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STPS745 데이터시트 PDF




STMicroelectronics에서 제조한 전자 부품 STPS745은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

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부품번호 STPS745 기능
기능 POWER SCHOTTKY RECTIFIER
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STPS745 데이터시트, 핀배열, 회로
www.DataSheet4U.com
Main product characteristics
IF(AV)
VRRM
Tj (max)
VF(max)
7.5 A
45 V
150° C
0.57 V
Features and Benefits
Very small conduction losses
Negligible switching losses
Extremely fast switching
Insulated package: TO-220FPAC
Insulating voltage = 2000 V DC
Capacitance = 12 pF
Avalanche capability specified
Description
Single Schottky rectifier suited for Switch Mode
Power Supply and high frequency DC to DC
converters.
Packaged either in TO-220AC, TO-220FPAC or
D2PAK, this device is intended for use in low
voltage, high frequency inverters, free wheeling
and polarity protection applications.
STPS745
Power Schottky rectifier
A
K
K
A
NC
D2PAK
STPS745G
A
K
TO-220AC
STPS745D
’’‘
A
K
TO-220FPAC
STPS745FP
March 2007
Rev 7
1/9
www.st.com
9




STPS745 pdf, 반도체, 판매, 대치품
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Characteristics
STPS745
Figure 7.
Relative variation of thermal
transient impedance junction to
case versus pulse duration
(TO-220AC and D2PAK)
Zth(j-c)/Rth(j-c)
1.0
Figure 8.
Relative variation of thermal
transient impedance junction to
case versus pulse duration
(TO-220FPAC)
Zth(j-c)/Rth(j-c)
1.0
0.8 0.8
0.6 δ = 0.5
0.4
δ = 0.2
0.2 δ = 0.1
Single pulse
0.0
1E-4
1E-3
tp(s)
1E-2
0.6 δ = 0.5
0.4
δ = 0.2
T δ = 0.1
0.2
δ=tp/T
1E-1
tp
1E+0
Single pulse
0.0
1E-3
1E-2
tp(s)
1E-1
T
δ=tp/T
1E+0
tp
1E+1
Figure 9.
IR(µA)
5E+4
1E+4
1E+3
1E+2
1E+1
1E+0
1E-1
0
5
Reverse leakage current versus
reverse voltage applied (typical
values)
Tj=150°C
Tj=125°C
Tj=100°C
Tj=75°C
Tj=50°C
Tj=25°C
VR(V)
10 15 20 25 30 35 40
Figure 10. Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
1000
F=1MHz
VOSC=30mVRMS
Tj=25°C
500
200
100
45 1
2
VR(V)
5 10
20
50
Figure 11.
Forward voltage drop versus
forward current (maximum values)
Figure 12.
Thermal resistance junction to
ambient versus copper surface
under tab (Epoxy printed circuit
board, copper thickness: 35 µm)
IFM(A)
100.0
Tj=125°C
(typical values)
Rth(j-a)(°C/W)
80
70
10.0
Tj=25°C
60
50
Tj=125°C
40
30
1.0
20
VFM(V)
0.1
10
S(Cu)(cm²)
0
0 2 4 6 8 10 12 14 16 18 20
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
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STPS745 전자부품, 판매, 대치품
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STPS745
Package information
Table 6. TO-220AC dimensions
Dimensions
Ref Millimeters
Inches
H2
ØI
L2
F1
F
L5
L6
L9
L4
G
Min. Max.
A
A
C
L7
C
D
E
F
F1
4.40
1.23
2.40
0.49
0.61
1.14
4.60
1.32
2.72
0.70
0.88
1.70
F2 1.14 1.70
D
M
E
G 4.95 5.15
G1 2.40 2.70
H2 10 10.40
L2 16.4 typ.
L4 13
14
L5 2.65 2.95
L6
L7
L9
M
Diam.
15.25 15.75
6.20 6.60
3.50 3.93
2.6 typ.
3.75 3.85
Min. Max.
0.173 0.181
0.048 0.051
0.094 0.107
0.019 0.027
0.024
0.044
0.034
0.066
0.044 0.066
0.194 0.202
0.094 0.106
0.393 0.409
0.645 typ.
0.511 0.551
0.104 0.116
0.600
0.244
0.620
0.259
0.137 0.154
0.102 typ.
0.147 0.151
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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