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ML145403 데이터시트 PDF




LANSDALE Semiconductor에서 제조한 전자 부품 ML145403은 전자 산업 및 응용 분야에서
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부품번호 ML145403 기능
기능 (ML145403 - ML145408) Drivers/Receivers
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ML145403 데이터시트, 핀배열, 회로
www.DataSheet4U.com
ML145403 ML145405
ML145404 ML145408
Drivers/Receivers
RS 232/EIA–232–E and CCITT V.28
Legacy Device: Motorola MC145403, MC145404, MC145405, MC145408
These devices are silicon gate CMOS ICs that combine both the
transmitter and receiver to fulfill the electrical specifications of EIA
Standard 232–E and CCITT V.28. The drivers feature true TTL input
compatibility, slew rate limiting outputs, 300 power–off source
impedance, and output typically switching to within 25% of the sup-
ply rails. The receivers can handle up to ± 25 V while presenting 3 to
7 kimpedance. Hysteresis in the receivers aid in the reception of
noisy signals. By combining both drivers and receivers in a single
CMOS chip, these devices provide efficient, low–power solutions for
both EIA–232–E and V.28 applications.
These devices offer the following performance features:
• Operating Temperature Range TA = –40° to +85°C
Drivers
• ± 5 to ± 12 V Supply Range
• 300 Power–Off Source Impedance
• Output Current Limiting
• TTL and CMOS Compatible Inputs
• Driver Slew Rate Range Limited to 30 V/µs Maximum
Receivers
• ± 25 V Input Range
• 3 to 7 kInput Impedance
• 0.8 V of Hysteresis for Enhanced Noise Immunity
• TTL and CMOS Compatible Outputs
Available Driver/Receiver Combinations
Device
Drivers Receivers Figure
ML145403
3
5
1
ML145404
4
4
2
ML145405
5
3
3
ML145408
5
5
4
No. of Pins
20
20
20
24
Alternative EIA–232 devices to consider are:
Three Supply
Single Supply
ML145406 (3 x 3)
ML145407 (3 x 3)
Note: Lansdale lead free (Pb) product, as it
becomes available, will be identified by a part
number prefix change from ML to MLE.
Page 1 of 8
www.lansdale.com
Issue A




ML145403 pdf, 반도체, 판매, 대치품
ML145403, ML145404, ML145405, ML145408
www.DataSheet4U.com
LANSDALE Semiconductor, Inc.
DRIVER ELECTRICAL SPECIFICATIONS
(Voltage Polarities Referenced to GND = 0 V, VDD = + 12 V, VSS = – 12 V, TA = – 40 to + 85°C, VCC = + 5 V, ± 10%)
Characteristic
Symbol
Min
Typ
Max Unit
Digital Input Voltage
Logic 0
Logic 1
Input Current
VDI = GND
VDI = VCC
Output High Voltage
VDI = Logic 0, RL = 3 k
VDD = + 5.0 V, VSS = – 5.0 V
VDD = + 6.0 V, VSS = – 6.0 V
VDD = + 12.0 V, VSS = – 12.0 V
Output Low Voltage*
VDI = Logic 1, RL = 3 k
VDD = + 5.0 V, VSS = – 5.0 V
VDD = + 6.0 V, VSS = – 6.0 V
VDD = + 12.0 V, VSS = – 12.0 V
Input Current
(Figure 5)
DI1 – DIn
DI1 – DIn
Tx1 – Txn
VIL
VIH
IIL
IIH
VOH
Tx1 – Txn
VOL
Tx1 – Txn
Zoff
2
3.5
4.3
9.2
–4
– 4.5
– 10
300
7
3.9
4.7
9.5
– 4.3
– 5.2
– 10.3
0.8
± 1.0
V
µA
V
V
Output Short Circuit Current
VDD = + 12 V, VSS = – 12 V
Tx Shorted to GND**
Tx Shorted to ± 15 V***
Tx1 – Txn
ISC
mA
± 22 ± 60
± 60 ± 100
* Voltage specifications are in terms of absolute values.
** Specification is for one Tx output pin to be shorted at a time. Should all three driver outputs be shorted simultaneously, device power dissipation
limits will be exceeded.
*** This condition could exceed package limitations.
SWITCHING CHARACTERISTICS (VCC = + 5 V, ± 10%, VDD = + 12 V, VSS = – 12 V, TA = – 40 to + 85°C; See Figures 2 and 3)
Characteristic
Symbol
Min
Typ
Max Unit
Drivers
Propagation Delay Time Tx
Low–to–High
RL = 3 k, CL = 50 pF
High–to–Low
RL = 3 k, CL = 50 pF
Output Slew Rate
Minimum Load
RL = 7 k, CL = 0 pF (VDD = 6 to 12 V, VSS = – 6 to – 12 V)
Maximum Load
RL = 3 k, CL = 2500 pF (VDD = 12 V, VSS = – 12 V, VCC = 5 V)
Receivers (CL = 50 pF)
Propagation Delay Time
Low–to–High
tPLH
tPHL
SR
tPLH
4
ns
500 1000
700 1000
V/µs
± 6 ± 30
——
ns
360 610
High–to–Low
Output Rise Time
Output Fall Time
tPHL
tr
tf
130 610
250 400 ns
40 100 ns
Page 4 of 8
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Issue A

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ML145403 전자부품, 판매, 대치품
LANSDALE Semiconductor, Inc.
www.DataSheet4U.com
ML145403, ML145404, ML145405, ML145408
-A-
20
1
-T-
SEATING
PLANE
E
GF
OUTLINE DIMENSIONS
P DIP 20 = RP
(ML145403RP, ML145404RP, ML145405RP)
PLASTIC DIP
CASE 738–03
11
B
10
C
K
N
D 20 PL
0.25 (0.010) M T A M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
L FLASH.
M
J 20 PL
0.25 (0.010) M T B M
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 1.010 1.070 25.66 27.17
B 0.240 0.260 6.10 6.60
C 0.150 0.180 3.81 4.57
D 0.015 0.022 0.39 0.55
E 0.050 BSC
1.27 BSC
F 0.050 0.070 1.27 1.77
G 0.100 BSC
2.54 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.140 2.80 3.55
L 0.300 BSC
7.62 BSC
M 0° 15° 0° 15°
N 0.020 0.040 0.51 1.01
P DIP 24 = LP
(ML145408LP)
PLASTIC DIP
CASE 724–03
–A–
24 13
–B–
1 12
–T–
SEATING
PLANE
E
GF
L
C
K
N
NOTE 1
M
D 24 PL
0.25 (0.010) M T A M
J 24 PL
0.25 (0.010) M T B M
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 1.230 1.265
B 0.250 0.270
C 0.145 0.175
D 0.015 0.020
E 0.050 BSC
F 0.040 0.060
G 0.100 BSC
J 0.007 0.012
K 0.110 0.140
L 0.300 BSC
M 0 15
N 0.020 0.040
MILLIMETERS
MIN MAX
31.25 32.13
6.35 6.85
3.69 4.44
0.38 0.51
1.27 BSC
1.02 1.52
2.54 BSC
0.18 0.30
2.80 3.55
7.62 BSC
0 15
0.51 1.01
Page 7 of 8
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Issue A

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부품번호상세설명 및 기능제조사
ML145403

(ML145403 - ML145408) Drivers/Receivers

LANSDALE Semiconductor
LANSDALE Semiconductor
ML145404

(ML145403 - ML145408) Drivers/Receivers

LANSDALE Semiconductor
LANSDALE Semiconductor

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