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PDF ILX137K Data sheet ( Hoja de datos )
| Número de pieza | ILX137K | |
| Descripción | 10700-pixel x 6-line CCD Linear Sensor | |
| Fabricantes | Sony | |
| Logotipo |  |
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ILX137K
10700-pixel × 6-line CCD Linear Sensor (Color)
Description
The ILX137K is a reduction type CCD linear sensor
developed for color image scanner. This sensor
reads A4-size documents at a density of pseudo
2400DPI.
24 pin DIP (Plastic)
Features
• Number of effective pixels:
64200 pixels (10700 pixels × 6)
• Pixel size: 2.4µm × 4µm (4µm pitch)
• Distance between line:
2 lines between the same color (8µm)
16 lines between different colors (64µm)
• On-chip microlens
Cylindrical lens (width 6µm)
• Single-sided readout
• Supply voltage: Single 12V power supply
• Input clock pulse: CMOS 5V drive
• Number of output: 3 (R, G, B)
• Package:
24-pin Plastic-DIP
Absolute Maximum Ratings
• Supply voltage
VDD
• Input clock voltage
• Operating temperature
• Storage temperature
15
7
–10 to +60
–30 to +80
V
V
°C
°C
Pin Configuration (Top View)
φ2 1
φ1L' 2
φ4 3
GND 4
VOUT-R 5
VOUT-G 6
NC 7
NC 8
GND 9
φROG-B 10
φROG-R 11
NC 12
24 φ1
23 φ2L
22 φ3
21 φRS
20 VDD
19 VOUT-B
18 NC
17 NC
16 φ1
15 φ2
14 φROG-G
13 VDD
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E01651-PS
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ILX137K
5. Specifies at the minimum value of the saturation output voltage.
6. SEmin is the exposure at the minimum value (1V) of the saturation output voltage.
7. Saturation exposure is defined as in the following figure for each color.
SE = VSAT/R
8. For each color, Main Line is defined by the difference between the average value of D2 to D64 dummy
signal during no incident light and of D66 to D82, S1 to S700. Sub Line is defined by the difference
between the average value of D2' to D64' dummy signal during no incident light and of D66' to D82', S1' to
S10700'. Optical signal integration time τ int stands at 20ms.
9. For each color, calculate the difference as follows; the maximum and minimum values of the dark output
voltage of respective Main Line and Sub Line; the dark voltage average value of respective Main Line and
Sub Line. Then, the highest value is defined as dark signal nonuniformity. Optical signal integration time τ int
stands at 20ms.
10. VOUT = 500mV (Typ.)
11. Vos is defined as the output DC value when φRS is high.
12. For each color, the Main Line offset level of the optical black pixel is defined as Vos-main, the Sub Line
offset level, Vos-sub. Then, the offset level difference is defined as indicated below.
∆Vos = | Vos-main – Vos-sub |
∆Vos
–5–
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ILX137K
Notes of Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the
following protective measures.
a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive
shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.
2) Notes on Handling CCD Packages
The following points should be observed when handling and installing packages.
a) Remain within the following limits when applying static load to the package:
(1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter
of the glass portion.)
(2) Shearing strength: 29N/surface
(3) Tensile strength: 29N/surface
(4) Torsional strength: 0.9Nm
Cover glass
Plastic portion
39N
29N
29N
0.9Nm
Ceramic portion
(1)
Adhesive
(2)
(3) (4)
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be
generated and the package may fracture, etc., depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
c) Be aware that any of the following can cause the package to crack or dust to be generated.
(1) Applying repetitive bending stress to the external leads.
(2) Applying heat to the external leads for an extended period of time with soldering iron.
(3) Rapid cooling or heating.
(4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer.
(5) Applying the metal a crash or a rub against the plastic portion.
Note that the preceding notes should also be observed when removing a component from a board
after it has already been soldered.
d) The notch of the plastic portion is used for directional index, and that can not be used for reference of
fixing. In addition, the cover glass and seal resin may overlap with the notch or ceramic may overlap
with the notch of the plastic portion.
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| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet ILX137K.PDF ] | |
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