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MCZ33887 데이터시트 PDF




Freescale Semiconductor에서 제조한 전자 부품 MCZ33887은 전자 산업 및 응용 분야에서
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부품번호 MCZ33887 기능
기능 5.0 A H-Bridge
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MCZ33887 데이터시트, 핀배열, 회로
www.DFaretaeSshceeatl4eUS.ceommiconductor
Technical Data
Document Number: MC33887
Rev. 12.0, 2/2007
5.0 A H-Bridge with Load
Current Feedback
The 33887 is a monolithic H-Bridge Power IC with a load current
feedback feature making it ideal for closed-loop DC motor control.
The IC incorporates internal control logic, charge pump, gate drive,
and low RDS(ON) MOSFET output circuitry. The 33887 is able to
control inductive loads with continuous DC load currents up to 5.0 A,
and with peak current active limiting between 5.2 A and 7.8 A. Output
loads can be pulse width modulated (PWM-ed) at frequencies up to
10 kHz. The load current feedback feature provides a proportional (1/
375th of the load current) constant-current output suitable for
monitoring by a microcontroller’s A/D input. This feature facilitates
the design of closed-loop torque/speed control as well as open load
detection.
A Fault Status output pin reports undervoltage, short circuit, and
overtemperature conditions. Two independent inputs provide polarity
control of two half-bridge totem-pole outputs. Two disable inputs
force the H-Bridge outputs to tri-state (exhibit high impedance).
The 33887 is parametrically specified over a temperature range of
-40°C TA 125°C and a voltage range of 5.0 V V+ 28 V.
Operation with voltages up to 40 V with derating of the specifications.
Features
• Fully specified operation 5.0 V to 28 V
• Limited operation with reduced performance up to 40 V
• 120 mRDS(ON) Typical H-Bridge MOSFETs
• TTL/CMOS Compatible Inputs
• PWM Frequencies up to 10 kHz
• Active Current Limiting (Regulation)
• Fault Status Reporting
• Sleep Mode with Current Draw 50 µA (Inputs Floating or Set
to Match Default Logic States)
• Pb-Free Packaging Designated by Suffix Codes VW and EK
33887
H-BRIDGE
DH SUFFIX
VW SUFFIX (Pb-FREE)
98ASH70273A
20-PIN HSOP
PNB SUFFIX
98ASA10583D
36-PIN PQFN
Bottom View
DWB SUFFIX
EK SUFFIX (Pb-FREE)
98ASA10506D
54-PIN SOICW-EP
ORDERING INFORMATION
Device
MC33887DH/R2
MC33887VW/R2
Temperature
Range (TA)
Package
20 HSOP
MC33887PNB/R2 -40°C to 125°C
36 PQFN
MC33887DWB/R2
MCZ33887EK/R2
54 SOICW-EP
6.0 V
MCU
IN
OUT
OUT
OUT
OUT
OUT
A/D
CCP
FS
EN
IN1
IN2
D1
D2
FB
33887
V+
OUT1
OUT2
PGND
AGND
V+
MOTOR
Figure 1. 33887 Simplified Application Diagram
Freescale Semiconductor, Inc. reserves the right to change the detail specifications,
as may be required, to permit improvements in the design of its products.
© Freescale Semiconductor, Inc., 2007. All rights reserved.




MCZ33887 pdf, 반도체, 판매, 대치품
PIN CONNECTIONS
Transparent Top View of Package
NC 1
D1 2
IN2 3
EN 4
V+ 5
V+ 6
NC 7
AGND 8
FS 9
NC 10
28 NC
27 D2
26 PGND
25 PGND
24 PGND
23 PGND
22 PGND
21 PGND
20 FB
19 NC
Figure 4. 33887 Pin Connections
Table 2. PQFN PIN DEFINITIONS
A functional description of each pin can be found in the Functional Pin DescriptionS section, page 21.
Pin
1, 7, 10, 16,
19, 28, 31
Pin Name
NC
Formal Name
No Connect
Definition
No internal connection to this pin.
2
D1
Disable 1
Active HIGH input used to simultaneously tri-state disable both H-Bridge
outputs. When D1 is Logic HIGH, both outputs are tri-stated.
3
IN2
Logic Input Control 2
Logic input control of OUT2 (i.e., IN2 logic HIGH = OUT2 HIGH).
4 EN
Enable
Logic input Enable control of device (i.e., EN logic HIGH = full operation,
EN logic LOW = Sleep Mode).
5, 6, 12, 13, 34, 35
V+
Positive Power Supply Positive supply connections.
8
AGND
Analog Ground
Low-current analog signal ground.
9 FS Fault Status for H-Bridge Open drain active LOW Fault Status output requiring a pull-up resistor to
5.0 V.
11
IN1
Logic Input Control 1
Logic input control of OUT1 (i.e., IN1 logic HIGH = OUT1 HIGH).
14, 15, 17, 18
OUT1
H-Bridge Output 1
Output 1 of H-Bridge.
20 FB Feedback for H-Bridge Current feedback output providing ground referenced 1/375th ratio of
H-Bridge high-side current.
21– 26
PGND
Power Ground
High-current power ground.
27 D2
Disable 2
Active LOW input used to simultaneously tri-state disable both H-Bridge
outputs. When D2 is Logic LOW, both outputs are tri-stated.
29, 30, 32, 33
OUT2
H-Bridge Output 2
Output 2 of H-Bridge.
36
CCP
Charge Pump Capacitor External reservoir capacitor connection for internal charge pump
capacitor.
Pad
Thermal
Exposed Pad Thermal Exposed pad thermal interface for sinking heat from the device.
Interface
Interface
Note: Must be DC-coupled to analog ground and power ground via very
low impedance path to prevent injection of spurious signals into IC
substrate.
33887
4
Analog Integrated Circuit Device Data
Freescale Semiconductor

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MCZ33887 전자부품, 판매, 대치품
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage (1)
Input Voltage (2)
FS Status Output (3)
Continuous Current (4)
DH Suffix HSOP ESD Voltage (5)
V+
VIN
V FS
IOUT
-0.3 to 40
-0.3 to 7.0
-0.3 to 7.0
5.0
V
V
V
A
V
Human Body Model
Each Pin to AGND
Each Pin to PGND
Each Pin to V+
Each I/O to All Other I/Os
Machine Model
VW Suffix HSOP, SOICW-EP, and PQFN ESD Voltage (5)
Human Body Model
Machine Model
THERMAL RATINGS
VESD1
VESD1
VESD1
VESD1
VESD2
VESD1
VESD2
±1000
±1500
±2000
±2000
±200
± 2000
± 200
V
Storage Temperature
Operating Temperature (6)
Ambient
Junction
Peak Package Reflow Temperature During Reflow (7), (8)
TSTG
TA
TJ
TPPRT
-65 to 150
-40 to 125
-40 to 150
Note 8.
°C
°C
°C
Notes
1 Performance at voltages greater than 28V is degraded.See Electrical Performance Curves on page 18 and 19 for typical performance.
Extended operation at higher voltages has not been fully characterized and may reduce the operational lifetime.
2 Exceeding the input voltage on IN1, IN2, EN, D1, or D2 may cause a malfunction or permanent damage to the device.
3 Exceeding the pull-up resistor voltage on the open Drain FS pin may cause permanent damage to the device.
4 Continuous current capability so long as junction temperature is 150°C.
5 ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ), ESD2 testing is performed in
accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 ).
6 The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking provided. Brief
nonrepetitive excursions of junction temperature above 150°C can be tolerated as long as duration does not exceed 30 seconds
maximum. (nonrepetitive events are defined as not occurring more than once in 24 hours.)
7 Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
8. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33887
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