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What is MCZ33793?

This electronic component, produced by the manufacturer "Freescale Semiconductor", performs the same function as "Distributed System Interface (DSI) Sensor Interface".


MCZ33793 Datasheet PDF - Freescale Semiconductor

Part Number MCZ33793
Description Distributed System Interface (DSI) Sensor Interface
Manufacturers Freescale Semiconductor 
Logo Freescale Semiconductor Logo 


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Technical Data
Distributed System Interface
(DSI) Sensor Interface
The 33793 is a slave Distributed System Interface (DSI) device
that is optimized as a sensor interface. The device contains circuits
to power sensors such as accelerometers and to digitize the analog
level from the sensor. The device is controlled by commands over the
DSI bus and returns measured data over the bus.
Features
• Conforms to DSI Specification Version 1
• 4-Channel, 8-Bit Analog-to-Digital Converter (ADC)
• 4 Pins Configurable as Analog or Logic Inputs or as Logic
Outputs
• Provides Regulated +5.0 V Output for Sensor Power from Bus
• Additional High-Drive Logic Output
• Undervoltage Fault Detection and Signaling
• On-Board Clock (No External Elements Required)
• Field-Programmable Address
• Default and Field-Programmable as a DSI Daisy Chain Device
• Recognizes Reverse Initialization for Open Bus Fault Tolerance
• Detects Short to Battery on Bus Switch and Prevents Its Closure
• Pb-Free Packaging Designated by Suffix Code EF
Document Number: MC33793
Rev 13.0, 11/2006
33793/A
DISTRIBUTED SYSTEM INTERFACE
SCALE 2:1
D SUFFIX
EF SUFFIX (Pb-FREE)
98ASB42566B
16-PIN SOICN
ORDERING INFORMATION
Device
MC33793D/R2
Temperature
Range (TJ)
Package
MCZ33793EF/R2 -40°C to 150°C
16 SOICN
MCZ33793AEF/R2
33790
GND
DSIO
X-Y
Accelerometer
Error
Test
X
Y
VCC
GND
33793
BUSIN
BUSRTN
I/O0
I/O1
I/O2
I/O3 BUSOUT
H_Cap
REGOUT
LOGOUT
AGND
Multiple
DSI Slaves
33793
BusIN
Figure 1. 33793 Simplified Application Diagram
Freescale Semiconductor, Inc. reserves the right to change the detail specifications, as
may be required, to permit improvements in the design of its products.
© Freescale Semiconductor, Inc., 2006. All rights reserved.

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MCZ33793 equivalent
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
I/O Pin Voltage
I/O Pin Current
BUSIN, BUSOUT, BUSRTN, and H_CAP Voltage
BUSIN, BUSOUT, BUSRTN, and H_CAP Current (Continuous)
ESD Protection (1)
Human Body Model
Machine Model
THERMAL RATINGS
VIO
IIO
VIN
IIN
VESD1
VESD2
-0.3 to VREGOUT + 0.5
5.0
-0.3 to 40
250
±2000
±200
V
mA
V
mA
V
Storage Temperature
TSTG
-55 to 150
°C
Operating Junction Temperature
Peak Package Reflow Temperature During Reflow (2), (3)
TJ
TPPRT
-40 to 150
Note 3.
°C
°C
Thermal Resistance Junction to Case
RθJC
150 °C/W
Notes
1. ESD1 performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ), ESD2 performed in accordance with the
Machine Model (CZAP = 200 pF, RZAP = 0 ).
2. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
3. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33793
5


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Part Details

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