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V048K015T090 데이터시트 PDF




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부품번호 V048K015T090 기능
기능 (V048x015T090) Voltage Transformation Module
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V048K015T090 데이터시트, 핀배열, 회로
www.DataSheet4U.com
VTM
V•I ChipTM – VTM
Voltage Transformation Module
V048K015T090
K indicates BGA configuration. For other
mounting options see Part Numbering below.
• 48 V to 1.5 V V•I Chip Converter
• 90 A (135 A for 1 ms)
• High density – 360 A/in3
• 125°C operation
• 1 µs transient response
• >3.5 million hours MTBF
Vf = 26 - 55 V
VOUT = 0.8 - 1.7 V
IOUT = 90 A
K = 1/32
ROUT = 1.2 mmax
©
• Small footprint – 84 A/in2
• Typical efficiency 93% at 1.5 V/50 A
• Low weight – 0.5 oz (14 g)
• No output filtering required
• Pick & Place / SMD
• BGA or J-Lead packages
Actual size
Product Description
Absolute Maximum Ratings
The V048K015T090 VI Chip Voltage Transformation
Module (VTM) breaks records for speed, density and
Parameter
Values
Unit
Notes
efficiency to meet the demands of advanced DSP,
FPGA, ASIC, processor cores and microprocessor
applications at the point of load (POL) while providing
+In to -In
+In to -In
-1.0 to 60.0
Vdc
100 Vdc For 100 ms
isolation from input to output. It achieves a response
PC to -In
-0.3 to 7.0
Vdc
time of less than 1 µs and delivers up to 90 A in a
TM to -In
-0.3 to 7.0
Vdc
volume of less than 0.25 in3 while providing low output
voltages with unprecedented efficiency. It may be
paralleled to deliver hundreds of amps at an output
voltage settable from 0.8 to 1.7 Vdc.
P R E L I M I N A RYThe VTM V048K015T090’s nominal output voltage is
1.5 Vdc from a 48 Vdc input factorized bus, Vf, and is
controllable from 0.8 to 1.7 Vdc at no load, and from
0.8 to 1.6 Vdc at full load, over a Vf input range of 26
to 55 Vdc. It can be operated either open- or closed-loop
depending on the output regulation needs of the
application. Operating open-loop, the output voltage
tracks its Vf input voltage with a transformation ratio,
K = 1/32, and an output resistance, ROUT = 1.0 milliohm, to
enable applications requiring a programmable low
output voltage at high current and high efficiency.
VC to -In
-0.3 to 19.0
Vdc
+Out to -Out
-0.1 to 4.0
Vdc
Isolation voltage
Operating junction temperature
2,250
-40 to 125
Vdc Input to Output
°C See Note
Output current
90 A Continuous
Peak output current
Case temperature during reflow
135
208
A For 1 ms
°C
Storage temperature
-40 to 150
°C
Output power
Peak output power
145 W Continuous
217 W For 1 ms
Note: The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
Closing the loop back to an input Pre-Regulation
Module (PRM) or DC-DC converter can compensate
for ROUT.
Part Numbering
The 1.5 V VTM achieves break-through current density
of 360 A/in3 in a VI Chip package compatible with
standard pick-and-place and surface mount assembly
processes. The VI Chip BGA package supports in-board
mounting with a low profile of 0.16" (4 mm) over the
board. A J-lead package option supports on-board
surface mounting with a profile of only 0.25" (6 mm)
over the board. The VTM’s fast dynamic response and
low noise eliminate the need for bulk capacitance at the
load, substantially increasing the POL density while
improving reliability and decreasing cost.
V 048
Voltage
Transformation
Module
Input Voltage
Designator
K
Configuration Options
A = On-board, elevated (Fig.16)
F = On-board (Fig.15)
K = In-board (Fig.14)
015 T 090
Output Voltage
Designator
(=VOUT x10)
Output Current
Designator
(=IOUT)
Product Grade Temperatures (°C)
Grade Storage Operating
T -40 to150 -40 to125
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Voltage Transformation Module V048K015T090 Rev. 1.0
Page 1 of 16




V048K015T090 pdf, 반도체, 판매, 대치품
Specifications, continued
PRELIMINARY
Figure 7— 0-90 A step load change with 100 µF input
capacitance and no output capacitance.
Figure 8— 90-0 A step load change with 100 µF input
capacitance and no output capacitance.
GENERAL
Parameter
MTBF
MIL-HDBK-217F
Isolation specifications
Voltage
Capacitance
Resistance
Agency approvals (pending)
Mechanical parameters
Weight
Dimensions
Length
Width
Height
Min Typ Max
3.5
2,250
10
2,500
cTÜVus
CE Mark
0.5 / 14.0
1.26 / 32
0.85 / 21.5
0.23 / 5.9
Unit
Mhrs
Vdc
pF
M
oz / g
in / mm
in / mm
in / mm
Note
25°C, GB
Input to Output
Input to Output
Input to Output
UL/CSA 60950, EN 60950
Low voltage directive
See mechanical drawing, Figs.10 and 12
Auxiliary Pins (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Primary Control (PC)
DC voltage
Module disable voltage
Module enable voltage
Current limit
Disable delay time
Temperature Monitor (TM)
27°C setting
Temperature coefficient
Full range accuracy
Current limit
VTM Control (VC)
External boost voltage
External boost duration
Min Typ Max Unit
4.8 5.0 5.2 Vdc
2.4 2.5
Vdc
2.5 2.6 Vdc
2.4 2.5 2.9 mA
4 10 µs
3.00
10
±5
100
Vdc
mV/°C
°C
µA
12.0 14.0 19.0
10
Vdc
ms
Note
Source only
PC low to Vout low
Operating junction temperature
Operating junction temperature
Source only
Required for VTM start up without PRM
Vin must be >26 V for VTM to remain operating
without boost voltage.
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Voltage Transformation Module V048K015T090 Rev. 1.0
Page 4 of 16

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V048K015T090 전자부품, 판매, 대치품
Mechanical Drawings
PRELIMINARY
SOLDER BALL
#A1 INDICATOR
21,5
0.85
1,00 18,00 1,00
0.039
0.709
0.039
5,9
0.23
(106) X
Ø
0.020
0.51
SOLDER
BALL
9,00
0.354
SOLDER BALL #A1
1,00 TYP
0.039
30,00
1.181
32,0 28,8
1.26
1.13
CL
16,0
0.63
15,00
0.591
TOP VIEW (COMPONENT SIDE)
1,6
0.06
CL
BOTTOM VIEW
1,00
0.039
3,9
0.15
15,6
0.62
SEATING PLANE
NOTES:
mm
1- DIMENSIONS ARE inch .
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
3- PRODUCT MARKING ON TOP SURFACE
Figure 10—VTM BGA mechanical outline; In-board mounting
IN-BOARD MOUNTING
BGA surface mounting requires a
cutout in the PCB in which to recess the V•I Chip
(
ø
0,51
0.020
)
SOLDER MASK
DEFINED PADS
0,50
0.020
1,50
0.059
(01.,00309)
ø
0,53
0.021
PLATED
VIA
CONNECT TO
INNER LAYERS
0,50
0.020
1,00
0.039
SOLDER PAD #A1
18,00
0.709
9,00
0.354
(2)
X
10,00
0.394
1,00
0.039
1
(4)
X
6,00
0.236
20,00
0.787 17,00
0.669
15,00
0.591
13,00
0.512
(106) X
ø
0,51
0.020
SOLDER MASK
DEFINED PAD
PCB CUTOUT
8,08
0.318
16,16
0.636
24,00
0.945
16,00
0.630
8,00
0.315
29,26
1.152
31
0,37
0.015
(4)
X
R
1,6
0.06
Figure 11— VTM BGA PCB land/VIA layout information; In-board mounting
1,00
0.039
(01.,00309)
RECOMMENDED LAND AND VIA PATTERN
(COMPONENT SIDE SHOWN)
NOTES:
mm
1- DIMENSIONS ARE inch .
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Voltage Transformation Module V048K015T090 Rev. 1.0
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부품번호상세설명 및 기능제조사
V048K015T090

(V048x015T090) Voltage Transformation Module

Vicor Corporation
Vicor Corporation

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