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PDF BU2098F Data sheet ( Hoja de datos )
| Número de pieza | BU2098F | |
| Descripción | 2-input I2C-bus Serial in/Parallel out Drivers | |
| Fabricantes | ROHM Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de BU2098F (archivo pdf) en la parte inferior de esta página. Total 18 Páginas | ||
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Datasheet
Serial-in / Parallel-out Driver Series
2-input I2C-bus
Serial in/Parallel out Drivers
BU2098F
Description
BU2098F is an open drain output driver.It incorporates a
built-in shift register and a latch circuit to control a
maximum of 8 outputs by a 2-line interface, linked to a
microcontroller.
An open drain output provides maximum 25mA current.
Key Specifications
Power supply voltage range:
Output voltage:
Operating temperature range:
2.7V to 5.5V
0V to 15V
-40℃ to +85℃
Features
LED can be driven directly
8 Bit parallel output
This product can be operated on low voltage
Compatible with I2C-bus
*I2C-bus is a trademark of NXP Semiconductors.
Package
SOP16
W(Typ) x D(Typ) x H(Max)
10.00mm x 6.20mm x 1.71mm
Applications
Drive of LED
Drive of Solenoid
Drive of Relay
Pin Configurations
(Top View)
A0 1
A1 2
A2 3
Q0 4
Q1 5
Q2 6
Q3 7
VSS 8
16 VDD
15 SDA
14 SCL
13 N.C.
12 Q7
11 Q6
10 Q5
9 Q4
Block Diagrams
Power-On
Reset
SDA
SCL
A0
A1
A2
I2C-bus
Controller
Shift
Register
8bit
Latch
Write Buffer
Q0～Q7
○Product structure：Silicon monolithic integrated circuit
.www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
○This product has no designed protection against radioactive rays
1/14
TSZ02201-0RHR1GZ00100-1-2
01.Sep.2015 Rev.002
1 page  
BU2098F
Test Circuit - continued
VDD
IDD+ A
VDD
8 IO+Z A
SW
PatternGenerator
1
VSS
Figure 5. Test Circuit of Output Leak Current / Static Dissipation Current
VDD
RL =10kΩ
+15V
RL RL RL RL
PatternGenerator
VDD
VSS
RL RL RL RL VSS
Figure 6. Test Circuit of Timing Characteristics
.www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
5/14
TSZ02201-0RHR1GZ00100-1-2
01.Sep.2015 Rev.002
5 Page 
BU2098F
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the PD rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
.www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11/14
TSZ02201-0RHR1GZ00100-1-2
01.Sep.2015 Rev.002
11 Page | ||
| Páginas | Total 18 Páginas | |
| PDF Descargar | [ Datasheet BU2098F.PDF ] | |
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