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PDF N16D1633LPA Data sheet ( Hoja de datos )

Número de pieza N16D1633LPA
Descripción 512K X 16 Bits X 2 Banks Low Power Synchronous DRAM
Fabricantes NanoAmp Solutions 
Logotipo NanoAmp Solutions Logotipo



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No Preview Available ! N16D1633LPA Hoja de datos, Descripción, Manual

www.DataSheet4U.com
NanoAmp Solutions, Inc.
670 North McCarthy Blvd. Suite 220, Milpitas, CA 95035
ph: 408-935-7777, FAX: 408-935-7770
www.nanoamp.com
N16D1633LPA
Advance Information
512K × 16 Bits × 2 Banks Low Power Synchronous DRAM
DESCRIPTION
These N16D1633LPA are low power 16,777,216 bits CMOS Synchronous DRAM organized as 2 banks of 524,288
words x 16 bits. These products are offering fully synchronous operation and are referenced to a positive edge of the
clock. All inputs and outputs are synchronized with the rising edge of the clock input. The data paths are internally
pipelined to achieve very high bandwidth. All input and output voltage levels are compatible with LVTTL.
Features
• JEDEC standard 3.0V/3.3V power supply.
• Auto refresh and self refresh.
• All pins are compatible with LVTTL interface.
• 4K refresh cycle / 64ms.
• Programmable Burst Length and Burst Type.
- 1, 2, 4, 8 or Full Page for Sequential Burst.
- 4 or 8 for Interleave Burst.
• Programmable CAS Latency : 2,3 clocks.
• Programmable Driver Strength Control.
- Full Strength or 1/2, 1/4 of Full Strength
• Deep Power Down Mode
• All inputs and outputs referenced to the positive
edge of the system clock.
• Data mask function by DQM.
• Internal dual banks operation.
• Burst Read Single Write operation.
• Special Function Support.
-PASR (Partial Array Self Refresh)
-Auto TCSR(Temperature Compensated Self Refresh)
• Automatic precharge, includes CONCURRENT
Auto Precharge Mode and controlled Precharge
Table 1: Ordering Information
PART NO.
N16D1633LPAZ2-75I
N16D1633LPAZ2-10I
N16D1633LPAC2-60I
N16D1633LPAC2-75I
N16D1633LPAC2-10I
N16D1633LPAT2-60I
N16D1633LPAT2-75I
N16D1633LPAT2-10I
CLOCK Freq.
133MHz
100MHz
166MHz
133MHz
100MHz
166MHz
133MHz
100MHz
Temperature
-25o C to
85o C
VDD/VDDQ
3.0V/3.0V
or
3.3V/3.3V
INTERLEAVE
LVTTL
PACKAGE
48-Ball Green
FBGA
60-Ball Green
WBGA
50-Pin Green
TSOP II
Stock No. 23395- Rev L 1/06
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.
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N16D1633LPA pdf
www.DataSheet4U.com
NanoAmp Solutions, Inc.
N16D1633LPA
Advance Information
Table 2: Pin Descriptions
PIN
CLK
CKE
/CS
A11
A0~A10
/RAS, /CAS, /WE
LDQM/UDQM
DQ0~DQ15
VDD/VSS
VDDQ/VSSQ
NC
PIN NAME
System Clock
Clock Enable
Chip Select
Bank Address
Address
Row Address Strobe,
Column Address Strobe,
Write Enable
Data Input/Output Mask
Data Input/Output
Power Supply/Ground
Data Output Power/Ground
No Connection
DESCRIPTIONS
The system clock input. All other inputs are registered to the
SDRAM on the rising edge of the CLK
Controls internal clock signal and when deactivated, the
SDRAM will be one of the states among power down, suspend
or self refresh.
Enable or disable all inputs except CLK, CKE and DQM
Selects bank to be activated during /RAS activity
Selects bank to be read/written during /CAS activity
Row Address : RA0~RA10
Column Address: CA0~CA7
Auto Precharge : A10
/RAS, /CAS and /WE define the operation
Refer function truth table for details
Controls output buffers in read mode and masks input data in
write mode
Multiplexed data input/output pin
Power supply for internal circuits and input buffers
Power Supply for output buffers
No Connection
Stock No. 23395- Rev L 1/06
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.
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N16D1633LPA arduino
www.DataSheet4U.com
NanoAmp Solutions, Inc.
N16D1633LPA
Advance Information
Burst Length
Read and write accesses to the SDRAM are burst oriented, with the burst length being programmable, as shown in
Figure 1. The burst length determines the maximum number of column locations that can be accessed for a given
READ or WRITE command. Burst lengths of 1, 2, 4 or 8 locations are available for both the sequential and the
interleaved burst types, and a full-page burst is available for the sequential type. The full-page burst is used in
conjunction with the BURST TERMINATE command to generate arbitrary burst lengths.
Reserved states should not be used, as unknown operation or incompatibility with future versions may result. When a
READ or WRITE command is issued, a block of columns equal to the burst length is effectively selected. All accesses
for that burst take place within this block, meaning that the burst will wrap within the block if a boundary is reached. The
block is uniquely selected by A1-A7 when the burst length is set to two; by A2-A7 when the burst length is set to four;
and by A3-A7 when the burst length is set to eight. The remaining (least significant) address bit(s) is (are) used to
select the starting location within the block. Full-page bursts wrap within the page if the boundary is reached.
Bank(Row) Active
The Bank Active command is used to activate a row in a specified bank of the device. This command is initiated by
activating /CS, /RAS and deasserting /CAS, /WE at the positive edge of the clock. The value on the A11 selects the
bank, and the value on the A0-A10 selects the row. This row remains active for column access until a precharge
command is issued to that bank. Read and write operations can only be initiated on this activated bank after the
minimum tRCD time is passed from the activate command.
Read
The READ command is used to initiate the burst read of data. This command is initiated by activating /CS, /CAS, and
deasserting /WE, /RAS at the positive edge of the clock. A11 input select the bank, A0-A7 address inputs select the
starting column location. The value on input A10 determines whether or not Auto Precharge is used. If Auto Precharge
is selected the row being accessed will be precharged at the end of the READ burst; if Auto Precharge is not selected,
the row will remain active for subsequent accesses. The length of burst and the CAS latency will be determined by the
values programmed during the MRS command.
Write
The WRITE command is used to initiate the burst write of data. This command is initiated by activating /CS, /CAS, /WE
and deasserting /RAS at the positive edge of the clock. A11 input select the bank, A0-A7 address inputs select the
starting column location. The value on input A10 determines whether or not Auto Precharge is used. If Auto Precharge
is selected the row being accessed will be precharged at the end of the WRITE burst; if Auto Precharge is not selected,
the row will remain active for subsequent accesses.
Stock No. 23395- Rev L 1/06
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.
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