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PDF UCLAMP3324P Data sheet ( Hoja de datos )
| Número de pieza | UCLAMP3324P | |
| Descripción | Low Voltage TVS | |
| Fabricantes | Semtech Corporation | |
| Logotipo |  |
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PROTECTION PRODUCTS - MicroClampTM
Description
The µClampTM series of TVS arrays are designed to
protect sensitive electronics from damage or latch-up
due to ESD, lightning, and other voltage-induced
transient events. Each device will protect up to four
lines operating at 3.3 volts.
The µClampTM3324P is a solid-state device designed
specifically for transient suppression. It is constructed
using Semtech’s proprietary EPD process technology.
The EPD process provides low standoff voltages with
significant reductions in leakage currents and capaci-
tance over traditional pn junction processes. They offer
desirable characteristics for board level protection
including fast response time, low clamping voltage and
no device degradation.
The µClamp3324P may be used to meet the immunity
requirements of IEC 61000-4-2, level 4 (±15kV air,
±8kV contact discharge). The “flow-thru” design of the
device results in enhanced ESD performance due to
reduced board trace inductance. The result is lower
clamping voltage and a higher level of protection when
compared to conventional TVS devices.
The µClamp3324P is in an 8-pin, RoHs compliant,
SLP2116P8 package. It measures 2.1 x 1.6 x
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPd. The small pack-
age makes it ideal for use in portable electronics such
as cell phones, digital still cameras, and notebook
computers.
Circuit Diagram
uClamp3324P
Low Voltage TVS
for ESD Protection
Features
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Small package for use in portable electronics
Protects four I/O
Working voltage: 3.3V
Flow thru design for easy layout
Low leakage current
Low operating and clamping voltages
Solid-state silicon-avalanche technology
Mechanical Characteristics
SLP2116P8 package
RoHs Compliant
Nominal Dimensions: 2.1 x 1.6 x 0.58 mm
Lead Pitch: 0.5mm
Lead Finish: NiPd
Marking : Orientation Mark and Marking Code
Packaging : Tape and Reel per EIA 481
Applications
Cellular Handsets & Accessories
Personal Digital Assistants (PDA’s)
Notebooks & Handhelds
Portable Instrumentation
Digital Cameras
Peripherals
MP3 Players
Package
18 27 3 6 4 5
2.10
12
1.60
0.50 BSC
GND
Device Schematic
Revision 01/05/2005
0.58
8 Pin SLP package (Bottom Side View)
2.1 x 1.6 x 0.58mm (Nominal)
1 www.semtech.com
1 page  
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uClamp3324P
PROTECTION PRODUCTS
Outline Drawing - SLP2116P8
A
PIN 1
INDICATOR
(LASER MARK)
D
aaa C
A2
E1
D1
12
B
E
A SEATING
PLANE
A1 C
LxN E/2
DIMENSIONS
DIM
INCHES
MIN NOM MAX
MILLIMETERS
MIN NOM MAX
A
A1
.0-20
.023
.001
.026
.002
0.50
0.00
0.58
.003
0.65
0.05
A2 (.006)
(0.15)
b .007 .010 .012 0.20 0.25 0.30
D .079 .083 .087 2.00 2.10 2.20
D1 .061 .067 .071 1.55 1.70 1.80
E .059 .063 .067 1.50 1.60 1.70
E1 .010 .016 .020 0.25 0.40 0.50
e .020 BSC
0.50 BSC
L .011 .013 .015 0.28 0.33 0.38
N6
6
aaa .003
0.08
bbb .004
0.10
N
e
bxN
bbb C A B
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP2116P8
P
X
DIMENSIONS
DIM INCHES
MILLIMETERS
ZG
Y
F (C)
B
C
F
G
P
X
Y
Z
.071
.060
.018
.035
.020
.012
.025
.085
1.80
1.52
0.45
0.89
0.50
0.30
0.63
2.15
B
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2005 Semtech Corp.
5
www.semtech.com
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet UCLAMP3324P.PDF ] | |
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