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V048K120T025 PDF 데이터시트 : 부품 기능 및 핀배열

부품번호 V048K120T025
기능 (V048x120x025) Voltage Transformation Module
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V048K120T025 데이터시트, 핀배열, 회로
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VTM
PRELIMINARY
V•I ChipTM – VTM
Voltage Transformation Module
• 48 V to 12 V V•I Chip Converter
• 25 A (37.5 A for 1 ms)
• High density – 1200 W/in3
• Small footprint – 280 W/in2
• Low weight – 0.5 oz (14 g)
• Pick & Place / SMD
• 125°C operation
• 1 µs transient response
• 3.5 million hours MTBF
• Typical efficiency 96%
• No output filtering required
• Surface mount BGA or J-Lead
packages
V048K120T025
K indicates BGA configuration. For other
mounting options see Part Numbering below.
©
Vf = 26 - 55 V
VOUT = 6.5 - 13.7 V
IOUT = 25 A
K = 1/4
ROUT = 13.9 mmax
Actual size
Product Description
The V048K120T025 V•I Chip Voltage Transformation
Module (VTM) breaks records for speed, density and
efficiency to meet the demands of advanced DSP, FPGA,
and ASIC at the point of load (POL) while providing
isolation from input to output. It achieves a response
time of less than 1 µs and delivers up to 25 A in a
volume of less than 0.25 in3 with unprecedented
efficiency. It may be paralleled to deliver hundreds of
amps at an output voltage settable from 6.5 to 13.7 Vdc.
The VTM V048K120T025’s nominal output voltage is
12 Vdc from a 48 Vdc input Factorized Bus, Vf, and is
controllable from 6.5 to 13.7 Vdc at no load, and from
6.5 to 13.4 Vdc at full load, over a Vf input range of
26 to 55 Vdc. It can be operated either open- or closed-
loop depending on the output regulation needs of the
application. Operating open-loop, the output voltage
tracks its Vf input voltage with a transformation ratio,
K = 1/4 , for applications requiring a programmable
output voltage at high current and high efficiency.
Closing the loop back to an input Pre-Regulation Module
(PRM) or DC-DC converter enables tight load regulation.
The 12 V VTM achieves break-through power density of
1200 W/in3 in a V•I Chip package compatible with
standard pick-and-place and surface mount assembly
processes. The V•I Chip BGA package supports in-board
mounting with a low profile of 0.16" (4 mm) over the
board.
A J-lead package option supports on-board surface
mounting with a profile of only 0.25" (6 mm) over the
board. The VTM’s fast dynamic response and low noise
eliminate the need for bulk capacitance at the load,
substantially increasing the POL density while improving
reliability and decreasing cost.
Absolute Maximum Ratings
Parameter
+In to -In
+In to -In
PC to -In
VC to -In
+Out to -Out
Isolation voltage
Output current
Peak output current
Output power
Peak output power
Case temperature
Operating junction temperature(1)
Values
-1.0 to 60
100
-0.3 to 7.0
-0.3 to 19.0
-0.1 to 30.0
2,250
25
37.5
300
450
208
-40 to 125
-55 to 125
Storage temperature
-40 to 150
-65 to 150
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
A
A
W
W
°C
°C
°C
°C
°C
Notes
For 100 ms
Input to Output
Continuous
For 1 ms
Continuous
For 1 ms
During reflow
T - Grade
M - Grade
T - Grade
M - Grade
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
Part Numbering
V 048
Voltage
Transformation
Module
Input Voltage
Designator
K
Configuration Options
F = On-board (Figure 15)
K = In-board (Figure 14)
120
Output Voltage
Designator
(=VOUT x10)
T
025
Output Current
Designator
(=IOUT)
Product Grade Temperatures (°C)
Grade Storage Operating
T -40 to150 -40 to125
M -65 to150 -55 to125
vicorpower.com 800-735-6200
V•I Chip Voltage Transformation Module
V048K120T025
Rev. 1.0
Page 1 of 16




V048K120T025 pdf, 반도체, 판매, 대치품
Electrical Specifications (continued)
PRELIMINARY
V•I Chip Voltage Transformation Module
Figure 7— 0-25 A step load change with 100 µF input capacitance and no
output capacitance.
Figure 8— 25-0 A step load change with 100 µF input capacitance and no
output capacitance.
General
Parameter
MTBF
MIL-HDBK-217F
Isolation specifications
Voltage
Capacitance
Resistance
Agency approvals (pending)
Mechanical parameters
Weight
Dimensions(BGA version)
Length
Width
Height
Min Typ Max
3.5
2,250
10
3,000
cTÜVus
CE Mark
0.5 / 14.0
1.26 / 32
0.85 / 21.5
0.23 / 5.9
Unit
Mhrs
Vdc
pF
M
oz / g
in / mm
in / mm
in / mm
Note
25°C, GB
Input to Output
Input to Output
Input to Output
UL/CSA 60950, EN 60950
Low voltage directive
See Mechanical Drawing, Figures 10 and 12
Auxiliary Pins (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Primary Control (PC)
DC voltage
Module disable voltage
Module enable voltage
Current limit
Disable delay time
VTM Control (VC)
External boost voltage
External boost duration
Min Typ Max Unit
4.8 5.0 5.2 Vdc
2.4 2.5
Vdc
2.5 2.6 Vdc
2.4 2.5 2.9 mA
4 10 µs
12.0 14.0 19.0
10
Vdc
ms
Note
VC voltage must be applied when module is enabled using PC
Source only
PC low to Vout low
Required for VTM start up without PRM
Vin > 26 Vdc. VC must be applied continuously
if Vin < 26 Vdc.
vicorpower.com 800-735-6200
V•I Chip Voltage Transformation Module
V048K120T025
Rev. 1.0
Page 4 of 16

4페이지










V048K120T025 전자부품, 판매, 대치품
Mechanical Drawings
PRELIMINARY
SOLDER BALL
#A1 INDICATOR
21,5
0.85
1,00 18,00 1,00
0.039
0.709
0.039
5,9
0.23
(106) X
Ø
0.020
0.51
SOLDER
BALL
9,00
0.354
SOLDER BALL #A1
1,00 TYP
0.039
30,00
1.181
32,0 28,8
1.26
1.13
CL
16,0
0.63
15,00
0.591
TOP VIEW (COMPONENT SIDE)
1,6
0.06
CL
BOTTOM VIEW
1,00
0.039
3,9
0.15
15,6
0.62
SEATING PLANE
Figure 10— V T M BGA mechanical outline; Inboard mounting
NOTES:
mm
1- DIMENSIONS ARE inch .
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
3- PRODUCT MARKING ON TOP SURFACE
IN-BOARD MOUNTING
BGA surface mounting requires a
cutout in the PCB in which to recess the V•I Chip
(
ø
0,51
0.020
)
SOLDER MASK
DEFINED PADS
0,50
0.020
1,50
0.059
(01.,00309)
ø
0,53
0.021
PLATED
VIA
CONNECT TO
INNER LAYERS
0,50
0.020
1,00
0.039
SOLDER PAD #A1
18,00
0.709
9,00
0.354
(2)
X
10,00
0.394
1,00
0.039
1
(4)
X
6,00
0.236
20,00
0.787 17,00
0.669
15,00
0.591
13,00
0.512
(106) X
ø
0,51
0.020
SOLDER MASK
DEFINED PAD
PCB CUTOUT
8,08
0.318
16,16
0.636
24,00
0.945
16,00
0.630
8,00
0.315
29,26
1.152
31
0,37
0.015
(4)
X
R
1,6
0.06
Figure 11— VTM BGA PCB land/VIA layout information; Inboard mounting
1,00
0.039
(01.,00309)
RECOMMENDED LAND AND VIA PATTERN
(COMPONENT SIDE SHOWN)
NOTES:
mm
1- DIMENSIONS ARE inch .
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
vicorpower.com 800-735-6200
V•I Chip Voltage Transformation Module
V048K120T025
Rev. 1.0
Page 7 of 16

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부품번호상세설명 및 기능제조사
V048K120T025

(V048x120x025) Voltage Transformation Module

Vicor Corporation
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