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11577-11 데이터시트 PDF




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11577-11 데이터시트, 핀배열, 회로
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Construction Analysis
Rockwell 11577-11
Digital Correlator
Report Number: SCA 9707-546
al Semiconductor Ind
®
17350 N. Hartford Drive
Scottsdale, AZ 85255
Phone: 602-515-9780
Fax: 602-515-9781
Internet: http://www.ice-corp.com




11577-11 pdf, 반도체, 판매, 대치품
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Assembly:
TECHNOLOGY DESCRIPTION
• Device was encapsulated in a 144-pin plastic Square Quad Flat Package (SQFP).
• Copper (Cu) leadframe was internally plated with silver (Ag).
• External pins were tinned with tin-lead (SnPb) solder.
• Lead-locking provisions (holes) at all pins.
• Thermosonic ball bonding using 1.1 mil O.D. gold wire.
• Pins 139 - 143 were not connected.
• Sawn dicing (full-depth).
• Silver-filled epoxy die attach.
Die Process:
• Fabrication process: Selective oxidation CMOS process employing P-wells in an N-
epi on a P-substrate.
• Final passivation: A layer of nitride over a layer of glass.
• Metallization: Two levels of metal defined by standard dry-etch techniques. Both
consisted of aluminum with a titanium-nitride cap and barrier. Standard vias and
contacts were used (no plugs).
• Interlevel dielectric: Interlevel dielectric consisted of two layers of silicon-dioxide
with a planarizing spin-on-glass (SOG) between them.
-2-

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11577-11 전자부품, 판매, 대치품
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ANALYSIS RESULTS II
Die Process and Design:
Figures 5 - 34
Questionable Items:1
• Metal 2 aluminum thinned up to 100 percent2 at some via locations. Barrier metal
remained intact to provide continuity.
• Metal 1 aluminum thinned up to 100 percent2 at some contact locations. Barrier
metal remained intact to provide continuity.
Special Features:
• Titanium silicided diffusion structures.
General items:
• Fabrication process: Devices were fabricated using selective oxidation CMOS
process employing P-wells in an N-epi on a P-substrate.
• Process implementation: Die layout was clean and efficient. Alignment was good at
all levels. No damage or contamination was found.
• Die coat: No die coat was present.
• Final passivation: A layer of nitride over a layer of glass. Overlay integrity test
indicated defect-free passivation. Edge seal was good as the passivation extended
1These items present possible quality or reliability concerns. They should be discussed
with the manufacturer to determine their possible impact on the intended application.
2Seriousness depends on design margins.
-5-

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11577-11

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