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PDF MPXV7007G Data sheet ( Hoja de datos )
| Número de pieza | MPXV7007G | |
| Descripción | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned | |
| Fabricantes | Freescale Semiconductor | |
| Logotipo |  |
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Technical Data
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPXV7007G series piezoresistive transducers are state-of-the-art
monolithic silicon pressure sensors designed for a wide range of applications, but
particularly those employing a microcontroller or microprocessor with A/D inputs.
This transducer combines advanced micromachining techniques, thin-film
metallization, and bipolar processing to provide an accurate, high level analog
output signal that is proportional to the applied pressure.
Features
• 5.0% Maximum Error over 0° to 85°C
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Thermoplastic (PPS) Surface Mount Package
• Temperature Compensated over –40° to +125°C
• Patented Silicon Shear Stress Strain Gauge
• Available in Differential and Gauge Configurations
Typical Applications
• Hospital Beds
• HVAC
• Respiratory Systems
• Process Control
ORDERING INFORMATION
Device
Type
Options
Case
No.
MPX Series Packing Device
Order No. Options Marking
SMALL OUTLINE PACKAGE (MPXV7007G SERIES)
Ported Gauge, Axial Port, SMT
Elements
Gauge, Axial Port, SMT
482A
482A
MPXV7007GC6U Rails MPXV7007G
MPXV7007GC6T1 Tape & MPXV7007G
Reel
Gauge, Side Port, SMT 1369 MPXV7007GP
Trays MPXV7007G
Gauge, Dual Port, SMT 1351 MPXV7007DP
Trays MPXV7007G
VS
MPXV7007G
Rev 0, 05/2005
MPXV7007G
SERIES
INTEGRATED
PRESSURE SENSOR
-7 to 7 kPa (-1 to 1 psi)
0.5 to 4.5 V OUTPUT
SMALL OUTLINE PACKAGE
MPXV7007GC6U
CASE 482A-01
MPXV7007GP
CASE 1369-01
MPXV7007DP
CASE 1351-01
SMALL OUTLINE PACKAGE
PIN NUMBERS(1)
1 N/C 5 N/C
2 VS 6 N/C
3 Gnd 7 N/C
4 Vout 8 N/C
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
Sensing
Element
Thin Film
Temperature
Compensation
and
Gain Stage #1
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Vout
Pins 1 and 5 through 8 are NO CONNECTS
for surface mount package
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
© Freescale Semiconductor, Inc., 2005. All rights reserved.
1 page  
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The MPX pressure
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Part Number
MPXV7007GC6U/C6T1
MPXV7007GP
MPXV7007DP
Case Type
482A
1369
1351
Pressure (P1)
Side Identifier
Side with Port Attached
Side with Port Attached
Side with Part Marking
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
correct footprint, the packages will self align when subjected
design. The footprint for the surface mount packages must
be the correct size to ensure proper solder connection
to a solder reflow process. It is always recommended to
design boards with a solder mask layer to avoid bridging and
interface between the board and the package. With the
shorting between solder pads.
0.660
16.76
0.100 TYP 8X
2.54
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm SCALE 2:1
Figure 5. Small Outline Package Footprint
Sensors
Freescale Semiconductor
MPXV7007G
5
5 Page 
NOTES
Sensors
Freescale Semiconductor
MPXV7007G
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet MPXV7007G.PDF ] | |
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