ground or High Leakage in Sleep Mode
• -18 V to +40 V DC Voltage at LIN Pin
• 8.0 µA in Sleep Mode
• Local and Remote Wake-Up Capability Reported by INH and
RXD Pins
• 5.0 V and 3.3 V Compatible Digital Inputs Without Any External
Components Required
• Pb-Free Packaging Designated by Suffix Code EF
LIN PHYSICAL INTERFACE
D SUFFIX
EF SUFFIX (PB-FREE)
98ASB42564B
8-PIN SOICN
ORDERING INFORMATION
Device
Temperature
Range (TA)
Package
MC33661D/R2
MCZ33661EF/R2
-40°C to 125°C
8 SOICN
VPWR
VDD
Regulator
12 V
5.0 V
MCU
33661
WAKE VSUP
INH
EN
RXD LIN
TXD GND
LIN Bus
Figure 1. 33661 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
1 page  
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics
Characteristics noted under conditions 7.0 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol Min Typ Max Unit
VSUP PIN (DEVICE POWER SUPPLY)
Supply Voltage
Nominal DC
Functional DC, TA ≥ 25°C
VSUP
7.0 13.5 18.0
6.0 —
—
V
Supply Current in Sleep Mode
VSUP ≤ 13.5 V, Recessive State
13.5 V < VSUP < 18 V
VSUP ≤ 13.5 V, Dominant State or Shorted to GND
µA
IS1 — 8.0 12
IS2 — — 200
IS3 — 300 —
Supply Current in Normal, Slow, or Fast Mode
mA
Bus Recessive, Excluding INH Output Current
IS(REC) — 4.0 6.0
Bus Dominant, Total Bus Load >500 Ω, Excluding INH Output Current
IS(DOM)
—
6.0
8.0
RXD OUTPUT PIN (LOGIC)
Low-Level Output Voltage
IIN ≤ 1.5 mA
VOL V
0 — 0.9
High-Level Output Voltage
VEN = 5.0 V, IOUT ≤ 250 µA
VEN = 3.3 V, IOUT ≤ 250 µA
VOH
V
4.25 — 5.25
3.0 — 3.5
TXD INPUT PIN (LOGIC)
Low-Level Input Voltage
High-Level Input Voltage
Input Threshold Voltage Hysteresis
Pullup Current Source
VEN = 5.0 V, 1.0 V < VTXD < 3.5 V
VIL — — 1.2 V
VIH 2.5 — — V
VINHYST 100 300 800 mV
IPU µA
-60 -35 -20
EN INPUT PIN (LOGIC)
Low-Level Input Voltage
High-Level Input Voltage
Input Voltage Threshold Hysteresis
Low-Level Input Current
VIN = 1.0 V
VIL — — 1.2 V
VIH 2.5 — — V
VINHYST 100 300 800 mV
IIL µA
5.0 20
30
High-Level Input Current
VIN = 4.0 V
IIH µA
— 20 40
Analog Integrated Circuit Device Data
Freescale Semiconductor
33661
5
5 Page 
ELECTRICAL CHARACTERISTICS
FUNCTIONAL DIAGRAMS
Wake-Up Frame
LIN 0.4 VSUP
t WUF
INH
EN
TXD
RXD (High Z)
tD_MS tD_COM
Figure 12. LIN Bus Wake-Up and
Slow Baud Rate Selection (1.0 kbps to 10 kbps)
EN EN = HIGH and TXD = HIGH
TXD
EN = LOW and TXD = HIGH
t1 (35 µs)
Toggle
EN
t2 (5.0 µs)
Reset to Previous Baud Rate
Figure 13. Fast Baud Rate Selection (Toggle Function)
EN
TXD
Device in Communication Mode
Preparation to Sleep Mode
t SD
Figure 14a
Sleep Mode
EN
INH Normal or Slow Mode
Preparation to Sleep Mode
t SD_INH
Figure 14b
Figure 14. Sleep Mode Enter
Sleep Mode
Analog Integrated Circuit Device Data
Freescale Semiconductor
33661
11
11 Page | ||
| Páginas | Total 21 Páginas | |
| PDF Descargar | [ Datasheet MCZ33661.PDF ] | |
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