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PDF HKT100Y01U Data sheet ( Hoja de datos )
| Número de pieza | HKT100Y01U | |
| Descripción | Chip | |
| Fabricantes | Renesas Technology | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de HKT100Y01U (archivo pdf) en la parte inferior de esta página. Total 14 Páginas | ||
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HKT100***U/HKT100Y01U
µ-Chip (RFID)
Overview
• HKT100***U/HKT100Y01U is RFID (Radio Frequency Identification) for 2.45 GHz.
• It has a unique ID inside, then it is applicable for management of individual object.
Note: "***" or "Y01" is a ROM code.
REJ03P0006-0101
Rev.1.01
Feb 23, 2007
Feature
• Thin and small package: URP (PTSP0002ZA-A)
• Including unique µ-Chip ID which is not alterable
• Communication without contact
Note: "µ-Chip" and the µ-Chip Logo are either registered Trademarks or Trademarks of Hitachi,Ltd. in Japan and in
other countries.
Rev.1.01 Feb 23, 2007 page 1 of 13
1 page  
www.DHaKtaTS1h0e0e*t*4*U/.HcoKmT100Y01U
Dimension of Inlet Outline
Cathode mark
Type No.
1.25 ± 0.15
1.7 ± 0.15
2.5 ± 0.15
Unit: mm
0.3 ± 0.15
0.9 ± 0.15
0 to 0.10
Note: Cathode mark indicates GND side.
Rev.1.01 Feb 23, 2007 page 5 of 13
5 Page 
www.DHaKtaTS1h0e0e*t*4*U/.HcoKmT100Y01U
Precautions for Storage, Transportation and Measuring
Note: These notes indicate a general item.
Please give priority to the notation in each C.S with Various kinds of notes originating in a product.
1. Other Precaution Involve Problems Occurring During Storage, Transportation and Measurement.
Although the general precautions for storage and transportation of electronic components can be applied as they are to
semiconductor devices, the latter require certain special precautions in addition to these. The following account
includes the general precautions.
1.1 Storage of Semiconductor Devices
The following methods of storage are advisable for semiconductor devices. If the precautions are not observed, faults
in electrical characteristics, solderability, external appearance and other attributes may occur. In some cases, failure
may also result. Precautions for storage are as follows,
(1) The storage location should be kept within the optimum ranges of temperature and humidity: 5 to 35°C and 45 to
75% R.H. are the optimal conditions.
(2) The atmosphere in the storage location should not contain any noxious gases, and the amount of dust should be
minimal.
(3) Storage containers should not be susceptible to static electricity.
(4) Semiconductor devices should not be subjected to loads.
(5) When strong for long periods, store in the non-processed state. When leads have already been formed, corrosion at
their bent portion of leads may occur.
(6) Be sure that sudden temperature changes sufficient to cause condensation do not occur during storage of the devices.
1.2 Precautions for Transportation
When transporting semiconductor devices or their assembly units or subsystems, the same precautions as for other
electronic components should be taken. The items listed in 1.1 and 1.2 have to be followed.
(1) Transportation containers, jigs etc., should not pick up static charge due to vibration en route.
(2) Persons handling semiconductor devices should be grounded via a high resistance to discharge any static electricity
that may be adhering to their clothing. The resistance value should be around 1 Mٶ and no other person should
come between the person being discharged and ground (GND).
(3) When transporting semiconductor devices and PCBs, try to keep mechanical vibration and shocks to an absolute
minimum.
Rev.1.01 Feb 23, 2007 page 11 of 13
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet HKT100Y01U.PDF ] | |
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